Shuji Tanaka

Affiliations: 
Tohoku University, Sendai-shi, Miyagi-ken, Japan 
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"Shuji Tanaka"
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Publications

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Qi X, Yoshida S, Tanaka S. (2020) Development of Sputter Epitaxy Technique of Pure-Perovskite (001)(100)-Oriented Sm-doped Pb(Mg1/3, Nb2/3)O3-PbTiO3 on Si. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control
Froemel J, Akita S, Tanaka S. (2020) Simple Device to Measure Pressure Using the Stress Impedance Effect of Amorphous Soft Magnetic Thin Film. Micromachines. 11
Esashi M, Tanaka S, Aoyagi S, et al. (2020) Special Issue on MEMS for Robotics and Mechatronics Journal of Robotics and Mechatronics. 32: 279-280
Ebihara R, Yoshida S, Tanaka S. (2020) Fabrication of c-Axis-Oriented PZT-Based Monocrystalline Thin Film with High Insulation Property on Si Substrate Ieej Transactions On Sensors and Micromachines. 140: 137-143
Vergara A, Tsukamoto T, Fang W, et al. (2020) Integration of buried piezoresistive sensors and PZT thin film for dynamic and static position sensing of MEMS actuator Journal of Micromechanics and Microengineering
Liu Z, Yoshida S, Horie T, et al. (2020) Feasibility study of ultrasonic biometrics based on finger vessel imaging by epitaxial-PZT/Si piezoelectric micromachined ultrasonic transducer Sensors and Actuators a: Physical. 312: 112145
Khan MJ, Tsukamoto T, Farisi MSA, et al. (2020) Fabrication method of micromachined quartz glass resonator using sacrificial supporting structures Sensors and Actuators a-Physical. 305: 111922
Iguchi F, Kubota K, Inagaki Y, et al. (2019) Low Temperature Operating Micro Solid Oxide Fuel Cells with Perovskite Type Proton Conductors Ecs Transactions. 35: 777-783
Baranov P, Nesterenko T, Barbin E, et al. (2019) A novel multiple-axis MEMS gyroscope-accelerometer with decoupling frames Sensor Review. 39: 670-681
Liu C, Froemel J, Chen J, et al. (2019) Laterally vibrating MEMS resonant vacuum sensor based on cavity-SOI process for evaluation of wide range of sealed cavity pressure Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems. 25: 487-497
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