Dhananjay R. Panchagade, Ph.D.
Affiliations: | 2007 | Auburn University, Auburn, AL, United States |
Area:
Mechanical EngineeringGoogle:
"Dhananjay Panchagade"Parents
Sign in to add mentor| Pradeep Lall | grad student | 2007 | Auburn University | |
| (Damage prediction of lead free ball grid array packages under shock and drop environment.) | ||||
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Publications
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| Gholap S, Pande S, Panchagade DR. (2016) Finite Element Analysis of Stacked U-Tube Heat Exchanger International Journal of Engineering Trends and Technology. 39: 160-167 |
| Kempe MD, Panchagade D, Reese MO, et al. (2015) Modeling moisture ingress through polyisobutylene-based edge-seals Progress in Photovoltaics: Research and Applications. 23: 570-581 |
| Lall P, Iyengar D, Shantaram S, et al. (2009) Damage progression using speckle-correlation and high-speed imaging for survivability of leadfree packaging under shock Strain. 45: 267-282 |
| Lall P, Panchagade DR, Iyengar D, et al. (2009) High speed digital image correlation for transient-shock reliability of electronics Ieee Transactions On Components and Packaging Technologies. 32: 378-395 |
| Lall P, Panchagade DR, Choudhary P, et al. (2008) Failure-Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging Ieee Transactions On Components and Packaging Technologies. 31: 104-113 |
| Lall P, Panchagade D, Liu Y, et al. (2007) Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages Journal of Electronic Packaging. 129: 373-381 |
| Lall P, Panchagade DR, Liu Y, et al. (2006) Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact Ieee Transactions On Components and Packaging Technologies. 29: 464-474 |