Venkatesh Sundaram, Ph.D.
Affiliations: | 2009 | Georgia Institute of Technology, Atlanta, GA |
Area:
Materials Science EngineeringGoogle:
"Venkatesh Sundaram"Parents
Sign in to add mentorRao R Tummala | grad student | 2009 | Georgia Tech | |
(Advances in electronic packaging technologies by ultra-small microvias, super-fine interconnections and low loss polymer dielectrics.) |
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Publications
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Ali M, Liu F, Watanabe A, et al. (2018) First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications Ieee Microwave and Wireless Components Letters. 28: 1110-1112 |
Demir K, Sukumaran V, Sato Y, et al. (2018) Reliability of fine-pitch through-vias in glass interposers and packages for high-bandwidth computing and communications Journal of Materials Science: Materials in Electronics. 29: 12669-12680 |
McCann S, Singh B, Smet V, et al. (2016) Process Innovations to Prevent Glass Substrate Fracture From RDL Stress and Singulation Defects Ieee Transactions On Device and Materials Reliability. 16: 622-630 |
McCann S, Sato Y, Sundaram V, et al. (2016) Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates Ieee Transactions On Device and Materials Reliability. 16: 43-49 |
Chen Q, Liu X, Sundaram V, et al. (2014) Double-Side Process and Reliability of Through-Silicon Vias for Passive Interposer Applications Ieee Transactions On Device and Materials Reliability. 14: 1041-1048 |
Liu X, Chen Q, Sundaram V, et al. (2013) Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test Microelectronics Reliability. 53: 70-78 |
Liu F, Lu J, Sundaram V, et al. (2002) Reliability assessment of microvias in HDI printed circuit boards Ieee Transactions On Components and Packaging Technologies. 25: 254-259 |