Abigail Agwai, Ph.D. - Publications

Affiliations: 
2011 Mechanical Engineering University of Arizona, Tucson, AZ 
Area:
Mechanical Engineering

17 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2014 Oterkus S, Madenci E, Agwai A. Peridynamic thermal diffusion Journal of Computational Physics. 265: 71-96. DOI: 10.1016/J.Jcp.2014.01.027  1
2012 Agwai A, Guven I, Madenci E. Drop-shock failure prediction in electronic packages by using peridynamic theory Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 439-447. DOI: 10.1109/Tcpmt.2011.2175924  1
2012 Agwai A, Guven I, Madenci E. Failure prediction in fully coupled thermal and deformational fields with peridynamics Proceedings - Electronic Components and Technology Conference. 1223-1232. DOI: 10.1109/ECTC.2012.6248991  1
2012 Agwai A, Guven I, Madenci E. Fully coupled peridynamic thermomechanics 53rd Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 2012. DOI: 10.1016/j.jmps.2013.10.011  1
2012 Agwai A, Guven I, Madenci E. Fully coupled peridynamic thermomechanics 53rd Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 2012. DOI: 10.1016/J.Jmps.2013.10.011  1
2012 Agwai A, Guven I, Madenci E. Fully coupled peridynamic thermomechanics 53rd Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 2012 1
2011 Agwai A, Guven I, Madenci E. A new thermomechanical fracture analysis approach for 3D integration technology Proceedings - Electronic Components and Technology Conference. 740-745. DOI: 10.1109/ECTC.2011.5898595  1
2011 Agwai A, Guven I, Madenci E. Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory Microelectronics Reliability. 51: 2298-2305. DOI: 10.1016/J.Microrel.2011.05.011  1
2011 Agwai A, Guven I, Madenci E. Predicting crack propagation with peridynamics: A comparative study International Journal of Fracture. 171: 65-78. DOI: 10.1007/S10704-011-9628-4  1
2010 Oterkus E, Agwai A, Guven I, Madenci E. Peridynamic theory for simulation of failure mechanisms in electronic packages Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 63-68. DOI: 10.1115/InterPACK2009-89107  1
2010 Agwai A, Guven I, Madenci E. Predicting crack initiation and propagation using XFEM, CZM and peridynamics: A comparative study Proceedings - Electronic Components and Technology Conference. 1178-1185. DOI: 10.1109/ECTC.2010.5490851  1
2010 Agwai A, Guven I, Madenci E. Comparison of XFEM, CZM and PD for predicting crack initiation and propagation Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference 1
2009 Agwai A, Guven I, Madenci E. Damage prediction for electronic package drop test using finite element method and peridynamic theory Proceedings - Electronic Components and Technology Conference. 565-569. DOI: 10.1109/ECTC.2009.5074069  1
2009 Kilic B, Agwai A, Madenci E. Peridynamic theory for progressive damage prediction in center-cracked composite laminates Composite Structures. 90: 141-151. DOI: 10.1016/J.Compstruct.2009.02.015  1
2008 Agwai A, Guven I, Madenci E. Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages Proceedings - Electronic Components and Technology Conference. 1614-1619. DOI: 10.1109/ECTC.2008.4550192  1
2008 Agwai A, Guven I, Madenci E. Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop Proceedings - Electronic Components and Technology Conference. 1048-1053. DOI: 10.1109/ECTC.2008.4550105  1
2007 Agwai A, Guven I, Madenci E, Kepler J. A combined experimental and numerical analysis of sandwich panels subjected to ballistic loads Collection of Technical Papers - Aiaa/Asme/Asce/Ahs/Asc Structures, Structural Dynamics and Materials Conference. 4: 3641-3649.  1
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