Stephan J. Meschter, Ph.D.
Affiliations: | 2001 | State University of New York at Binghamton, Vestal, NY, United States |
Area:
Mechanical Engineering, Metallurgy EngineeringGoogle:
"Stephan Meschter"Parents
Sign in to add mentor| Timothy J. Singler | grad student | 2001 | SUNY Binghamton | |
| (Wetting of low melting point alloys on metal substrates.) | ||||
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Publications
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| Delhaise AM, Snugovsky P, Kennedy J, et al. (2020) Thermal Preconditioning and Restoration of Bismuth-Containing, Lead-Free Solder Alloys Journal of Electronic Materials. 49: 116-127 |
| Dong F, Meschter SJ, Nozaki S, et al. (2019) Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings Polymer Degradation and Stability. 166: 219-229 |
| Dong F, Meschter SJ, Cho J. (2019) Improved adhesion of polyurethane-based coatings to tin surface Journal of Materials Science: Materials in Electronics. 30: 7268-7279 |
| Dong F, Maganty S, Meschter SJ, et al. (2018) Effects of curing conditions on structural evolution and mechanical properties of UV-curable polyurethane acrylate coatings Progress in Organic Coatings. 114: 58-67 |
| Dong F, Maganty S, Meschter SJ, et al. (2017) Electron beam irradiation effect on the mechanical properties of nanosilica-filled polyurethane films Polymer Degradation and Stability. 141: 45-53 |
| Maganty S, Roma MPC, Meschter SJ, et al. (2016) Enhanced mechanical properties of polyurethane composite coatings through nanosilica addition Progress in Organic Coatings. 90: 243-251 |
| Meschter S, Snugovsky P, Bagheri Z, et al. (2014) Whisker Formation on SAC305 Soldered Assemblies Jom. 66: 2320-2333 |
| Han S, Osterman M, Meschter S, et al. (2012) Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation Journal of Electronic Materials. 41: 2508-2518 |
| Snugovsky P, Meschter S, Bagheri Z, et al. (2012) Whisker Formation Induced by Component and Assembly Ionic Contamination Journal of Electronic Materials. 41: 204-223 |
| Yin L, Meschter SJ, Singler TJ. (2004) Wetting in the Au-Sn System Acta Materialia. 52: 2873-2888 |