| Year |
Citation |
Score |
| 2020 |
Zhang J, Ragab T, Zhang W, Basaran C. High current density electron wind forces in metallic graphene nanoribbons. Nanotechnology. PMID 32369799 DOI: 10.1088/1361-6528/Ab9044 |
0.716 |
|
| 2019 |
Zhang W, Ragab T, Zhang J, Basaran C. Influence of Defects on Dissipative Transport in Graphene Nanoribbons Tunnel Field-Effect Transistor. Nanotechnology. PMID 31581145 DOI: 10.1088/1361-6528/Ab4A9A |
0.701 |
|
| 2019 |
Zhang J, Osloub E, Siddiqui F, Zhang W, Ragab T, Basaran C. Anisotropy of Graphene Nanoflake Diamond Interface Frictional Properties. Materials (Basel, Switzerland). 12. PMID 31052418 DOI: 10.3390/Ma12091425 |
0.693 |
|
| 2019 |
Zhang W, Ragab T, Basaran C. Electrostatic Doping-Based All GNR Tunnel FET: An Energy-Efficient Design for Power Electronics Ieee Transactions On Electron Devices. 66: 1971-1978. DOI: 10.1109/Ted.2019.2896315 |
0.679 |
|
| 2019 |
Zhang W, Ragab T, Zhang J, Basaran C. Impact of electrostatic doping level on the dissipative transport in graphene nanoribbons tunnel field-effect transistors Carbon. 153: 120-126. DOI: 10.1016/J.Carbon.2019.07.016 |
0.691 |
|
| 2018 |
Zhang J, Ragab T, Basaran C. Comparison of fracture behavior of defective armchair and zigzag graphene nanoribbons International Journal of Damage Mechanics. 28: 325-345. DOI: 10.1177/1056789518764282 |
0.69 |
|
| 2018 |
Zhang J, Zhang W, Ragab T, Basaran C. Mechanical and electronic properties of graphene nanomesh heterojunctions Computational Materials Science. 153: 64-72. DOI: 10.1016/J.Commatsci.2018.06.026 |
0.707 |
|
| 2018 |
Lan T, Ragab T, Basaran C. Electron-phonon scattering and Joule heating in copper at extreme cold temperatures Computational Materials Science. 149: 397-408. DOI: 10.1016/J.Commatsci.2018.03.049 |
0.711 |
|
| 2018 |
Ragab T, Basaran C. Shear Strength of Square Graphene Nanoribbons beyond Wrinkling Journal of Electronic Materials. 47: 3891-3896. DOI: 10.1007/S11664-018-6264-Z |
0.713 |
|
| 2017 |
Zhang W, Ragab T, Basaran C. Unraveling mechanics of armchair and zigzag graphene nanoribbons International Journal of Damage Mechanics. 26: 447-462. DOI: 10.1177/1056789517695871 |
0.699 |
|
| 2017 |
Ragab T, McDonald J, Basaran C. Aspect ratio effect on shear modulus and ultimate shear strength of graphene nanoribbons Diamond and Related Materials. 74: 9-15. DOI: 10.1016/J.Diamond.2017.01.017 |
0.71 |
|
| 2017 |
Zhang W, Basaran C, Ragab T. Impact of geometry on transport properties of armchair graphene nanoribbon heterojunction Carbon. 124: 422-428. DOI: 10.1016/J.Carbon.2017.09.005 |
0.693 |
|
| 2016 |
Zhang J, Ragab T, Basaran C. The effects of vacancy defect on the fracture behaviors of zigzag graphene nanoribbons International Journal of Damage Mechanics. 26: 608-630. DOI: 10.1177/1056789516671795 |
0.698 |
|
| 2016 |
Zhang J, Ragab T, Basaran C. Influence of vacancy defects on the damage mechanics of graphene nanoribbons International Journal of Damage Mechanics. 26: 29-49. DOI: 10.1177/1056789516645645 |
0.711 |
|
| 2016 |
Fu Y, Ragab T, Basaran C. The effect of Stone-Wales defects on the mechanical behavior of graphene nano-ribbons Computational Materials Science. 124: 142-150. DOI: 10.1016/J.Commatsci.2016.07.022 |
0.711 |
|
| 2016 |
Chu Y, Gautreau P, Ragab T, Basaran C. Strained phonon-phonon scattering in carbon nanotubes Computational Materials Science. 112: 87-91. DOI: 10.1016/J.Commatsci.2015.10.006 |
0.778 |
|
| 2015 |
Chu Y, Ragab T, Gautreau P, Basaran C. Mechanical Properties of Hydrogen Edge–Passivated Chiral Graphene Nanoribbons Journal of Nanomechanics and Micromechanics. 5: 04015001. DOI: 10.1061/(Asce)Nm.2153-5477.0000101 |
0.775 |
|
| 2015 |
Gautreau P, Chu Y, Ragab T, Basaran C. Phonon-phonon scattering rates in single walled carbon nanotubes Computational Materials Science. 103: 151-156. DOI: 10.1016/J.Commatsci.2015.02.046 |
0.783 |
|
| 2015 |
Lee Y, Basaran C. Erratam: Effect of Ni solute on grain boundary diffusivity and structure of βsn (Computational Materials Science (2014) 92 (1-7)) Computational Materials Science. 96: 379. DOI: 10.1016/J.Commatsci.2014.09.023 |
0.472 |
|
| 2015 |
Chu Y, Ragab T, Basaran C. Temperature dependence of Joule heating in Zigzag Graphene Nanoribbon Carbon. 89: 169-175. DOI: 10.1016/J.Carbon.2015.03.030 |
0.705 |
|
| 2014 |
Yao W, Basaran C. Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study International Journal of Damage Mechanics. 23: 203-221. DOI: 10.1177/1056789513488396 |
0.328 |
|
| 2014 |
Chu Y, Gautreau P, Basaran C. Parity conservation in electron-phonon scattering in zigzag graphene nanoribbon Applied Physics Letters. 105. DOI: 10.1063/1.4895553 |
0.789 |
|
| 2014 |
Gautreau P, Ragab T, Chu Y, Basaran C. Phonon dispersion and quantization tuning of strained carbon nanotubes for flexible electronics Journal of Applied Physics. 115. DOI: 10.1063/1.4884613 |
0.796 |
|
| 2014 |
Chu Y, Gautreau P, Ragab T, Basaran C. An accelerated algorithm for full band electron-phonon scattering rate computation Computer Physics Communications. 185: 3392-3397. DOI: 10.1016/J.Cpc.2014.08.009 |
0.768 |
|
| 2014 |
Lee Y, Basaran C. Effect of Ni solute on grain boundary diffusivity and structure of βsn Computational Materials Science. 92: 1-7. DOI: 10.1016/J.Commatsci.2014.05.008 |
0.474 |
|
| 2014 |
Chu Y, Ragab T, Basaran C. The size effect in mechanical properties of finite-sized graphene nanoribbon Computational Materials Science. 81: 269-274. DOI: 10.1016/J.Commatsci.2013.08.016 |
0.714 |
|
| 2013 |
Basaran C, Gunel E. Predicting elastic modulus of particle filled composites International Journal of Materials and Structural Integrity. 7: 100-108. DOI: 10.1504/Ijmsi.2013.055109 |
0.771 |
|
| 2013 |
Lee Y, Basaran C. Atomic-level shear stress-strain behavior of β-sn Journal of Nanomechanics and Micromechanics. 3. DOI: 10.1061/(Asce)Nm.2153-5477.0000066 |
0.536 |
|
| 2013 |
Gunel E, Basaran C. Influence of filler content and interphase properties on large deformation micromechanics of particle filled acrylics Mechanics of Materials. 57: 134-146. DOI: 10.1016/J.Mechmat.2012.10.012 |
0.784 |
|
| 2013 |
Lee Y, Basaran C. A multiscale modeling technique for bridging molecular dynamics with finite element method Journal of Computational Physics. 253: 64-85. DOI: 10.1016/J.Jcp.2013.06.039 |
0.503 |
|
| 2013 |
Kim D, Dargush GF, Basaran C. A cyclic two-surface thermoplastic damage model with application to metallic plate dampers Engineering Structures. 52: 608-620. DOI: 10.1016/J.Engstruct.2013.02.030 |
0.339 |
|
| 2013 |
Lee Y, Basaran C. Corrigendum to "molecular dynamics of viscoplasticity in β-tin lattice and grain boundary" [Comput. Mater. Sci. 68 (2013) 290-296] Computational Materials Science. 77: 467. DOI: 10.1016/J.Commatsci.2013.05.004 |
0.472 |
|
| 2013 |
Yao W, Basaran C. Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model Computational Materials Science. 71: 76-88. DOI: 10.1016/J.Commatsci.2013.01.016 |
0.337 |
|
| 2013 |
Lee Y, Basaran C. Molecular dynamics of viscoplasticity in β-tin lattice and grain boundary Computational Materials Science. 68: 290-296. DOI: 10.1016/J.Commatsci.2012.10.029 |
0.511 |
|
| 2013 |
Gautreau P, Ragab T, Basaran C. Influence of hot phonons on wind forces in metallic single walled carbon nanotubes Carbon. 57: 59-64. DOI: 10.1016/J.Carbon.2013.01.031 |
0.784 |
|
| 2012 |
Ragab T, Basaran C. Modeling Joule heating in carbon nanotubes with Monte Carlo simulations Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 20-29. DOI: 10.1109/ITHERM.2012.6231409 |
0.7 |
|
| 2012 |
Gautreau P, Ragab T, Basaran C. Hot phonons contribution to Joule heating in single-walled carbon nanotubes Journal of Applied Physics. 112. DOI: 10.1063/1.4766901 |
0.784 |
|
| 2012 |
Yao W, Basaran C. Electromigration analysis of solder joints under ac load: A mean time to failure model Journal of Applied Physics. 111. DOI: 10.1063/1.3693532 |
0.322 |
|
| 2012 |
Chen B, Basaran C. Near field modeling of the Moiré interferometer for nanoscale strain measurement Optics and Lasers in Engineering. 50: 976-984. DOI: 10.1016/J.Optlaseng.2012.01.023 |
0.496 |
|
| 2012 |
Chen B, Basaran C. Far-field modeling of Moiré interferometry using scalar diffraction theory Optics and Lasers in Engineering. 50: 1168-1176. DOI: 10.1016/J.Optlaseng.2011.08.007 |
0.485 |
|
| 2011 |
Chen B, Basaran C. Statistical phase-shifting step estimation algorithm based on the continuous wavelet transform for high-resolution interferometry metrology. Applied Optics. 50: 586-93. PMID 21283251 DOI: 10.1364/Ao.50.000586 |
0.445 |
|
| 2011 |
Lee Y, Basaran C. A creep model for solder alloys Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4005288 |
0.542 |
|
| 2011 |
Ragab T, Basaran C. Introduction for JEP Special Issue on Carbon Nanotubes Journal of Electronic Packaging. 133. DOI: 10.1115/1.4004324 |
0.671 |
|
| 2011 |
Ragab T, Basaran C. The unravelling of open-ended single walled carbon nanotubes using molecular dynamics simulations Journal of Electronic Packaging, Transactions of the Asme. 133. DOI: 10.1115/1.4003866 |
0.704 |
|
| 2011 |
Sellers MS, Schultz AJ, Basaran C, Kofke DA. βSn grain boundary structure and self-diffusivity via molecular dynamics simulation Proceedings of the 2011 - Grand Challenges in Modeling and Simulation Conference, Gcms 2011. 321-332. DOI: 10.1103/Physrevb.81.134111 |
0.761 |
|
| 2011 |
Sellers MS, Schultz AJ, Basaran C, Kofke DA. Effect of Cu and Ag solute segregation on βsn grain boundary diffusivity Journal of Applied Physics. 110. DOI: 10.1063/1.3606421 |
0.761 |
|
| 2011 |
Chen B, Basaran C. Measuring Joule heating and strain induced by electrical current with Moiré interferometry Journal of Applied Physics. 109. DOI: 10.1063/1.3565045 |
0.51 |
|
| 2011 |
Sellers MS, Schultz AJ, Kofke DA, Basaran C. Solute Effects on β-Sn Grain Boundary Energy and Shear Stress Journal of Nanomechanics and Micromechanics. 1: 41-50. DOI: 10.1061/(Asce)Nm.2153-5477.0000028 |
0.771 |
|
| 2011 |
Gunel EM, Basaran C. Damage characterization in non-isothermal stretching of acrylics. Part II: Experimental validation Mechanics of Materials. 43: 992-1012. DOI: 10.1016/J.Mechmat.2011.09.003 |
0.792 |
|
| 2011 |
Gunel EM, Basaran C. Damage characterization in non-isothermal stretching of acrylics. Part I: Theory Mechanics of Materials. 43: 979-991. DOI: 10.1016/J.Mechmat.2011.09.002 |
0.777 |
|
| 2011 |
Ragab T, Basaran C. The prediction of the effective charge number in single-walled carbon nanotubes using Monte Carlo simulation Carbon. 49: 425-434. DOI: 10.1016/J.Carbon.2010.09.039 |
0.722 |
|
| 2010 |
Chen B, Basaran C. Continuous wavelet transform based nanoscale strain field measurement using Moire interferometry with phase shifting Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 647-654. DOI: 10.1115/InterPACK2009-89016 |
0.438 |
|
| 2010 |
Basaran C, Ragab T. Damage mechanics of carbon nano tubes under uniaxial tension Proceedings of the Asme Interpack Conference 2009, Ipack2009. 1: 513-516. DOI: 10.1115/InterPACK2009-89005 |
0.703 |
|
| 2010 |
Gunel EM, Basaran C. Stress whitening quantification of thermoformed mineral filled acrylics Journal of Engineering Materials and Technology, Transactions of the Asme. 132: 0310021-03100211. DOI: 10.1115/1.4001262 |
0.773 |
|
| 2010 |
Chen B, Basaran C. Statistical phase shifting step estimation based on continuous wavelet transform for high resolution interferometry metrology 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501282 |
0.368 |
|
| 2010 |
Sellers MS, Schultz AJ, Basaran C, Kofke DA. β-Sn grain-boundary structure and self-diffusivity via molecular dynamics simulations Physical Review B - Condensed Matter and Materials Physics. 81. DOI: 10.1103/PhysRevB.81.134111 |
0.696 |
|
| 2010 |
Ragab T, Basaran C. Semi-classical transport for predicting joule heating in carbon nanotubes Physics Letters, Section a: General, Atomic and Solid State Physics. 374: 2475-2479. DOI: 10.1016/J.Physleta.2010.04.009 |
0.71 |
|
| 2010 |
Ragab T, Basaran C. Corrigendum to 'A quantum mechanical formulation of electron transport induced wind forces in metallic single walled carbon nanotubes' (DOI:10.1016/j.carbon.2009.08.010) Carbon. 48: 1321. DOI: 10.1016/J.Carbon.2009.12.032 |
0.692 |
|
| 2010 |
Ragab T, Basaran C. A quantum mechanical formulation of electron transport induced wind forces in metallic single-walled carbon nanotubes Carbon. 48: 47-53. DOI: 10.1016/J.Carbon.2009.08.010 |
0.721 |
|
| 2010 |
Sellers MS, Schultz AJ, Basaran C, Kofke DA. Atomistic modeling of β-Sn surface energies and adatom diffusivity Applied Surface Science. 256: 4402-4407. DOI: 10.1016/J.Apsusc.2010.02.038 |
0.764 |
|
| 2009 |
Li S, Sellers MS, Basaran C, Schultz AJ, Kofke DA. Lattice strain due to an atomic vacancy. International Journal of Molecular Sciences. 10: 2798-808. PMID 19582230 DOI: 10.3390/Ijms10062798 |
0.783 |
|
| 2009 |
Abdulhamid MF, Basaran C, Lai Y. Thermomigration Versus Electromigration in Microelectronics Solder Joints Ieee Transactions On Advanced Packaging. 32: 627-635. DOI: 10.1109/Tadvp.2009.2018293 |
0.315 |
|
| 2009 |
Li S, Abdulhamid MF, Basaran C. Damage Mechanics of Low Temperature Electromigration and Thermomigration Ieee Transactions On Advanced Packaging. 32: 478-485. DOI: 10.1109/Tadvp.2008.2005840 |
0.546 |
|
| 2009 |
Ragab T, Basaran C. Joule heating in single-walled carbon nanotubes Journal of Applied Physics. 106. DOI: 10.1063/1.3204971 |
0.713 |
|
| 2009 |
Basaran C, Li S, Hopkins DC, Veychard D. Electromigration time to failure of SnAgCuNi solder joints Journal of Applied Physics. 106. DOI: 10.1063/1.3159012 |
0.502 |
|
| 2009 |
Gunel EM, Basaran C. Micro-deformation mechanisms in thermoformed alumina trihydrate reinforced poly(methyl methacrylate) Materials Science and Engineering A. 523: 160-172. DOI: 10.1016/J.Msea.2009.05.064 |
0.787 |
|
| 2009 |
Li S, Basaran C. A computational damage mechanics model for thermomigration Mechanics of Materials. 41: 271-278. DOI: 10.1016/J.Mechmat.2008.10.013 |
0.564 |
|
| 2009 |
Li S, Basaran C. Effective diffusivity of lead free solder alloys Computational Materials Science. 47: 71-78. DOI: 10.1016/J.Commatsci.2009.06.015 |
0.51 |
|
| 2009 |
Ragab T, Basaran C. A framework for stress computation in single-walled carbon nanotubes under uniaxial tension Computational Materials Science. 46: 1135-1143. DOI: 10.1016/J.Commatsci.2009.05.022 |
0.716 |
|
| 2008 |
Abdulhamid MF, Li S, Basaran C. Thermomigration in lead-free solder joints International Journal of Materials and Structural Integrity. 2: 11-34. DOI: 10.1504/Ijmsi.2008.018898 |
0.533 |
|
| 2008 |
Basaran C, Nie S, Hutchins CS, Ergun H. Influence of interfacial bond strength on fatigue life and thermo-mechanical behavior of a particulate composite: An experimental study International Journal of Damage Mechanics. 17: 123-147. DOI: 10.1177/1056789507077437 |
0.583 |
|
| 2008 |
Basaran C, Nie S, Hutchins CS. Time dependent behavior of a particle filled composite PMMA/ATH at elevated temperatures Journal of Composite Materials. 42: 2003-2025. DOI: 10.1177/0021998308094542 |
0.591 |
|
| 2008 |
Basaran C, Li S, Abdulhamid MF. Thermomigration induced degradation in solder alloys Journal of Applied Physics. 103. DOI: 10.1063/1.2943261 |
0.56 |
|
| 2008 |
Basaran C, Lin M. Damage mechanics of electromigration induced failure Mechanics of Materials. 40: 66-79. DOI: 10.1016/J.Mechmat.2007.06.006 |
0.336 |
|
| 2008 |
Chen B, Basaran C. Automatic full strain field Moiré interferometry measurement with nano-scale resolution Proceedings of the Society For Experimental Mechanics, Inc.. 65: 665-673. DOI: 10.1007/S11340-008-9127-3 |
0.313 |
|
| 2007 |
Basaran C. Damage mechanics of solder joints under high current density Key Engineering Materials. 345: 1403-1410. DOI: 10.4028/Www.Scientific.Net/Kem.345-346.1403 |
0.326 |
|
| 2007 |
Basaran C, Lin M. Damage mechanics of electromigration in microelectronics copper interconnects International Journal of Materials and Structural Integrity. 1: 16-39. DOI: 10.1504/Ijmsi.2007.013864 |
0.592 |
|
| 2007 |
Basaran C, Gomez J, Lin M, Li S. Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging Summer Computer Simulation Conference 2007, Scsc'07, Part of the 2007 Summer Simulation Multiconference, Summersim'07. 1: 269-275. DOI: 10.1163/157361106777641387 |
0.603 |
|
| 2007 |
Gomez J, Basaran C. Determination of strain gradient plasticity length scale for microelectronics solder alloys Journal of Electronic Packaging, Transactions of the Asme. 129: 120-128. DOI: 10.1115/1.2721082 |
0.323 |
|
| 2007 |
Basaran C, Lin M. Electromigration induced strain field simulations for nanoelectronics lead-free solder joints International Journal of Solids and Structures. 44: 4909-4924. DOI: 10.1016/J.Ijsolstr.2006.12.011 |
0.366 |
|
| 2007 |
Basaran C, Nie S. A thermodynamics based damage mechanics model for particulate composites International Journal of Solids and Structures. 44: 1099-1114. DOI: 10.1016/J.Ijsolstr.2006.06.001 |
0.568 |
|
| 2006 |
Nie S, Basaran C, Hutchins CS, Ergun H. Failure Mechanisms in PMMA/ATH Acrylic Casting Dispersion Journal of the Mechanical Behavior of Materials. 17: 79-96. DOI: 10.1515/Jmbm.2006.17.2.79 |
0.561 |
|
| 2006 |
Ye H, Basaran C, Hopkins DC. Experimental damage mechanics of micro/power electronics solder joints under electric current stresses International Journal of Damage Mechanics. 15: 41-67. DOI: 10.1177/1056789506054311 |
0.486 |
|
| 2006 |
Li S, Abdulhamid MF, Lin M, Basaran C. Thermomigration induced strain field simulation for microelectronic lead free solder joints American Society of Mechanical Engineers, Electronic and Photonic Packaging, Epp. DOI: 10.1115/Imece2006-13046 |
0.692 |
|
| 2006 |
Basaran C, Wen Y. Analysis of multilayered microelectronic packaging under thermal gradient loading Ieee Transactions On Components and Packaging Technologies. 29: 850-855. DOI: 10.1109/Tcapt.2006.885966 |
0.309 |
|
| 2006 |
Basaran C, Wen Y. Influence of interfacial compliance on thermomechanical stresses in multilayered microelectronic packaging Ieee Transactions On Advanced Packaging. 29: 666-673. DOI: 10.1109/Tadvp.2006.871175 |
0.305 |
|
| 2006 |
Yujun W, Basaran C. An analytical model for thermal stress analysis of multi-layered microelectronic packaging 2005 Conference On High Density Microsystem Design and Packaging and Component Failure Analysis, Hdp'05. DOI: 10.1016/S0167-6636(03)00076-0 |
0.334 |
|
| 2006 |
Gomez J, Basaran C. Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm Mechanics of Materials. 38: 585-598. DOI: 10.1016/J.Mechmat.2005.11.008 |
0.342 |
|
| 2006 |
Gomez J, Basaran C. Nanoindentation of Pb/Sn solder alloys; Experimental and finite element simulation results International Journal of Solids and Structures. 43: 1505-1527. DOI: 10.1016/J.Ijsolstr.2005.06.095 |
0.382 |
|
| 2005 |
Basaran C, Zhao Y, Tang H, Gomez J. A Damage-Mechanics-Based Constitutive Model for Solder Joints Journal of Electronic Packaging. 127: 208-214. DOI: 10.1115/1.1939822 |
0.353 |
|
| 2005 |
Basaran C, Tang H, Nie S. Experimental damage mechanics of microelectronic solder joints under fatigue loading Proceedings - Electronic Components and Technology Conference. 1: 874-881. DOI: 10.1016/J.Mechmat.2003.10.002 |
0.588 |
|
| 2005 |
Nie S, Basaran C. A micromechanical model for effective elastic properties of particulate composites with imperfect interfacial bonds International Journal of Solids and Structures. 42: 4179-4191. DOI: 10.1016/J.Ijsolstr.2004.12.009 |
0.577 |
|
| 2005 |
Gomez J, Basaran C. A thermodynamics based damage mechanics constitutive model for low cycle fatigue analysis of microelectronics solder joints incorporating size effects International Journal of Solids and Structures. 42: 3744-3772. DOI: 10.1016/J.Ijsolstr.2004.11.022 |
0.392 |
|
| 2005 |
Lin M, Basaran C. Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties Computational Materials Science. 34: 82-98. DOI: 10.1016/J.Commatsci.2004.10.007 |
0.369 |
|
| 2004 |
Basaran C, Nie S. An irreversible thermodynamics theory for damage mechanics of solids International Journal of Damage Mechanics. 13: 205-223. DOI: 10.1177/1056789504041058 |
0.555 |
|
| 2004 |
Liu H, Basaran C, Cartwright AN, Casey W. Application of Moiré interferometry to determine strain fields and debonding of solder joints in BGA packages Ieee Transactions On Components and Packaging Technologies. 27: 217-223. DOI: 10.1109/Tcapt.2003.821687 |
0.347 |
|
| 2004 |
Ye H, Basaran C, Hopkins DC. Deformation of solder joint under current stressing and numerical simulation - I International Journal of Solids and Structures. 41: 4939-4958. DOI: 10.1016/J.Ijsolstr.2004.04.003 |
0.337 |
|
| 2004 |
Basaran C, Lin M, Ye H. A thermodynamic model for electrical current induced damage Proceedings - Electronic Components and Technology Conference. 2: 1738-1745. DOI: 10.1016/J.Ijsolstr.2003.08.018 |
0.644 |
|
| 2003 |
Basaran C, Wen Y. Coarsening in BGA solder balls: Modeling and experimental evaluation Journal of Electronic Packaging, Transactions of the Asme. 125: 426-430. DOI: 10.1115/1.1602707 |
0.576 |
|
| 2003 |
Tang H, Basaran C. A damage mechanics-based fatigue life prediction model for solder joints Journal of Electronic Packaging, Transactions of the Asme. 125: 120-125. DOI: 10.1115/1.1536171 |
0.354 |
|
| 2003 |
Wen Y, Basaran C. Thermomechanical stress analysis of multi-layered electronic packaging Journal of Electronic Packaging, Transactions of the Asme. 125: 134-138. DOI: 10.1115/1.1535446 |
0.569 |
|
| 2003 |
Ye H, Basaran C, Hopkins DC. Numerical Simulation of Stress Evolution during Electromigration in IC Interconnect Lines Ieee Transactions On Components and Packaging Technologies. 26: 673-681. DOI: 10.1109/Tcapt.2003.817877 |
0.498 |
|
| 2003 |
Ye H, Basaran C, Hopkins D. Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing Applied Physics Letters. 82: 1045-1047. DOI: 10.1063/1.1554775 |
0.476 |
|
| 2003 |
Ye H, Hopkins DC, Basaran C. Measurement of high electrical current density effects in solder joints Microelectronics Reliability. 43: 2021-2029. DOI: 10.1016/S0026-2714(03)00131-8 |
0.511 |
|
| 2003 |
Ye H, Basaran C, Hopkins DC. Damage mechanics of microelectronics solder joints under high current densities International Journal of Solids and Structures. 40: 4021-4032. DOI: 10.1016/S0020-7683(03)00175-6 |
0.314 |
|
| 2003 |
Wen Y, Basaran C. Analysis of multi-layered microelectronic packaging under uniformly distributed loading International Journal of Solids and Structures. 40: 3331-3345. DOI: 10.1016/S0020-7683(03)00092-1 |
0.566 |
|
| 2003 |
Ye H, Basaran C, Hopkins DC. Mechanical degradation of microelectronics solder joints under current stressing International Journal of Solids and Structures. 40: 7269-7284. DOI: 10.1016/J.Ijsolstr.2003.08.019 |
0.331 |
|
| 2002 |
Ye H, Basaran C, Hopkins D. Mechanical implications of high current densities in flip chip solder joints Asme International Mechanical Engineering Congress and Exposition, Proceedings. 477-483. DOI: 10.1177/1056789504044282 |
0.309 |
|
| 2002 |
Basaran C, Nie S. Irreversible thermodynamics for damage mechanics of solid materials Asme International Mechanical Engineering Congress and Exposition, Proceedings. 193-198. DOI: 10.1115/IMECE2002-32937 |
0.5 |
|
| 2002 |
Basaran C, Tang H. Implementation of a thermodynamic framework for damage mechanics of solder interconnect in microelectronic packaging Asme International Mechanical Engineering Congress and Exposition, Proceedings. 61-68. DOI: 10.1106/105678902022259 |
0.367 |
|
| 2002 |
Basaran C, Jiang J. Measuring intrinsic elastic modulus of Pb/Sn solder alloys Mechanics of Materials. 34: 349-362. DOI: 10.1016/S0167-6636(02)00131-X |
0.301 |
|
| 2001 |
Basaran C, Zhao Y. Mesh sensitivity and FEA for multi-layered electronic packaging Journal of Electronic Packaging, Transactions of the Asme. 123: 218-224. DOI: 10.1115/1.1362674 |
0.302 |
|
| 2001 |
Tang H, Basaran C. Influence of microstructure coarsening on thermomechanical fatigue behavior of Pb/Sn eutectic solder joints International Journal of Damage Mechanics. 10: 235-255. DOI: 10.1106/Kfd9-Xr1F-Vnve-95Xn |
0.35 |
|
| 2001 |
Basaran C, Cartwright A, Zhao Y. Experimental damage mechanics of microelectronics solder joints under concurrent vibration and thermal loading International Journal of Damage Mechanics. 10: 153-170. DOI: 10.1106/Hlb3-Mjc8-Jvyl-9A9P |
0.305 |
|
| 2001 |
Ye H, Lin M, Basaran C. Failure modes and FEM analysis of power electronic packaging Advances in Electronic Packaging. 1: 417-428. DOI: 10.1016/S0168-874X(01)00094-4 |
0.615 |
|
| 2000 |
Zhao Y, Basaran C, Cartwright A, Dishongh T. Thermomechanical behavior of micron scale solder joints under dynamic loads Mechanics of Materials. 32: 161-173. DOI: 10.1016/S0167-6636(99)00053-8 |
0.359 |
|
| 2000 |
Basaran C, Chandaroy R. Using finite element analysis for simulation of reliability tests on solder joints in microelectronic packaging Computers and Structures. 74: 215-231. DOI: 10.1016/S0045-7949(99)00028-0 |
0.337 |
|
| 1999 |
Chandaroy R, Basaran C. Damage mechanics of surface mount technology solder joints under concurrent thermal and dynamic loading Journal of Electronic Packaging, Transactions of the Asme. 121: 61-68. DOI: 10.1115/1.2792669 |
0.337 |
|
| 1999 |
Basaran C, Chandaroy R. Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory Journal of Electronic Packaging. 121: 8-11. DOI: 10.1115/1.2792663 |
0.337 |
|
| 1999 |
Basaran C, Chandaroy R. Thermomechanical analysis of solder joints under thermal and vibration loading American Society of Mechanical Engineers, Eep. 26: 419-422. DOI: 10.1115/1.1400752 |
0.333 |
|
| 1999 |
Basaran C, Zhao Y. Closed form vs. finite element analysis of laminated stacks Finite Elements in Analysis and Design. 32: 163-179. DOI: 10.1016/S0168-874X(99)00012-8 |
0.327 |
|
| 1998 |
Basaran C, Desai CS, Kundu T. Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2 - Verification and Application Journal of Electronic Packaging, Transactions of the Asme. 120: 48-53. DOI: 10.1115/1.2792285 |
0.525 |
|
| 1998 |
Basaran C, Desai CS, Kundu T. Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1 - Theory and Formulation Journal of Electronic Packaging, Transactions of the Asme. 120: 41-47. DOI: 10.1115/1.2792284 |
0.559 |
|
| 1998 |
Desai CS, Basaran C, Dishongh T, Prince JL. Thermomechanical analysis in electronic packaging with unified constitutive model for materials and joints Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 21: 87-97. DOI: 10.1109/96.659511 |
0.503 |
|
| 1998 |
Basaran C, Chandaroy R. Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations Applied Mathematical Modelling. 22: 601-627. DOI: 10.1016/S0307-904X(98)10059-8 |
0.334 |
|
| 1997 |
Basaran C, Chandaroy R. Finite element simulation of the temperature cycling tests Ieee Transactions On Components Packaging and Manufacturing Technology Part A. 20: 530-536. DOI: 10.1109/95.650944 |
0.319 |
|
| 1997 |
Desai CS, Basaran C, Zhang W. Numerical algorithms and mesh dependence in the disturbed state concept International Journal For Numerical Methods in Engineering. 40: 3059-3083. DOI: 10.1002/(Sici)1097-0207(19970830)40:16<3059::Aid-Nme182>3.0.Co;2-S |
0.553 |
|
| Show low-probability matches. |
