Xiaoning Ye, Ph.D.
Affiliations: | 2000 | University of Missouri-Rolla, Rolla, MO, United States |
Area:
Electronics and Electrical EngineeringGoogle:
"Xiaoning Ye"Parents
Sign in to add mentorJames L. Drewniak | grad student | 2000 | University of Missouri-Rolla | |
(Advances and applications of the finite difference time domain (FDTD) method and scattering parameter measurement techniques for electromagnetic compatibility in high speed digital design.) |
BETA: Related publications
See more...
Publications
You can help our author matching system! If you notice any publications incorrectly attributed to this author, please sign in and mark matches as correct or incorrect. |
Chen B, He J, Guo Y, et al. (2019) Multi-Ports ( [$2^{n}$ ) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization Ieee Transactions On Electromagnetic Compatibility. 61: 1261-1270 |
Chen Y, Deng H, Chen B, et al. (2018) Signal-signal D-probe and unified launch pad designs Ieee Electromagnetic Compatibility Magazine. 7: 101-106 |
Jin S, Chen B, Fang X, et al. (2017) Improved “Root-Omega” Method for Transmission-Line-Based Material Property Extraction for Multilayer PCBs Ieee Transactions On Electromagnetic Compatibility. 59: 1356-1367 |
Chu Y, Xiao K, Ho Y, et al. (2017) SNEM: Full S-Parameter Synthesis From Near-End Measurement Ieee Transactions On Electromagnetic Compatibility. 59: 1302-1311 |
Ye L, Li C, Sun X, et al. (2017) Thru-Reflect-Line Calibration Technique: Error Analysis for Characteristic Impedance Variations in the Line Standards Ieee Transactions On Electromagnetic Compatibility. 59: 779-788 |
Huang S, Lee B, Wu B, et al. (2017) Absorbing Termination for High-Frequency Measurements of Interconnects Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 1173-1184 |
Huang S, Ye X, Kang N, et al. (2016) Suppression of couplings in high-speed interconnects using absorbing materials Ieee Transactions On Electromagnetic Compatibility. 58: 1432-1439 |
Huang S, Xiao K, Lee B, et al. (2016) Stub Effect Mitigations Using Absorbing Materials Ieee Transactions On Components, Packaging and Manufacturing Technology. 6: 1233-1244 |
Fan J, Ye X, Kim J, et al. (2010) Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions Ieee Transactions On Electromagnetic Compatibility. 52: 392-400 |
Ye X, Drewniak JL. (2002) FDTD modeling incorporating a two-port network for I/O line EMI filtering design Ieee Transactions On Electromagnetic Compatibility. 44: 175-181 |