Tong Jiang, Ph.D.

Affiliations: 
2012 Mechanical Engineering Hong Kong University of Science and Technology (Hong Kong) 
Area:
Mechanical Engineering
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Shi-Wei R. Lee grad student 2012 Hong Kong University of Science and Technology (Hong Kong)
 (Modeling of Failure Mechanism and Life Prediction of Lead-Free BGA Solder Joint under Repetitive Mechanical Drop Loading.)