King-ning Tu - Publications

Electrical Engineering University of California, Los Angeles, Los Angeles, CA 
3D IC packaging and joule heating, metal-silicon interfaces, electromigration, pb-free solder joints

15 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Chang YW, Cheng Y, Helfen L, Xu F, Tian T, Scheel M, Di Michiel M, Chen C, Tu KN, Baumbach T. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Scientific Reports. 7: 17950. PMID 29263329 DOI: 10.1038/s41598-017-06250-8  0.52
2016 Zhang H, Tersoff J, Xu S, Chen H, Zhang Q, Zhang K, Yang Y, Lee CS, Tu KN, Li J, Lu Y. Approaching the ideal elastic strain limit in silicon nanowires. Science Advances. 2: e1501382. PMID 27540586 DOI: 10.1126/sciadv.1501382  0.84
2016 Chen HP, Huang CW, Wang CW, Wu WW, Liao CN, Chen LJ, Tu KN. Optimization of the nanotwin-induced zigzag surface of copper by electromigration. Nanoscale. PMID 26787289 DOI: 10.1039/c5nr05418d  0.6
2015 Chou YC, Tang W, Chiou CJ, Chen K, Minor AM, Tu KN. Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions. Nano Letters. 15: 4121-8. PMID 25965773 DOI: 10.1021/acs.nanolett.5b01234  0.52
2015 Liu CM, Lin HW, Huang YS, Chu YC, Chen C, Lyu DR, Chen KN, Tu KN. Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu. Scientific Reports. 5: 9734. PMID 25962757 DOI: 10.1038/srep09734  0.6
2014 Song TB, Chen Y, Chung CH, Yang YM, Bob B, Duan HS, Li G, Tu KN, Huang Y, Yang Y. Nanoscale Joule heating and electromigration enhanced ripening of silver nanowire contacts. Acs Nano. 8: 2804-11. PMID 24517263 DOI: 10.1021/nn4065567  0.6
2011 Zhang X, Xu C, Chong K, Tu KN, Xie YH. Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated Circuits. Materials (Basel, Switzerland). 4: 952-962. PMID 28879960 DOI: 10.3390/ma4060952  0.36
2011 Lu KC, Wu WW, Ouyang H, Lin YC, Huang Y, Wang CW, Wu ZW, Huang CW, Chen LJ, Tu KN. The influence of surface oxide on the growth of metal/semiconductor nanowires. Nano Letters. 11: 2753-8. PMID 21657260 DOI: 10.1021/nl201037m  0.6
2010 Wu WW, Lu KC, Wang CW, Hsieh HY, Chen SY, Chou YC, Yu SY, Chen LJ, Tu KN. Growth of multiple metal/semiconductor nanoheterostructures through point and line contact reactions. Nano Letters. 10: 3984-9. PMID 20809607 DOI: 10.1021/nl101842w  0.52
2009 Chou YC, Wu WW, Chen LJ, Tu KN. Homogeneous nucleation of epitaxial CoSi2 and NiSi in Si nanowires. Nano Letters. 9: 2337-42. PMID 19453125 DOI: 10.1021/nl900779j  0.52
2008 Wang DH, Xu D, Wang Q, Hao YJ, Jin GQ, Guo XY, Tu KN. Periodically twinned SiC nanowires. Nanotechnology. 19: 215602. PMID 21730575 DOI: 10.1088/0957-4484/19/21/215602  0.36
2008 Chou YC, Wu WW, Cheng SL, Yoo BY, Myung N, Chen LJ, Tu KN. In-situ TEM observation of repeating events of nucleation in epitaxial growth of nano CoSi2 in nanowires of Si. Nano Letters. 8: 2194-9. PMID 18616326 DOI: 10.1021/nl080624j  0.52
2008 Lin YC, Lu KC, Wu WW, Bai J, Chen LJ, Tu KN, Huang Y. Single crystalline PtSi nanowires, PtSi/Si/PtSi nanowire heterostructures, and nanodevices. Nano Letters. 8: 913-8. PMID 18266331 DOI: 10.1021/nl073279r  0.6
2007 Lu KC, Wu WW, Wu HW, Tanner CM, Chang JP, Chen LJ, Tu KN. In situ control of atomic-scale Si layer with huge strain in the nanoheterostructure NiSi/Si/NiSi through point contact reaction. Nano Letters. 7: 2389-94. PMID 17604405 DOI: 10.1021/nl071046u  0.52
2006 Zhang X, Tu KN. Preparation of hierarchically porous nickel from macroporous silicon. Journal of the American Chemical Society. 128: 15036-7. PMID 17117824 DOI: 10.1021/ja062562+  0.36
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