Eun C. Oh, Ph.D. - Publications
Affiliations: | 2010 | North Carolina State University, Raleigh, NC |
Area:
Electronics and Electrical Engineering, Materials Science EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2009 | Davis WR, Oh EC, Sule AM, Franzon PD. Application exploration for 3-D integrated circuits: TCAM, FIFO, and FFT case studies Ieee Transactions On Very Large Scale Integration (Vlsi) Systems. 17: 496-506. DOI: 10.1109/Tvlsi.2008.2009352 | 0.674 | |||
2009 | Oh EC, Franzon PD. Technology impact analysis for 3D TCAM 2009 Ieee International Conference On 3d System Integration, 3dic 2009. DOI: 10.1109/3DIC.2009.5306563 | 0.696 | |||
2008 | Franzon PD, Davis WR, Steer MB, Lipa S, Oh EC, Thorolfsson T, Melamed S, Luniya S, Doxsee T, Berkeley S, Shani B, Obermiller K. Design and CAD for 3D integrated circuits Proceedings - Design Automation Conference. 668-673. DOI: 10.1109/DAC.2008.4555903 | 0.524 | |||
2007 | Oh EC, Franzon PD. TCAM core design in 3D IC for low matchline capacitance and low power Proceedings of Spie - the International Society For Optical Engineering. 6414. DOI: 10.1117/12.695915 | 0.667 | |||
2007 | Oh EC, Franzon PD. Design Considerations and Benefits of Three-Dimensional Ternary Content Addressable Memory Proceedings of the Ieee 2007 Custom Integrated Circuits Conference, Cicc 2007. 591-594. DOI: 10.1109/CICC.2007.4405801 | 0.688 | |||
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