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Shubhra Bansal, Ph.D.

Affiliations: 
2006 Georgia Institute of Technology, Atlanta, GA 
Area:
Materials Science Engineering, Mechanical Engineering
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"Shubhra Bansal"
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Rao R Tummala grad student 2006 Georgia Tech
 (Characterization of nanostructured metals and metal nanowires for chip -to -package interconnections.)

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Publications

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Bansal S, Saxena AM, Hartwig T, et al. (2005) Mechanical Properties of ECAE Nanocrystalline Copper and Nickel Journal of Metastable and Nanocrystalline Materials. 23: 183-186
Shinotani K-, Raj PM, Seo M, et al. (2004) Evaluation of alternative materials for system-on-package (SOP) substrates Ieee Transactions On Components and Packaging Technologies. 27: 694-701
Tummala RR, Raj PM, Atmur S, et al. (2004) Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging Journal of Electroceramics. 13: 417-422
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