Felix Recht, Ph.D. - Publications

Affiliations: 
2009 University of California, Santa Barbara, Santa Barbara, CA, United States 
Area:
Electronics & Photonics

13 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2013 Sasikumar A, Arehart AR, Martin-Horcajo S, Romero MF, Pei Y, Brown D, Recht F, Di Forte-Poisson MA, Calle F, Tadjer MJ, Keller S, Denbaars SP, Mishra UK, Ringel SA. Direct comparison of traps in InAlN/GaN and AlGaN/GaN high electron mobility transistors using constant drain current deep level transient spectroscopy Applied Physics Letters. 103. DOI: 10.1063/1.4813862  0.701
2013 Arehart AR, Sasikumar A, Rajan S, Via GD, Poling B, Winningham B, Heller ER, Brown D, Pei Y, Recht F, Mishra UK, Ringel SA. Direct observation of 0.57 eV trap-related RF output power reduction in AlGaN/GaN high electron mobility transistors Solid-State Electronics. 80: 19-22. DOI: 10.1016/J.Sse.2012.09.010  0.736
2011 Kocan M, Recht F, Umana-Membreno GA, Kilburn MR, Nener BD, Mishra UK, Parish G. Implantation angle periphery effects on non-alloyed Si-implanted ohmic contacts for AlGaN/GaN high electron mobility transistors Solid-State Electronics. 56: 56-59. DOI: 10.1016/J.Sse.2010.10.013  0.681
2008 Chu R, Poblenz C, Wong MH, Dasgupta S, Rajan S, Pei Y, Recht F, Shen L, Speck JS, Mishra UK. Improved performance of plasma-assisted molecular beam epitaxy grown AlGaN/GaN high electron mobility transistors with gate-recess and CF 4-treatment Applied Physics Express. 1: 0611011-0611013. DOI: 10.1143/Apex.1.061101  0.719
2008 Kocan M, Umana-Membreno GA, Kilburn MR, Fletcher IR, Recht F, McCarthy L, Mishra UK, Nener BD, Parish G. Scanning ion probe studies of silicon implantation profiles in AlGaN/GaN HEMT heterostructures Journal of Electronic Materials. 37: 554-557. DOI: 10.1007/S11664-007-0336-9  0.766
2008 Cuerdo R, Pei Y, Recht F, Fichtenbaum N, Keller S, Denbaars SP, Calle F, Mishra UK. Temperature-dependent high-frequency performance of deep submicron AlGaN/GaN HEMTs Physica Status Solidi (C) Current Topics in Solid State Physics. 5: 2994-2997. DOI: 10.1002/Pssc.200779240  0.71
2008 Kocan M, Umana-Membreno GA, Recht F, Baharin A, Fichtenbaum NA, McCarthy L, Keller S, Menozzi R, Mishra UK, Parish G, Nener BD. GaN vertical n-p junctions prepared by Si ion implantation Physica Status Solidi (C) Current Topics in Solid State Physics. 5: 1938-1940. DOI: 10.1002/Pssc.200778496  0.718
2007 Poblenz C, Corrion AL, Recht F, Suh CS, Chu R, Shen L, Speck JS, Mishra UK. Power performance of AlGaN/GaN HEMTs grown on SiC by ammonia-MBE at 4 and 10 GHz Ieee Electron Device Letters. 28: 945-947. DOI: 10.1109/Led.2007.907266  0.7
2007 Pei Y, Suh C, Chu R, Recht F, Shen L, Corrion A, Poblenz C, Speck J, Mishra UK. AlGaN/GaN HEMT with high PAE and breakdown voltage grown by ammonia MBE 65th Drc Device Research Conference. 129-130. DOI: 10.1109/DRC.2007.4373683  0.609
2007 Recht F, McCarthy L, Shen L, Poblenz C, Corrion A, Speck JS, Mishra UK. AlGaN/ GaN HEMTs with large angle implanted nonalloyed ohmic contacts 65th Drc Device Research Conference. 37-38. DOI: 10.1109/DRC.2007.4373640  0.702
2007 Pei Y, Recht F, Fichtenbaum N, Keller S, Denbaars SP, Mishra UK. Deep submicron AlGaN/GaN HEMTs with ion implanted source/drain regions and non-alloyed ohmic contacts Electronics Letters. 43: 1466-1467. DOI: 10.1049/El:20072969  0.765
2007 Kocan M, Umana-Membreno GA, Chung JS, Recht F, McCarthy L, Keller S, Mishra UK, Parish G, Nener BD. Characterization of non-alloyed ohmic contacts to Si-implanted AlGaN/GaN heterostructures for high-electron mobility transistors Journal of Electronic Materials. 36: 1156-1159. DOI: 10.1007/S11664-007-0184-7  0.748
2006 Recht F, McCarthy L, Rajan S, Chakraborty A, Poblenz C, Corrion A, Speck JS, Mishra UK. Nonalloyed ohmic contacts in AlGaN/GaN HEMTs by ion implantation with reduced activation annealing temperature Ieee Electron Device Letters. 27: 205-207. DOI: 10.1109/Led.2006.870419  0.785
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