I Charles Ume
Affiliations: | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Packaging EngineeringGoogle:
"I Ume"Children
Sign in to add traineeHai Ding | grad student | 2003 | Georgia Tech |
Bao Mi | grad student | 2003 | Georgia Tech |
Dathan S. Erdahl | grad student | 2005 | Georgia Tech |
Reinhard E. Powell | grad student | 2006 | Georgia Tech |
Tsun-Yen Wu | grad student | 2011 | Georgia Tech |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Kang S, Ume IC. (2018) Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards The International Journal of Advanced Manufacturing Technology. 96: 3235-3249 |
Yang L, Ume IC. (2017) Measurement of weld penetration depths in thin structures using transmission coefficients of laser-generated Lamb waves and neural network. Ultrasonics. 78: 96-109 |
Yang L, Ume IC. (2015) Inspection of notch depths in thin structures using transmission coefficients of laser-generated Lamb waves. Ultrasonics. 63: 168-73 |
Yang L, Gong J, Ume IC. (2015) Fundamental Study of Microelectronic Chips’ Response Under Laser Excitation and Signal Processing Methods Journal of Nondestructive Evaluation. 34 |
Kang S, Ume IC. (2014) Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions during Warpage Measurement of Unpainted PWB Assembly Journal of Microelectronics and Electronic Packaging. 2014: 574-579 |
Kang S, Ume IC. (2014) Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods Journal of Electronic Packaging. 136: 31007 |
Kang S, Ume IC. (2013) Techniques for Measuring Warpage of Chip Packages, PWBs, and PWB Assemblies Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1533-1544 |
Gong J, Ume IC. (2013) Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1301-1309 |
Wu T, Ume IC. (2012) Prediction and experimental validation of penetration depth of butt welds in thin plates using superimposed laser sources Ndt & E International. 50: 10-19 |
Wu T, Ume IC. (2011) Fundamental study of laser generation of narrowband Lamb waves using superimposed line sources technique Ndt & E International. 44: 315-323 |