Joydeep Mitra
Affiliations: | 2019 | University of Texas at Austin, Austin, Texas, U.S.A. |
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"Joydeep Mitra"
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| Torres JA, Fenger G, Khaira D, et al. (2017) Overview and development of EDA tools for integration of DSA into patterning solutions Proceedings of Spie. 10144 |
| Ma Y, Kye J, Khaira GS, et al. (2017) Design technology co-optimization (DTCO) study on self-aligned-via (SAV) with Lamella DSA for sub-7 nm technology Proceedings of Spie. 10148 |
| Mitra J, Torres A, Ma Y, et al. (2017) Model-based guiding pattern synthesis for on-target and robust assembly of via and contact layers using DSA Proceedings of Spie. 10144: 1014414 |
| Mitra J, Torres A, Pan DZ. (2017) Process, design rule, and layout co-optimization for DSA based patterning of sub-10nm Finfet devices Proceedings of Spie. 10144 |
| Ma Y, Wang Y, Word J, et al. (2016) Directed Self Assembly (DSA) compliant flow with immersion lithography: From material to design and patterning Proceedings of Spie - the International Society For Optical Engineering. 9777 |
| Ma Y, Wang Y, Word J, et al. (2016) Directed self-assembly compliant flow with immersion lithography: From material to design and patterning Journal of Micro/ Nanolithography, Mems, and Moems. 15 |
| Badr Y, Torres JA, Ma Y, et al. (2015) Incorporating DSA in multipatterning semiconductor manufacturing technologies Proceedings of Spie - the International Society For Optical Engineering. 9427 |
| Jung M, Mitra J, Pan DZ, et al. (2014) TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC Communications of the Acm. 57: 107-115 |
| Jung M, Mitra J, Pan DZ, et al. (2012) TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 31: 1194-1207 |