Xiang Qiu, Ph.D. - Publications
Affiliations: | 2013 | Electrical and Computer Engineering | University of California, Santa Barbara, Santa Barbara, CA, United States |
Area:
Computer EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2015 | Qiu X, Marek-Sadowska M, Maly WP. Three-dimensional chips can be cool: Thermal study of VeSFET-based 3-D chips Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 23: 869-878. DOI: 10.1109/Tvlsi.2014.2325551 | 0.482 | |||
2014 | Qiu X, Marek-Sadowska M, Maly WP. Characterizing VeSFET-based ICs with CMOS-Oriented EDA infrastructure Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 33: 495-506. DOI: 10.1109/Tcad.2013.2293539 | 0.476 | |||
2013 | Qiu X, Marek-Sadowska M. Routing challenges for designs with super high pin density Ieee Transactions On Computer-Aided Design of Integrated Circuits and Systems. 32: 1357-1368. DOI: 10.1109/Tcad.2013.2256462 | 0.451 | |||
Show low-probability matches. |