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Melida Chin, Ph.D.

Affiliations: 
2005 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
Mechanical Engineering
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"Melida Chin"
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Shixin J. Hu grad student 2005 University of Michigan
 (Electrical contact resistance of anisotropic conductive adhesive assemblies in microelectronics packaging.)

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Publications

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Yue J, Camelio JA, Chin M, et al. (2007) Product-Oriented Sensitivity Analysis for Multistation Compliant Assemblies Journal of Mechanical Design. 129: 844-851
Chin M, Hu SJ. (2007) A multiple particle model for the prediction of electrical contact resistance in anisotropic conductive adhesive assemblies Ieee Transactions On Components and Packaging Technologies. 30: 745-753
Chin M, Hu SJ, Barber JR. (2005) Design guidelines for anisotropic conductive adhesive assemblies in microelectronics packaging American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. 5: 371-374
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