Rongwei Zhang, Ph.D.
Affiliations: | 2011 | Georgia Institute of Technology, Atlanta, GA |
Area:
Packaging Engineering, Nanotechnology, Plastics TechnologyGoogle:
"Rongwei Zhang"Parents
Sign in to add mentor| Ching-Ping Wong | grad student | 2011 | Georgia Tech | |
| (Novel conductive adhesives for electronic packaging applications: A way towards economical, highly conductive, low temperature and flexible interconnects.) | ||||
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Publications
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| Li Z, Zhang R, Moon K, et al. (2012) Highly Conductive, Flexible, Polyurethane-Based Adhesives for Flexible and Printed Electronics Advanced Functional Materials. 23: 1459-1465 |
| Zhang R, Lin W, Moon K, et al. (2011) Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 25-32 |
| Zhang R, Moon K, Lin W, et al. (2011) A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications Composites Science and Technology. 71: 528-534 |
| Yang C, Lin W, Li Z, et al. (2011) Water-Based Isotropically Conductive Adhesives: Towards Green and Low-Cost Flexible Electronics Advanced Functional Materials. 21: 4582-4588 |
| Lin W, Zhang RW, Jang SS, et al. (2010) "Organic aqua regia"--powerful liquids for dissolving noble metals. Angewandte Chemie (International Ed. in English). 49: 7929-32 |
| Zhang R, Lin W, Moon KS, et al. (2010) Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles. Acs Applied Materials & Interfaces. 2: 2637-45 |
| Zhang R, Moon K, Lin W, et al. (2010) Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction Ieee Transactions On Advanced Packaging. 33: 892-898 |
| Lin W, Zhang R, Moon K, et al. (2010) Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management Ieee Transactions On Advanced Packaging. 33: 370-376 |
| Zhang R, Moon K, Lin W, et al. (2010) Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles Journal of Materials Chemistry. 20: 2018 |
| Zhang R, Lin W, Lawrence K, et al. (2010) Highly reliable, low cost, isotropically conductive adhesives filled with Ag-coated Cu flakes for electronic packaging applications International Journal of Adhesion and Adhesives. 30: 403-407 |