Xingjia Huang, Ph.D.
Affiliations: | 2003 | Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong |
Area:
Packaging Engineering, Materials Science Engineering, Mechanical EngineeringGoogle:
"Xingjia Huang"Parents
Sign in to add mentor| Shi-Wei R. Lee | grad student | 2003 | HKUST | |
| (Investigation and analysis on the solder ball shear strength of plastic ball grid array, chip scale, and flip chip packages with eutectic lead-tin and lead-free solders.) | ||||