Michael Liehr
Affiliations: | 2011- | Nanoscale Science and Engineering-Nanoscale Engineering | State University of New York, Albany, Albany, NY, United States |
Area:
Electronics and Electrical Engineering, Electricity and Magnetism PhysicsGoogle:
"Michael Liehr"Bio:
https://www.researchgate.net/profile/Michael-Liehr-3
http://publications.rwth-aachen.de/record/68269?ln=de
BETA: Related publications
See more...
Publications
|
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
| Adamshick S, Northrup S, Liehr M. (2018) Experimental characterisation of coaxial TSV transistor keep out zones Micro & Nano Letters. 13: 1457-1459 |
| Adamshick S, Burke J, Liehr M. (2017) Fabrication method for annular/shielded copper interconnects Micro & Nano Letters. 12: 301-303 |
| Liehr M. (2016) Merging photonics with nanoelectronics (Conference Presentation) Proceedings of Spie. 9750: 975002 |
| Koch TL, Liehr M, Coolbaugh D, et al. (2016) The American Institute for Manufacturing Integrated Photonics: Advancing the ecosystem Proceedings of Spie - the International Society For Optical Engineering. 9772 |
| Montgomery W, Chun JS, Liehr M, et al. (2015) The Patterning Center of Excellence (CoE): An evolving lithographic enablement model Proceedings of Spie - the International Society For Optical Engineering. 9422 |
| Adamshick S, Coolbaugh D, Liehr M. (2015) Experimental characterization of coaxial through silicon vias for 3D integration Microelectronics Journal. 46: 377-382 |
| Adamshick S, Carroll R, Rao M, et al. (2014) High frequency electrical characterization of 3D signal/ground through silicon vias Progress in Electromagnetics Research Letters. 47: 71-75 |
| Adamshick S, Coolbaugh D, Liehr M. (2013) Feasibility of coaxial through silicon via 3D integration Electronics Letters. 49: 1028-1030 |
| Montgomery W, Rice B, Brilla R, et al. (2011) Enabling EUV materials introduction: An evolutionary process Journal of Photopolymer Science and Technology. 24: 193-198 |