Ibrahim Guven, Ph.D. - Publications

Affiliations: 
2000 University of Arizona, Tucson, AZ 
Area:
Mechanical Engineering, Applied Mechanics

62 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Prevatte C, Meitl MA, Gomez D, Ghosal K, Bonafede S, Raymond B, Moore T, Trindade AJ, Hines P, Guven I, Bower CA. Pressure-Activated Electrical Interconnection during Micro-Transfer-Printing Proceedings - Electronic Components and Technology Conference. 2016: 1209-1215. DOI: 10.1109/ECTC.2016.355  1
2016 Prevatte C, Guven I, Ghosal K, Gomez D, Moore T, Bonafede S, Raymond B, Trindade AJ, Fecioru A, Kneeburg D, Meitl MA, Bower CA. Pressure activated interconnection of micro transfer printed components Applied Physics Letters. 108. DOI: 10.1063/1.4950992  1
2016 Guven I. Peridynamics Springer Series in Materials Science. 226: 219-247. DOI: 10.1007/978-3-319-24529-4_5  1
2015 Guven I, Zelinski BJ. Peridynamic modeling of damage and fracture in em windows and domes Proceedings of Spie - the International Society For Optical Engineering. 9453. DOI: 10.1117/12.2202309  1
2015 Tune S, Schultz R, Guven I, Zelinski BJ. Peridynamic simulation of the effects of coatings, substrate properties, incident angle, and tilt on sand impact damage in transparent ceramic windows Proceedings of Spie - the International Society For Optical Engineering. 9453. DOI: 10.1117/12.2181433  1
2015 Schultz R, Guven I, Zelinski BJ. Role of impactor properties on the computational simulation of particle impact damage in transparent ceramic windows Proceedings of Spie - the International Society For Optical Engineering. 9453. DOI: 10.1117/12.2181407  1
2015 Guven I. A fundamental computational study of 3-D non-planar fracture in solder joints Proceedings - Electronic Components and Technology Conference. 2015: 1017-1022. DOI: 10.1109/ECTC.2015.7159720  1
2015 Madenci E, Guven I. The finite element method and applications in engineering using ANSYS®, second edition The Finite Element Method and Applications in Engineering Using Ansys, Second Edition. 1-657. DOI: 10.1007/978-1-4899-7550-8  1
2014 Ball S, Guven I, Sinha P, Rastogi R, McCarson B. Computational investigation of failure in anodized aluminum Proceedings - Electronic Components and Technology Conference. 2035-2041. DOI: 10.1109/ECTC.2014.6897582  1
2012 Oterkus E, Guven I, Madenci E. Impact damage assessment by using peridynamic theory Central European Journal of Engineering. 2: 523-531. DOI: 10.2478/S13531-012-0025-1  1
2012 Agwai A, Guven I, Madenci E. Drop-shock failure prediction in electronic packages by using peridynamic theory Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 439-447. DOI: 10.1109/Tcpmt.2011.2175924  1
2012 Agwai A, Guven I, Madenci E. Failure prediction in fully coupled thermal and deformational fields with peridynamics Proceedings - Electronic Components and Technology Conference. 1223-1232. DOI: 10.1109/ECTC.2012.6248991  1
2012 Colavito KW, Guven I, Madenci E. Fracture behavior of nanostructured materials through peridynamic theory Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 1
2012 Agwai A, Guven I, Madenci E. Fully coupled peridynamic thermomechanics 53rd Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 2012 1
2011 Celik E, Guven I, Madenci E. Mechanical characterization of nickel nanowires by using a customized atomic force microscope. Nanotechnology. 22: 155702. PMID 21389567 DOI: 10.1088/0957-4484/22/15/155702  1
2011 Barut A, Guven I, Madenci E. An analytical method for evaluating repairs in composite honeycomb structures Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. DOI: 10.2514/6.2011-1789  1
2011 Barut A, Guven I, Madenci E. An analytical method for evaluating bolted joint repairs in composite structures Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. DOI: 10.2514/6.2011-1733  1
2011 Celik E, Guven I, Madenci E. Mechanical characterization of nickel nanowires by using a customized atomic microscope in scanning electron microscope Proceedings - Electronic Components and Technology Conference. 1999-2006. DOI: 10.1109/ECTC.2011.5898791  1
2011 Agwai A, Guven I, Madenci E. A new thermomechanical fracture analysis approach for 3D integration technology Proceedings - Electronic Components and Technology Conference. 740-745. DOI: 10.1109/ECTC.2011.5898595  1
2011 Yoon Kah L, Akoglu A, Guven I, Madenci E. High performance linear equation solver using NVIDIA GPUs Proceedings of the 2011 Nasa/Esa Conference On Adaptive Hardware and Systems, Ahs 2011. 367-374. DOI: 10.1109/AHS.2011.5963960  1
2011 Celik E, Guven I, Madenci E. Simulations of nanowire bend tests for extracting mechanical properties Theoretical and Applied Fracture Mechanics. 55: 185-191. DOI: 10.1016/J.Tafmec.2011.07.002  1
2011 Agwai A, Guven I, Madenci E. Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory Microelectronics Reliability. 51: 2298-2305. DOI: 10.1016/J.Microrel.2011.05.011  1
2011 Madenci E, Barut A, Guven I. Stress analysis of bonded patch and scarf repairs in composite structures Composite Joints and Connections. 463-483. DOI: 10.1016/B978-1-84569-990-1.50016-8  1
2011 Madenci E, Barut A, Guven I. Stress analysis of bolted composite joints under multiaxial loading Composite Joints and Connections. 186-207. DOI: 10.1016/B978-1-84569-990-1.50005-3  1
2011 Agwai A, Guven I, Madenci E. Predicting crack propagation with peridynamics: A comparative study International Journal of Fracture. 171: 65-78. DOI: 10.1007/S10704-011-9628-4  1
2010 Oterkus E, Agwai A, Guven I, Madenci E. Peridynamic theory for simulation of failure mechanisms in electronic packages Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 63-68. DOI: 10.1115/InterPACK2009-89107  1
2010 Oterkus E, Guven I, Madenci E. Fatigue failure model with peridynamic theory 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501273  1
2010 Agwai A, Guven I, Madenci E. Predicting crack initiation and propagation using XFEM, CZM and peridynamics: A comparative study Proceedings - Electronic Components and Technology Conference. 1178-1185. DOI: 10.1109/ECTC.2010.5490851  1
2010 Vallone W, Guven I, Madenci E. Wind tunnel tests to modify a drag-type vertical axis wind turbine Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 1
2010 Agwai A, Guven I, Madenci E. Comparison of XFEM, CZM and PD for predicting crack initiation and propagation Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 1
2010 Oterkus E, Guven I, Madenci E. Effect of core termination features on failure modes in sandwich panels by using peridynamic theory Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 1
2010 Celik E, Guven I, Madenci E. Mechanical characterization of nanowires using a customized atomic force microscope Society For Experimental Mechanics - Sem Annual Conference and Exposition On Experimental and Applied Mechanics 2010. 1: 223-232.  1
2009 Agwai A, Guven I, Madenci E. Damage prediction for electronic package drop test using finite element method and peridynamic theory Proceedings - Electronic Components and Technology Conference. 565-569. DOI: 10.1109/ECTC.2009.5074069  1
2009 Celik E, Oterkus E, Guven I, Madenci E. Mechanical characterization of ultra-thin films by combining AFM nanoindentation tests and peridynamic simulations Proceedings - Electronic Components and Technology Conference. 262-268. DOI: 10.1109/ECTC.2009.5074026  1
2008 Agwai A, Guven I, Madenci E. Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages Proceedings - Electronic Components and Technology Conference. 1614-1619. DOI: 10.1109/ECTC.2008.4550192  1
2008 Agwai A, Guven I, Madenci E. Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop Proceedings - Electronic Components and Technology Conference. 1048-1053. DOI: 10.1109/ECTC.2008.4550105  1
2007 Celik E, Guven I, Madenci E. Experimental and numerical characterization of non-Fickian moisture diffusion in electronic packages Proceedings - Electronic Components and Technology Conference. 1069-1073. DOI: 10.1109/Tadvp.2009.2016848  1
2007 Agwai A, Guven I, Madenci E, Kepler J. A combined experimental and numerical analysis of sandwich panels subjected to ballistic loads Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. 4: 3641-3649.  1
2006 Grover R, McCarthy B, Sarid D, Guven I. Mapping thermal conductivity using bimetallic atomic force microscopy probes Applied Physics Letters. 88. DOI: 10.1063/1.2210973  1
2006 Kay NR, Ghosh S, Guven I, Madenci E. A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages Materials Science and Engineering A. 421: 57-67. DOI: 10.1016/J.Msea.2005.10.013  1
2006 Madenci E, Guven I. The finite element method and applications in engineering using Ansys® The Finite Element Method and Applications in Engineering Using Ansys®. 1-686. DOI: 10.1007/978-0-387-28290-9  1
2006 Barut A, Guven I, Madenci E. A meshless grain element for micromechanical analysis with crystal plasticity International Journal For Numerical Methods in Engineering. 67: 17-65. DOI: 10.1002/Nme.1623  1
2006 Guven I, Celik E, Madenci E. Transient response of composite sandwich panels subjected to blast wave pressure Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. 7: 5052-5061.  1
2005 Das M, Guven I, Madenci E. Coupled BEM and FEM analysis of functionally graded underfill layers in electronic packages Proceedings - Electronic Components and Technology Conference. 1: 995-1005.  1
2004 Guven I, Kradinov V, Tor JL, Madenci E. Strain energy density criterion for reliability life prediction of solder joints in electronic packaging Journal of Electronic Packaging, Transactions of the Asme. 126: 398-405. DOI: 10.1115/1.1773855  1
2004 Kirk JJ, Tor JL, Guven I, Madenci E, Mertol A, Kutlu Z. Experimental validation of hygro/thermo-mechanical simulations for multi-material polymer structures Proceedings - Electronic Components and Technology Conference. 1: 883-889.  1
2004 Das M, Guven I, Madenci E. Three-dimensional analysis of sandwich panels with common defects Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. 5: 3519-3525.  1
2003 Guven I, Madenci E. Transient heat conduction analysis in a piecewise homogeneous domain by a coupled boundary and finite element method International Journal For Numerical Methods in Engineering. 56: 351-380. DOI: 10.1002/Nme.570  1
2003 Guven I, Madenci E. Thermoelastic stress field in a piece-wise homogeneous domain under non-uniform temperature using a coupled boundary and finite element method International Journal For Numerical Methods in Engineering. 56: 381-403. DOI: 10.1002/Nme.569  1
2003 Guven I, Kradinov V, Madenci E, Tor JL. Solder joint life prediction model based on the strain energy density criterion Proceedings - Electronic Components and Technology Conference. 214-220.  1
2003 Guven I, Madenci E. Stress analysis of a surface crack perpendicular to the interface of dissimilar materials by boundary element method Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. 7: 5396-5405.  1
2002 Guven I, Madenci E, Chan CL. Transient two-dimensional heat conduction analysis of electronic packages by coupled boundary and finite element methods Ieee Transactions On Components and Packaging Technologies. 25: 684-694. DOI: 10.1109/Tcapt.2002.808012  1
2001 Barut A, Guven I, Madenci E. Analysis of singular stress fields at junctions of multiple dissimilar materials under mechanical and thermal loading International Journal of Solids and Structures. 38: 9077-9109. DOI: 10.1016/S0020-7683(01)00206-2  1
2001 Guven I, Barut A, Madenci E. Sensitivity derivatives of dissimilar material junctions in electronic packages Proceedings - Electronic Components and Technology Conference. 911-918.  1
2000 Sburlati R, Madenci E, Guven I. Local buckling of a circular interface delamination between a layer and a substrate with finite thickness Journal of Applied Mechanics, Transactions Asme. 67: 590-596. DOI: 10.1115/1.1309547  1
2000 Anderson T, Guven I, Madenci E, Gustafsson G. The necessity of reexamining previous life prediction analyses of solder joints in electronic packages Ieee Transactions On Components and Packaging Technologies. 23: 516-520. DOI: 10.1109/6144.868851  1
2000 Gustafsson G, Guven I, Kradinov V, Madenci E. Finite element modeling of BGA packages for life prediction Proceedings - Electronic Components and Technology Conference. 1059-1063.  1
2000 Anderson T, Barut A, Guven I, Madenci E. Revisit of life-prediction model for solder joints Proceedings - Electronic Components and Technology Conference. 1064-1069.  1
1999 Anderson T, Guven I, Madenci E, Gustafsson G. Necessity of reexamining previous life prediction analyses of solder joints in electronic packages Proceedings - Electronic Components and Technology Conference. 1010-1014. DOI: 10.1109/6144.868851  1
1999 Guven I. Transient two-dimensional thermal analysis of electronic packages by the boundary element method Ieee Transactions On Advanced Packaging. 22: 476-486. DOI: 10.1109/6040.784502  1
1998 Guven I, Madenci E, Chan CL. Transient heat conduction analysis of electronic packages by coupled boundary and finite element methods Proceedings - Electronic Components and Technology Conference. 51-61.  1
1997 Guven I, Chan CL, Madenci E. Transient thermal analysis of electronic packages by the boundary element method Proceedings - Electronic Components and Technology Conference. 279-288.  1
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