Ifeanyi C. Ume
Affiliations: | Georgia Institute of Technology, Atlanta, GA |
Area:
Mechanical Engineering, Electronics and Electrical EngineeringGoogle:
"Ifeanyi Ume"
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Publications
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| Reddy VVB, Ume IC, Mebane A, et al. (2019) Evaluation of FCBGA Package Subjected to Four-Point Bend Reliability Test Using Fiber Array Laser Ultrasonic Inspection System Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1219-1226 |
| Mebane AM, Reddy VVB, Ume IC, et al. (2019) Feasibility Studies and Advantages of Using Dual Fiber Array in Laser Ultrasonic Inspection of Electronic Chip Packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1284-1290 |
| Ume IC, Gong J. (2013) Evaluation of Lead-Free Solder Bump Voiding Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1310-1320 |
| Tan W, Ume IC. (2012) Application of Lamination Theory to Study Warpage Across PWB and PWBA During Convective Reflow Process Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 217-223 |
| Yang J, Ume IC, Zhang L. (2010) Defect detection of flip chip solder bumps with wavelet analysis of laser ultrasound signals Ieee Transactions On Advanced Packaging. 33: 19-29 |
| Zhang L, Ume IC, Gamalski J, et al. (2009) Study of Flip Chip Solder Joint Cracks Under Temperature Cycling Using a Laser Ultrasound Inspection System Ieee Transactions On Components and Packaging Technologies. 32: 120-126 |
| Yang J, Ume IC. (2009) Thermomechanical reliability study of flip chip solder bumps: Using laser ultrasound technique and finite element method Ieee Transactions On Advanced Packaging. 32: 729-739 |
| Tan W, Ume IC. (2008) Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm Ieee Transactions On Advanced Packaging. 31: 447-453 |
| Zhang L, Ume IC, Gamalski J, et al. (2006) Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals Ieee Transactions On Components and Packaging Technologies. 29: 13-19 |
| Ding H, Ume IC, Powell RE, et al. (2005) Parametric study of warpage in printed wiring board assemblies Ieee Transactions On Components and Packaging Technologies. 28: 517-524 |