Renchun Huang, Ph.D. - Publications
Affiliations: | 2003 | Iowa State University, Ames, IA, United States |
Area:
Chemical Engineering, Materials Science EngineeringYear | Citation | Score | |||
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2004 | Huang R, Hebert KR, Gessmann T, Lynn KG. Effect of Impurities on Interfacial Void Formation in Aluminum Journal of the Electrochemical Society. 151: B227-B232. DOI: 10.1149/1.1666148 | 0.488 | |||
2004 | Huang R, Hebert KR. The electrical double layer in a nanopore in a barrier surface film Journal of Electroanalytical Chemistry. 565: 103-114. DOI: 10.1016/J.Jelechem.2003.09.040 | 0.484 | |||
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