Katayun Barmak

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Barmak K, Ezzat S, Gusley R, et al. (2020) Epitaxial metals for interconnects beyond Cu Journal of Vacuum Science & Technology A. 38: 033406
Gusley R, Sentosun K, Ezzat S, et al. (2019) Electrodeposition of Epitaxial Co on Ru(0001)/Al2O3(0001) Journal of the Electrochemical Society. 166: D875-D881
Ezzat SS, Mani PD, Khaniya A, et al. (2019) Resistivity and surface scattering of (0001) single crystal ruthenium thin films Journal of Vacuum Science & Technology A. 37: 031516
Milosevic E, Kerdsongpanya S, McGahay ME, et al. (2019) Resistivity scaling and electron surface scattering in epitaxial Co(0001) layers Journal of Applied Physics. 125: 245105
Boissonière GML, Choksi R, Barmak K, et al. (2019) Statistics of grain growth: Experiment versus the phase-field-crystal and Mullins models Materialia. 6: 100280
Milosevic E, Kerdsongpanya S, Zangiabadi A, et al. (2018) Resistivity size effect in epitaxial Ru(0001) layers Journal of Applied Physics. 124: 165105
Barmak K, Liu J. (2017) Impact of deposition rate, underlayers, and substrates on β-tungsten formation in sputter deposited films Journal of Vacuum Science and Technology. 35: 61516
Ratanaphan S, Boonkird T, Sarochawikasit R, et al. (2017) Atomistic simulations of grain boundary energies in tungsten Materials Letters. 186: 116-118
Choi D, Barmak K. (2017) On the potential of tungsten as next-generation semiconductor interconnects Electronic Materials Letters. 13: 449-456
Rohrer GS, Liu X, Liu J, et al. (2017) The grain boundary character distribution of highly twinned nanocrystalline thin film aluminum compared to bulk microcrystalline aluminum Journal of Materials Science. 52: 9819-9833