Year |
Citation |
Score |
2015 |
Peters BL, Rathsack B, Somervell M, Nakano T, Schmid G, De Pablo JJ. Graphoepitaxial assembly of cylinder forming block copolymers in cylindrical holes Journal of Polymer Science, Part B: Polymer Physics. 53: 430-441. DOI: 10.1002/Polb.23652 |
0.75 |
|
2014 |
Latypov A, Garner G, Preil M, Schmid G, Wang W, Xu J, Zou Y. Computational simulations and parametric studies for directed self-assembly process development and solution of the inverse directed self-assembly problem Japanese Journal of Applied Physics. 53: 06JC01. DOI: 10.7567/Jjap.53.06Jc01 |
0.343 |
|
2014 |
Farrell RA, Hosler ER, Schmid GM, Xu J, Preil ME, Rastogi V, Mohanty N, Kumar K, Cicoria MJ, Hetzer DR, Devilliers AJ. Manufacturability considerations for DSA Proceedings of Spie - the International Society For Optical Engineering. 9051. DOI: 10.1117/12.2048396 |
0.354 |
|
2014 |
Mohanty N, Ko A, Cole C, Rastogi V, Kumar K, Schmid G, Farrell R, Ryan T, Hosler E, Xu J, Preil M. Dual frequency mid-gap capacitively coupled plasma (m-CCP) for conventional and DSA patterning at 10nm node and beyond Proceedings of Spie - the International Society For Optical Engineering. 9054. DOI: 10.1117/12.2048320 |
0.307 |
|
2014 |
Latypov A, Coskun TH, Garner G, Preil M, Schmid G, Xu J, Zou Y. Simulations of spatial DSA morphology, DSA-aware assist features and block copolymer-homopolymer blends Proceedings of Spie. 9049: 904908. DOI: 10.1117/12.2046082 |
0.406 |
|
2013 |
Schmid G, Farrell R, Xu J, Park C, Preil M, Chakrapani V, Mohanty N, Ko A, Cicoria M, Hetzer D, Somervell M, Rathsack B. Fabrication of 28nm pitch Si fins with DSA lithography Proceedings of Spie - the International Society For Optical Engineering. 8680. DOI: 10.1117/12.2011607 |
0.76 |
|
2013 |
Latypov A, Preil M, Schmid G, Xu J, Yi H, Yoshimoto K, Zou Y. Exploration of the directed self-assembly based nano-fabrication design space using computational simulations Proceedings of Spie - the International Society For Optical Engineering. 8680. DOI: 10.1117/12.2011238 |
0.385 |
|
2010 |
Resnick DJ, Haase G, Singh L, Curran D, Schmid GM, Luo K, Brooks C, Selinidis K, Fretwell J, Sreenivasan SV. Inspection of imprint lithography patterns for semiconductor and patterned media Proceedings of Spie - the International Society For Optical Engineering. 7637. DOI: 10.1117/12.848391 |
0.314 |
|
2010 |
Ye Z, Fretwell J, Luo K, Ha S, Schmid G, Labrake D, Resnick DJ, Sreenivasan SV. Defect analysis for patterned media Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics. 28: C6M7-C6M11. DOI: 10.1116/1.3498752 |
0.352 |
|
2009 |
Brooks C, Schmid GM, Miller M, Johnson S, Khusnatdinov N, Labrake D, Resniek DJ, Sreenivasan SV. Step and flash imprint lithography for manufacturing patterned media Proceedings of Spie - the International Society For Optical Engineering. 7271. DOI: 10.1117/12.815016 |
0.335 |
|
2009 |
Schmid GM, Miller M, Brooks C, Khusnatdinov N, LaBrake D, Resnick DJ, Sreenivasan SV, Gauzner G, Lee K, Kuo D, Weller D, Yang X. Step and flash imprint lithography for manufacturing patterned media Journal of Vacuum Science & Technology B. 27: 573-580. DOI: 10.1116/1.3081981 |
0.334 |
|
2008 |
Schmid GM, Khusnatdinov N, Brooks CB, Labrake D, Thompson E, Resnick DJ. Minimizing linewidth roughness for 22-nm node patterning with step-and-flash imprint lithography Proceedings of Spie - the International Society For Optical Engineering. 6921. DOI: 10.1117/12.772956 |
0.345 |
|
2008 |
Selinidis K, Thompson E, Schmid G, Stacey N, Perez J, Maltabes J, Sreenivasan SV, Resnick DJ, Fujii A, Sakai Y, Sasaki S, Hayashi N. Full field imprint masks using variable shape beam pattern generators Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 26: 2410-2415. DOI: 10.1116/1.2976573 |
0.325 |
|
2008 |
Khusnatdinov N, Schmid GM, Brooks CB, LaBrake D, Resnick DJ, Hart MW, Gopalakrishnan K, Shenoy R, Jih R, Zhang Y, Sikorski E, Rothwell MB, Owens J, Ford A. Minimizing linewidth roughness in Step and Flash Imprint Lithography Microelectronic Engineering. 85: 856-860. DOI: 10.1016/J.Mee.2008.01.041 |
0.377 |
|
2007 |
Schmid GM, Thompson E, Stacey N, Resnick DJ, Olynick DL, Anderson EH. Toward 22 nm for unit process development using step and flash imprint lithography Proceedings of Spie - the International Society For Optical Engineering. 6517. DOI: 10.1117/12.718155 |
0.363 |
|
2007 |
Miller M, Schmid G, Doyle G, Thompson E, Resnick DJ. Template replication for full wafer imprint lithography Microelectronic Engineering. 84: 885-890. DOI: 10.1016/J.Mee.2007.01.060 |
0.352 |
|
2007 |
Schmid GM, Thompson E, Stacey N, Resnick DJ, Olynick DL, Anderson EH. Template fabrication for the 32 nm node and beyond Microelectronic Engineering. 84: 853-859. DOI: 10.1016/J.Mee.2007.01.038 |
0.355 |
|
2006 |
Schmid GM, Stewart MD, Wetzel J, Palmieri F, Hao J, Nishimura Y, Jen K, Kim EK, Resnick DJ, Liddle JA, Willson CG. Implementation of an imprint damascene process for interconnect fabrication Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 1283-1291. DOI: 10.1116/1.2197508 |
0.76 |
|
2005 |
Stewart MD, Wetzel JT, Schmid GM, Palmieri F, Thompson E, Kim EK, Wang D, Sotodeh K, Jen K, Johnson SC, Hao J, Dickey MD, Nishimura Y, Laine RM, Resnick DJ, et al. Direct imprinting of dielectric materials for dual damascene processing Progress in Biomedical Optics and Imaging - Proceedings of Spie. 5751: 210-218. DOI: 10.1117/12.599977 |
0.719 |
|
2005 |
Meiring JE, Michaelson TB, Jamieson AT, Schmid GM, Willson CG. Using mesoscale simulation to explore photoresist line edge roughness Progress in Biomedical Optics and Imaging - Proceedings of Spie. 5753: 350-360. DOI: 10.1117/12.599736 |
0.709 |
|
2005 |
Johnson S, Burns R, Kim EK, Dickey M, Schmid G, Meiring J, Burns S, Willson CG, Convey D, Wei Y, Fejes P, Gehoski K, Mancini D, Nordquist K, Dauksher WJ, et al. Effects of etch barrier densification on step and flash imprint lithography Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 2553-2556. DOI: 10.1116/1.2102971 |
0.73 |
|
2005 |
Tsiartas PC, Schmid GM, Johnson HF, Stewart MD, Willson CG. Quantifying acid generation efficiency for photoresist applications Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 23: 224-228. DOI: 10.1116/1.1851537 |
0.646 |
|
2005 |
Stewart MD, Wetzel J, Palmieri F, Hao J, Schmid GM, Jen K, Nishimura Y, Willson CG. Interconnect patterning in a single step with multi-level nanoimprint lithography 2005 Proceedings - 22nd International Vlsi Multilevel Interconnection Conference, Vmic 2005. 497-502. |
0.698 |
|
2004 |
Johnson S, Burns R, Kim EK, Schmid G, Dickey M, Meiring J, Burns S, Stacey N, Willson CG, Convey D, Wei Y, Fejes P, Gehoski K, Mancini D, Nordquist K, et al. Step and Flash Imprint Lithography modeling and process development Journal of Photopolymer Science and Technology. 17: 417-419. DOI: 10.2494/Photopolymer.17.417 |
0.745 |
|
2004 |
Schmid GM, Stewart MD, Burns SD, Willson CG. Mesoscale Monte Carlo Simulation of Photoresist Processing Journal of the Electrochemical Society. 151: G155-G161. DOI: 10.1149/1.1637359 |
0.787 |
|
2004 |
Burns RL, Johnson SC, Schmid GM, Kim EK, Dickey MD, Meiring J, Burns SD, Stacey NA, Willson CG, Convey D, Wei Y, Fejes P, Gehoski K, Mancini D, Nordquist K, et al. Mesoscale modeling for SFIL simulating polymerization kinetics and densification Proceedings of Spie - the International Society For Optical Engineering. 5374: 348-360. DOI: 10.1117/12.536216 |
0.743 |
|
2004 |
Schmid GM, Carpenter LE, Liddle JA. Nonaqueous development of silsesquioxane electron beam resist Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 3497-3502. DOI: 10.1116/1.1825014 |
0.355 |
|
2004 |
Jones RL, Hu T, Lin EK, Wu WL, Goldfarb DL, Angelopoulos M, Trinque BC, Schmid GM, Stewart MD, Willson CG. Formation of deprotected fuzzy blobs in chemically amplified resists Journal of Polymer Science, Part B: Polymer Physics. 42: 3063-3069. DOI: 10.1002/Polb.20168 |
0.751 |
|
2002 |
Schmid GM, Burns SD, Stewart MD, Willson CG. Mesoscale simulation of positive tone chemically amplified photoresists Proceedings of Spie - the International Society For Optical Engineering. 4690: 381-390. DOI: 10.1117/12.474237 |
0.675 |
|
2002 |
Stewart MD, Becker DJ, Stachowiak TB, Schmid GM, Michaelson TB, Tran HV, Willson CG. Acid mobility in chemically amplified photoresists Proceedings of Spie - the International Society For Optical Engineering. 4690: 943-951. DOI: 10.1117/12.474168 |
0.728 |
|
2002 |
Stewart MD, Tran HV, Schmid GM, Stachowiak TB, Becker DJ, Willson CG. Acid catalyst mobility in resist resins Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 2946-2952. DOI: 10.1116/1.1523027 |
0.733 |
|
2002 |
Schmid GM, Burns SD, Tsiartas PC, Willson CG. Electrostatic effects during dissolution of positive tone photoresists Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 2913-2919. DOI: 10.1116/1.1521735 |
0.688 |
|
2002 |
Burns SD, Schmid GM, Tsiartas PC, Willson CG, Flanagin L. Advancements to the critical ionization dissolution model Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 537-543. DOI: 10.1116/1.1450593 |
0.695 |
|
2002 |
Schmid GM, Stewart MD, Singh VK, Willson CG. Spatial distribution of reaction products in positive tone chemically amplified resists Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 20: 185-190. DOI: 10.1116/1.1431954 |
0.665 |
|
2001 |
Burns SD, Gardiner AB, Krukonis VJ, Wetmore PM, Lutkenhaus J, Schmid GM, Flanagin LW, Willson CG. Understanding nonlinear dissolution rates in photoresists Proceedings of Spie - the International Society For Optical Engineering. 4345: 37-49. DOI: 10.1117/12.436876 |
0.552 |
|
2001 |
Schmid GM, Smith MD, Mack CA, Singh VK, Burns SD, Grant Willson C. Understanding molecular level effects during post exposure processing Proceedings of Spie - the International Society For Optical Engineering. 4345: 1037-1047. DOI: 10.1117/12.436829 |
0.667 |
|
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