Michael D. Glover, Ph.D.
Affiliations: | 2013 | Electrical Engineering | University of Arkansas, Little Rock, AR |
Area:
Electronics and Electrical EngineeringGoogle:
"Michael Glover"Parents
Sign in to add mentorHomer Alan Mantooth | grad student | 2013 | University of Arkansas, Fayetteville | |
(Design, layout, and testing of a silicon carbide-based under voltage lock-out circuit.) |
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Publications
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Seal S, Glover MD, Mantooth HA. (2018) 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices Ieee Transactions On Power Electronics. 33: 8553-8564 |
Zhu N, Mantooth HA, Xu D, et al. (2017) A Solution to Press-Pack Packaging of SiC MOSFETS Ieee Transactions On Industrial Electronics. 64: 8224-8234 |
Seal S, Glover MD, Mantooth HA. (2016) The Design and Evaluation of an Integrated Wire-Bondless Power Module (IWPM) using Low Temperature Co-fired Ceramic Interposer Journal of Microelectronics and Electronic Packaging. 2016: 65-72 |
Croteau P, Seal S, Witherell R, et al. (2015) Test results of sintered nano-silver paste die attach for high temperature applications Imaps International Conference On High Temperature Electronics Network, Hiten 2015. 37-49 |
Decrossas E, Glover MD, Porter K, et al. (2015) High-performance and high-data-rate quasi-coaxial LTCC vertical interconnect transitions for multichip modules and system-on-package applications Ieee Transactions On Components, Packaging and Manufacturing Technology. 5: 307-313 |
Ericson MN, Frank SS, Britton CL, et al. (2014) An integrated gate driver in 4H-SiC for power converter applications 2nd Ieee Workshop On Wide Bandgap Power Devices and Applications, Wipda 2014. 66-69 |
Ericson N, Frank S, Britton C, et al. (2014) A 4H silicon carbide gate buffer for integrated power systems Ieee Transactions On Power Electronics. 29: 539-542 |
Mantooth HA, Glover MD, Shepherd P. (2014) Wide Bandgap Technologies and Their Implications on Miniaturizing Power Electronic Systems Ieee Journal of Emerging and Selected Topics in Power Electronics. 2: 374-385 |
Glover MD, Shepherd P, Francis AM, et al. (2014) A UVLO Circuit in SiC Compatible With Power MOSFET Integration Ieee Journal of Emerging and Selected Topics in Power Electronics. 2: 425-433 |
Yoon SW, Glover MD, Shiozaki K. (2013) Nickel-tin transient liquid phase bonding toward high-temperature operational power electronics in electrified vehicles Ieee Transactions On Power Electronics. 28: 2448-2456 |