Nicole E. Lay, Ph.D.
Affiliations: | 2006 | Rensselaer Polytechnic Institute, Troy, NY, United States |
Area:
Materials Science EngineeringGoogle:
"Nicole Lay"Parents
Sign in to add mentorDavid J. Duquette | grad student | 2006 | RPI | |
(Seedless electrochemical deposition of copper on air-exposed tantalum nitride barriers with ultra-thin adhesion layers.) |