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Kumar Pallav, Ph.D. - Publications

Affiliations: 
2013 Mechanical Engineering Northwestern University, Evanston, IL 
Area:
Mechanical Engineering
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7 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2015 Pallav K, Saxena I, Ehmann KF. Laser-Induced Plasma Micromachining Process: Principles and Performance Journal of Micro and Nano-Manufacturing. 3. DOI: 10.1115/1.4030706  0.637
2014 Pallav K, Saxena I, Ehmann KF. Comparative Assessment of the Laser-Induced Plasma Micromachining and the Ultrashort Pulsed Laser Ablation Processes Journal of Micro and Nano-Manufacturing. 2. DOI: 10.1115/1.4027738  0.613
2014 Pallav K, Han P, Ramkumar J, Nagahanumaiah, Ehmann KF. Comparative assessment of the laser induced plasma micromachining and the micro-EDM processes Journal of Manufacturing Science and Engineering, Transactions of the Asme. 136. DOI: 10.1115/1.4025391  0.628
2012 Han P, Pallav K, Ehmann K. Force model for needle-tissue interaction Asme 2012 International Manufacturing Science and Engineering Conference Collocated With the 40th North American Manufacturing Research Conference and in Participation With the Int. Conf., Msec 2012. 51-58. DOI: 10.1115/MSEC2012-7257  0.531
2012 Han P, Che D, Pallav K, Ehmann K. Models of the cutting edge geometry of medical needles with applications to needle design International Journal of Mechanical Sciences. 65: 157-167. DOI: 10.1016/J.Ijmecsci.2012.09.014  0.568
2010 Pallav K, Ehmann KF. Laser induced plasma micro-machining Asme 2010 International Manufacturing Science and Engineering Conference, Msec 2010. 2: 363-369. DOI: 10.1115/MSEC2010-34242  0.593
2010 Pallav K, Ehmann KF. Feasibility of laser induced plasma micro-machining (LIP-MM) Ifip Advances in Information and Communication Technology. 315: 73-80. DOI: 10.1007/978-3-642-11598-1_8  0.63
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