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Bavani Balakrisnan, Ph.D. - Publications

Affiliations: 
2012 Mechanical Engineering University of Maryland, College Park, College Park, MD 
Area:
Mechanical Engineering, Materials Science Engineering, Applied Mechanics
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14 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Balakrisnan B, Nacev A, Smela E. Design of bending multi-layer electroactive polymer actuators Smart Materials and Structures. 24. DOI: 10.1088/0964-1726/24/4/045032  0.564
2014 Gerratt AP, Balakrisnan B, Penskiy I, Bergbreiter S. Dielectric elastomer actuators fabricated using a micro-molding process Smart Materials and Structures. 23. DOI: 10.1088/0964-1726/23/5/055004  0.424
2012 Balakrisnan B, Nacev A, Burke JM, Dasgupta A, Smela E. Design of compliant meanders for applications in MEMS, actuators, and flexible electronics Smart Materials and Structures. 21. DOI: 10.1088/0964-1726/21/7/075033  0.541
2011 Alben S, Balakrisnan B, Smela E. Edge effects determine the direction of bilayer bending. Nano Letters. 11: 2280-5. PMID 21528897 DOI: 10.1021/Nl200473P  0.514
2010 Balakrisnan B, Smela E. Challenges in the microfabrication of dielectric elastomer actuators Proceedings of Spie - the International Society For Optical Engineering. 7642. DOI: 10.1117/12.847613  0.546
2009 Balakrisnan B, Patil S, Smela E. Patterning PDMS using a combination of wet and dry etching Journal of Micromechanics and Microengineering. 19. DOI: 10.1088/0960-1317/19/4/047002  0.536
2007 Liew SL, Balakrisnan B, Ho CS, Thomas O, Chi DZ. Phase and texture of Er-germanide formed on Ge(001) through a solid-state reaction Journal of the Electrochemical Society. 154. DOI: 10.1149/1.2372582  0.307
2006 Liew SL, Lee RTP, Lee KY, Balakrisnan B, Chow SY, Lai MY, Chi DZ. Enhanced morphological stability of NiGe films formed using Ni(Zr) alloy Thin Solid Films. 504: 104-107. DOI: 10.1016/J.Tsf.2005.09.149  0.354
2006 Liew SL, Balakrisnan B, Chow SY, Lai MY, Wang WD, Lee KY, Ho CS, Osipowicz T, Chi DZ. Growth of high quality Er-Ge films on Ge(001) substrates by suppressing oxygen contamination during germanidation annealing Thin Solid Films. 504: 81-85. DOI: 10.1016/J.Tsf.2005.09.046  0.323
2006 Chen Z, He M, Balakrisnan B, Chum CC. Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films Materials Science and Engineering A. 423: 107-110. DOI: 10.1016/J.Msea.2005.12.038  0.343
2003 Balakrisnan B, Chum CC, Li M, Chen Z, Cahyadi T. Fracture toughness of Cu-Sn intermetallic thin films Journal of Electronic Materials. 32: 166-171. DOI: 10.1007/S11664-003-0188-X  0.31
2002 Balakrisnan B, Tomcik B, Blackwooda DJ. Influence of carbon sputtering conditions on corrosion protection of magnetic layer by an electrochemical technique Journal of the Electrochemical Society. 149. DOI: 10.1149/1.1448819  0.353
2002 Tomcik B, Seng SC, Balakrisnan B, Lee JY. Electrochemical tests on the carbon protective layer of a hard disk Diamond and Related Materials. 11: 1409-1415. DOI: 10.1016/S0925-9635(02)00038-9  0.323
2002 Zhang F, Li M, Balakrisnan B, Chen WT. Failure mechanism of lead-free solder joints in flip chip packages Journal of Electronic Materials. 31: 1256-1263. DOI: 10.1007/S11664-002-0018-6  0.335
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