William Nelson Gill
Affiliations: | 1960-1965 | Chemical Engineering & Metallurgy | Syracuse University, Syracuse, NY, United States |
| 1965-1971 | Chemical Engineering | Clarkson University, Potsdam, NY, United States | |
| 1971-1987 | Chemical Engineering | State University of New York, Buffalo, Buffalo, NY, United States | |
| 1980-1982 | Iowa State University, Ames, IA, United States | ||
| 1987- | Chemical Engineering | Rensselaer Polytechnic Institute, Troy, NY, United States |
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| Borja J, Plawsky JL, Lu TM, et al. (2014) Correlation between plasma damage and dielectric reliability for ultra-porous low-k materials Ecs Journal of Solid State Science and Technology. 3: N59-N61 |
| Borja J, Plawsky JL, Lu TM, et al. (2014) Current leakage relaxation and charge trapping in ultra-porous low- k materials Journal of Applied Physics. 115 |
| Borja J, Plawsky JL, Gill WN, et al. (2013) Penetration of copper-manganese self-forming barrier into SiO2 pore-sealed SiCOH during deposition Ecs Journal of Solid State Science and Technology. 2 |
| Borja J, Plawsky JL, Lu TM, et al. (2013) On the dynamics of Cu ions injection into low-k nanoporous materials under oscillating applied fields Journal of Applied Physics. 113 |
| Plawsky JL, Gill WN, Achanta RS. (2012) Impact of interfacial solubility on penetration of metals into dielectrics and the mechanism of failure Journal of Materials Science: Materials in Electronics. 23: 48-55 |
| Plawsky JL, Gill WN, Achanta RS. (2010) Modeling time-dependent dielectric breakdown with and without barriers Journal of Micro/Nanolithography, Mems, and Moems. 9 |
| Achanta RS, Gill WN, Plawsky JL. (2009) Predicting the lifetime of copper/barrier/dielectric systems: Insights for designing better barriers for reducing copper ion drift/diffusion into the dielectric Journal of Applied Physics. 106 |
| Achanta RS, Plawsky JL, Gill WN, et al. (2009) The effect of metallic barriers in inhibiting copper ion transport in low-k dielectrics: Implications for time-to-failure Thin Solid Films. 517: 5630-5633 |
| Achanta RS, Plawsky JL, Gill WN. (2008) Copper ion transport induced dielectric failure: Inclusion of elastic drift and consequences for reliability Journal of Vacuum Science and Technology a: Vacuum, Surfaces and Films. 26: 1497-1500 |
| Achanta RS, Gill WN, Plawsky JL. (2008) Copper ion drift in integrated circuits: Effect of boundary conditions on reliability and breakdown of low- k dielectrics Journal of Applied Physics. 103 |