Che-Yu Li

Affiliations: 
Materials Science and Engineering Cornell University, Ithaca, NY, United States 
Area:
Materials Science Engineering, Mechanical Engineering, Electronics and Electrical Engineering
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"Che-Yu Li"
Bio:

https://books.google.com/books?id=t0xUAAAAYAAJ

Parents

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Peter Harriott grad student 1960 Cornell (Chemistry Tree)
 (Turbulent mass transfer at a solid-liquid boundary inside a pipe.)
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Publications

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Su P, Zhou C, Rzepka S, et al. (1998) The Reliability Assessment of Flip Chip Type Solder Joints Based on the Damage Integral Approach Mrs Proceedings. 516: 357
Korhonen MA, Bergesen P, Li C. (1991) Mechanisms of Inelastic Deformation and Stress Relaxation in Thin Metallizations Bonded to Hard Substrates Mrs Proceedings. 226: 391
Korhonen MA, Wilson H, Kuo RC, et al. (1991) Superplastic-like deformation in some solid solution alloys Materials Science and Engineering A. 137: 27-33
Subrahmanyan R, Stone D, Li C. (1987) Deformation Behavior of Leadless 60% Pb–40% Sn Solder Joints Mrs Proceedings. 108
Stone D, Wilson H, Kuo RC, et al. (1987) A comparison of load relaxation, tensile, and creep data of AlMg alloys in the range of alloy-class creep behavior Scripta Metallurgica. 21: 1559-1563
Stone D, Wilson H, Subrahmanyan R, et al. (1986) Deformation Properties of a Lead-Tin (95–5) Solder Mrs Proceedings. 72
Stone DS, Homa TR, Li C. (1984) Kinetics of Cavity Growth In Solder Joints During Thermal Cycle Mrs Proceedings. 40: 117
Nir N, Huang FH, Hart EW, et al. (1977) Relationship between anelastic and nonlinear viscoplastic behavior of 316 stainless steel at low homologous temperature Metallurgical Transactions A. 8: 583-588
Huang FH, Ellis FV, Li CY. (1977) Comparison of load relaxation data of type 316 austenitic stainless steel with Hart's deformation model Metallurgical Transactions A. 8: 699-704
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