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Jason W. Weigold, Ph.D.

Affiliations: 
2000 University of Michigan, Ann Arbor, Ann Arbor, MI 
Area:
Electronics and Electrical Engineering, Mechanical Engineering
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Stella W. Pang grad student 2000 University of Michigan
 (Dry etching of high aspect ratio silicon microstructures in high density plasma sources for microelectromechanical systems.)

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Publications

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Weigold J, Najafi K, Pang S. (2001) Design and fabrication of submicrometer, single crystal Si accelerometer Journal of Microelectromechanical Systems. 10: 518-524
Tian W-, Weigold JW, Pang SW. (2000) Comparison of Cl[sub 2] and F-based dry etching for high aspect ratio Si microstructures etched with an inductively coupled plasma source Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 18: 1890
Weigold JW, Juan WH, Pang SW, et al. (1999) Characterization of bending in single crystal Si beams and resonators Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 17: 1336
Weigold J, Wong A, Nguyen C, et al. (1999) A merged process for thick single-crystal Si resonators and BiCMOS circuitry Journal of Microelectromechanical Systems. 8: 221-228
Weigold JW, Juan WH, Pang SW. (1998) Dry Etching of Deep Si Trenches for Released Resonators in a Cl2 Plasma Journal of the Electrochemical Society. 145: 1767-1771
Weigold JW, Pang SW. (1998) High-aspect-ratio single-crystal Si microelectromechanical systems Proceedings of Spie. 3511: 242-251
Weigold J, Pang S. (1998) Fabrication of thick Si resonators with a frontside-release etch-diffusion process Journal of Microelectromechanical Systems. 7: 201-206
Weigold JW, Juan WH, Pang SW, et al. (1997) Optical interferometric characterization of membrane curvature in boron doped Si microstructures Proceedings of Spie - the International Society For Optical Engineering. 3223: 142-148
Weigold JW. (1997) Etching and boron diffusion of high aspect ratio Si trenches for released resonators Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures. 15: 267
Weigold JW, Pang SW. (1997) A new frontside-release etch-diffusion process for the fabrication of thick Si microstructures Sensors. 2: 1435-1438
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