Jaeseol Cho, Ph.D. - Publications

Affiliations: 
2007 Chemical Engineering University of Massachusetts, Amherst, Amherst, MA 
Area:
Chemical Engineering

17 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2012 Cho J, Dorfman KD. Erratum to “Brownian dynamics simulations of electrophoretic DNA separations in a sparse ordered post array” [J. Chromatogr. A 1217 (2010) 5522–5528] Journal of Chromatography A. 1252: 189. DOI: 10.1016/J.Chroma.2012.06.077  0.622
2010 Cho J, Dorfman KD. Brownian dynamics simulations of electrophoretic DNA separations in a sparse ordered post array Journal of Chromatography A. 1217: 5522-5528. PMID 20650462 DOI: 10.1016/J.Chroma.2010.06.057  0.669
2010 Cho J, Kumar S, Dorfman KD. Electrophoretic collision of a DNA molecule with a small elliptical obstacle Electrophoresis. 31: 860-867. PMID 20191551 DOI: 10.1002/Elps.200900491  0.645
2010 Cho J, Gungor MR, Maroudas D. Analysis of current-driven motion of morphologically stable voids in metallic thin films: Steady and time-periodic states Journal of Applied Physics. 108. DOI: 10.1063/1.3476263  0.532
2009 Ou J, Cho J, Olson DW, Dorfman KD. DNA electrophoresis in a sparse ordered post array. Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics. 79: 061904. PMID 19658521 DOI: 10.1103/Physreve.79.061904  0.716
2009 Laachi N, Cho J, Dorfman KD. DNA unhooking from a single post as a deterministic process: insights from translocation modeling. Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics. 79: 031928. PMID 19391992 DOI: 10.1103/Physreve.79.031928  0.755
2009 Cho J, Kenward M, Dorfman KD. A boundary element method/Brownian dynamics approach for simulating DNA electrophoresis in electrically insulating microfabricated devices Electrophoresis. 30: 1482-1489. PMID 19350540 DOI: 10.1002/Elps.200800582  0.753
2009 Laachi N, Cho J, Dorfman KD. Erratum: DNA unhooking from a single post as a deterministic process: Insights from translocation modeling [Phys. Rev. E79, 031928 (2009)] Physical Review E. 80. DOI: 10.1103/Physreve.80.019903  0.741
2009 Ou J, Cho J, Olson DW, Dorfman KD. DNA electrophoresis in a sparse ordered post array Physical Review E - Statistical, Nonlinear, and Soft Matter Physics. 79. DOI: 10.1103/PhysRevE.79.061904  0.699
2009 Laachi N, Cho J, Dorfman KD. DNA unhooking from a single post as a deterministic process: Insights from translocation modeling Physical Review E - Statistical, Nonlinear, and Soft Matter Physics. 79. DOI: 10.1103/PhysRevE.79.031928  0.753
2008 Cho J, Gungor MR, Maroudas D. Hopf bifurcation, bistability, and onset of current-induced surface wave propagation on void surfaces in metallic thin films Surface Science. 602: 1227-1242. DOI: 10.1016/J.Susc.2008.01.021  0.539
2007 Cho J, Rauf Gungor M, Maroudas D. Theoretical analysis of current-driven interactions between voids in metallic thin films Journal of Applied Physics. 101. DOI: 10.1063/1.2426901  0.539
2006 Cho J, Gungor MR, Maroudas D. Current-driven interactions between voids in metallic interconnect lines and their effects on line electrical resistance Applied Physics Letters. 88. DOI: 10.1063/1.2207849  0.528
2005 Rauf Gungor M, Cho J, Maroudas D. Analysis of electromigration- And stress-induced dynamical response of voids confined in metallic thin films Materials Research Society Symposium Proceedings. 899: 123-128. DOI: 10.1557/Proc-0899-N07-17  0.535
2005 Cho J, Gungor MR, Maroudas D. Effects of electromigration-induced void dynamics on the evolution of electrical resistance in metallic interconnect lines Applied Physics Letters. 86: 1-3. DOI: 10.1063/1.1947373  0.533
2005 Cho J, Gungor MR, Maroudas D. Electromigration-induced wave propagation on surfaces of voids in metallic thin films: Hopf bifurcation for high grain symmetry Surface Science. 575. DOI: 10.1016/J.Susc.2004.11.011  0.527
2004 Cho J, Gungor MR, Maroudas D. Electromigration-driven motion of morphologically stable voids in metallic thin films: Universal scaling of migration speed with void size Applied Physics Letters. 85: 2214-2216. DOI: 10.1063/1.1790037  0.505
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