Brian T. Good, Ph.D. - Publications

Affiliations: 
2005 University of Colorado, Boulder, Boulder, CO, United States 
Area:
Chemical Engineering

7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2007 Good BT, Bowman CN, Davis RH. A water-activated pump for portable microfluidic applications. Journal of Colloid and Interface Science. 305: 239-49. PMID 17081553 DOI: 10.1016/J.Jcis.2006.08.067  0.8
2007 Good BT, Reddy S, Davis RH, Bowman CN. Tailorable low modulus, reversibly deformable elastomeric thiol-ene materials for microfluidic applications Sensors and Actuators, B: Chemical. 120: 473-480. DOI: 10.1016/J.Snb.2006.02.040  0.8
2006 Good BT, Bowman CN, Davis RH. An effervescent reaction micropump for portable microfluidic systems. Lab On a Chip. 6: 659-66. PMID 16652182 DOI: 10.1039/B601542E  0.8
2006 Haraldsson KT, Hutchison JB, Sebra RP, Good BT, Anseth KS, Bowman CN. 3D polymeric microfluidic device fabrication via contact liquid photolithographic polymerization (CLiPP) Sensors and Actuators, B: Chemical. 113: 454-460. DOI: 10.1016/J.Snb.2005.03.096  0.8
2005 Simms HM, Brotherton CM, Good BT, Davis RH, Anseth KS, Bowman CN. In situ fabrication of macroporous polymer networks within microfluidic devices by living radical photopolymerization and leaching. Lab On a Chip. 5: 151-7. PMID 15672128 DOI: 10.1039/B412589D  0.8
2004 Hutchison JB, Haraldsson KT, Good BT, Sebra RP, Luo N, Anseth KS, Bowman CN. Robust polymer microfluidic device fabrication via contact liquid photolithographic polymerization (CLiPP). Lab On a Chip. 4: 658-62. PMID 15570381 DOI: 10.1039/B405985A  0.8
2004 Good BT, Bowman CN, Davis RH. Modeling and verification of fluid-responsive polymer pumps for microfluidic systems Chemical Engineering Science. 59: 5967-5974. DOI: 10.1016/J.Ces.2004.07.041  0.8
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