Reinhard E. Powell, Ph.D.
Affiliations: | 2006 | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Reinhard Powell"Parents
Sign in to add mentor| I Charles Ume | grad student | 2006 | Georgia Tech | |
| (Development of convective solder reflow and projection moire system and FEA model for PWBA warpage prediction.) | ||||
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Publications
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| Powell RE, Ume IC. (2009) A novel projection moiré system for measuring PWBA warpage using simulated optimized convective reflow process Journal of Electronic Packaging, Transactions of the Asme. 131: 0210061-0210066 |
| Powell RE, Ume IC. (2007) Simultaneous measurement of PWB and chip package warpage using automatic image segmentation Ieee Transactions On Components and Packaging Technologies. 30: 500-508 |
| Ding H, Ume IC, Powell RE, et al. (2005) Parametric study of warpage in printed wiring board assemblies Ieee Transactions On Components and Packaging Technologies. 28: 517-524 |
| Ding H, Powell RE, Hanna CR, et al. (2002) Warpage measurement comparison using shadow moiré and projection moiré methods Ieee Transactions On Components and Packaging Technologies. 25: 714-721 |