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Chunho Kim, Ph.D.

Affiliations: 
2003 Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Industrial Engineering, Electronics and Electrical Engineering
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Daniel F. Baldwin grad student 2003 Georgia Tech
 (Fundamentals of area array solder interconnect yield.)

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Publications

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Kim C, Kang SC, Baldwin DF. (2008) Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials Journal of Applied Physics. 104: 033537
Kang SC, Kim C, Muncy J, et al. (2005) Experimental wetting dynamics study of eutectic and lead-free solders with various fluxes, isothermal conditions, and bond pad metallizations Ieee Transactions On Advanced Packaging. 28: 465-474
Ok SJ, Kim C, Baldwin DF. (2003) High density, high aspect ratio through-wafer electrical interconnect vias for MEMS packaging Ieee Transactions On Advanced Packaging. 26: 302-309
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