Year |
Citation |
Score |
2020 |
Craton MT, Konstantinou X, Albrecht JD, Chahal P, Papapolymerou J. A Chip-First Microwave Package Using Multimaterial Aerosol Jet Printing Ieee Transactions On Microwave Theory and Techniques. 68: 3418-3427. DOI: 10.1109/Tmtt.2020.2992074 |
0.578 |
|
2020 |
Craton MT, Albrecht JD, Chahal P, Papapolymerou J. In Situ Nanocomposite Fabrication for RF Electronics Applications With Additive Manufacturing Ieee Transactions On Microwave Theory and Techniques. 68: 1646-1659. DOI: 10.1109/Tmtt.2020.2977030 |
0.583 |
|
2020 |
Gjokaj V, Papapolymerou J, Albrecht JD, Wright B, Chahal P. A Compact Receive Module in 3-D Printed Vivaldi Antenna Ieee Transactions On Components, Packaging and Manufacturing Technology. 10: 343-346. DOI: 10.1109/Tcpmt.2019.2961345 |
0.578 |
|
2020 |
Mondal S, Kumar D, Chahal P. A Continuous-Mode Single-Antenna Harmonic RFID Tag Ieee Microwave and Wireless Components Letters. 30: 441-444. DOI: 10.1109/Lmwc.2020.2975743 |
0.356 |
|
2020 |
Karuppuswami S, Mondal S, Kumar D, Chahal P. RFID Coupled Passive Digital Ammonia Sensor for Quality Control of Packaged Food Ieee Sensors Journal. 20: 4679-4687. DOI: 10.1109/Jsen.2020.2964676 |
0.347 |
|
2020 |
Kumar D, Mondal S, Kaur A, Deng Y, Chahal P. An RF backscatterer system for real-time multi-sensing applications Sensors and Actuators a: Physical. 303: 111685. DOI: 10.1016/J.Sna.2019.111685 |
0.351 |
|
2019 |
Chu Y, Qian C, Chahal P, Cao C. Printed Diodes: Materials Processing, Fabrication, and Applications. Advanced Science (Weinheim, Baden-Wurttemberg, Germany). 6: 1801653. PMID 30937260 DOI: 10.1002/Advs.201801653 |
0.371 |
|
2019 |
Oakley C, Albrecht JD, Papapolymerou J, Chahal P. Low-Loss Aerosol-Jet Printed Wideband Interconnects for Embedded Devices Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 2305-2313. DOI: 10.1109/Tcpmt.2019.2933792 |
0.612 |
|
2019 |
Gjokaj V, Papapolymerou J, Albrecht JD, Chahal P. Design and Fabrication of Additively Manufactured Hybrid Rigid-Flex RF Components Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 779-785. DOI: 10.1109/Tcpmt.2019.2900210 |
0.593 |
|
2019 |
Ghazali MIM, Karuppuswami S, Mondal S, Kaur A, Chahal P. Embedded Actives Using Additive Manufacturing for High-Density RF Circuits and Systems Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 1643-1651. DOI: 10.1109/Tcpmt.2019.2898979 |
0.436 |
|
2019 |
Byford JA, Chahal P. Demonstration of Substrate Integrated Ribbon Waveguide Using 3-D Printing Ieee Transactions On Components, Packaging and Manufacturing Technology. 9: 146-155. DOI: 10.1109/Tcpmt.2018.2885637 |
0.466 |
|
2019 |
Craton MT, Albrecht JD, Chahal P, Papapolymerou J. A Chip-First Approach to Millimeter-Wave Circuit Packaging Ieee Microwave and Wireless Components Letters. 29: 116-118. DOI: 10.1109/Lmwc.2018.2886737 |
0.577 |
|
2019 |
Mondal S, Karuppuswami S, Chahal P. ID Integrated Batteryless Wireless Digital pH Sensor Ieee Sensors Journal. 19: 12079-12086. DOI: 10.1109/Jsen.2019.2939926 |
0.3 |
|
2019 |
Mondal S, Kumar D, Chahal P. A Wireless Passive pH Sensor With Clutter Rejection Scheme Ieee Sensors Journal. 19: 3399-3407. DOI: 10.1109/Jsen.2019.2893869 |
0.307 |
|
2019 |
Mondal S, Wijewardena KP, Karuppuswami S, Kriti N, Kumar D, Chahal P. Blockchain Inspired RFID-Based Information Architecture for Food Supply Chain Ieee Internet of Things Journal. 6: 5803-5813. DOI: 10.1109/Jiot.2019.2907658 |
0.304 |
|
2019 |
Mohd Ghazali MI, Karuppuswami S, Kaur A, Chahal P. 3D Printed high functional density packaging compatible out-of-plane antennas Additive Manufacturing. 30: 100863. DOI: 10.1016/J.Addma.2019.100863 |
0.421 |
|
2018 |
Matta LL, Karuppuswami S, Chahal P, Alocilja EC. AuNP-RF sensor: An innovative application of RF technology for sensing pathogens electrically in liquids (SPEL) within the food supply chain. Biosensors & Bioelectronics. 111: 152-158. PMID 29677636 DOI: 10.1016/J.Bios.2018.04.010 |
0.301 |
|
2018 |
Karuppuswami S, Rothwell E, Chahal P, Havrilla M. A Triaxial Applicator for the Measurement of the Electromagnetic Properties of Materials. Sensors (Basel, Switzerland). 18. PMID 29382122 DOI: 10.3390/S18020383 |
0.383 |
|
2018 |
Frasch JL, Rothwell EJ, Chahal P, Doroshewitz J. Insertable waveguide verification standards for the electromagnetic characterization of materials Progress in Electromagnetics Research M. 66: 183-191. DOI: 10.2528/Pierm17111304 |
0.366 |
|
2018 |
Oakley C, Chahal P. Aerosol Jet Printed Quasi-Optical Terahertz Components Ieee Transactions On Terahertz Science and Technology. 8: 765-772. DOI: 10.1109/Tthz.2018.2873915 |
0.405 |
|
2018 |
Mukherjee S, Shi X, Udpa L, Udpa S, Deng Y, Chahal P. Design of a Split-Ring Resonator Sensor for Near-Field Microwave Imaging Ieee Sensors Journal. 18: 7066-7076. DOI: 10.1109/Jsen.2018.2852657 |
0.336 |
|
2018 |
Kaur A, Chahal P. RF Characterization of NiO and TiO2 Based Metal-Insulator-Metal (MIM) Diodes on Flexible Substrates Ieee Access. 6: 55653-55660. DOI: 10.1109/Access.2018.2871635 |
0.359 |
|
2018 |
Kumar D, Karuppuswami S, Deng Y, Chahal P. A wireless shortwave near-field probe for monitoring structural integrity of dielectric composites and polymers Ndt & E International. 96: 9-17. DOI: 10.1016/J.Ndteint.2018.02.005 |
0.339 |
|
2017 |
Oakley C, Chahal P, Papapolymerou J, Albrecht JD. Fabrication of X-band Oscillator on LCP Substrate Using Aerosol Printing International Symposium On Microelectronics. 2017: 000052-000055. DOI: 10.4071/ISOM-2017-TP24_106 |
0.458 |
|
2017 |
Craton M, Ghazali MIM, Wright B, Park KY, Chahal P, Papapolymerou J. 3D Printed Integrated Microfluidic Cooling for High Power RF Applications International Symposium On Microelectronics. 2017: 000675-000680. DOI: 10.4071/ISOM-2017-POSTER6_098 |
0.454 |
|
2017 |
Mukherjee S, Udpa L, Deng Y, Chahal P, Rothwell EJ. DESIGN OF A MICROWAVE TIME REVERSAL MIRROR FOR IMAGING APPLICATIONS Progress in Electromagnetics Research C. 77: 155-165. DOI: 10.2528/Pierc17051805 |
0.319 |
|
2017 |
Ghazali MIM, Karuppuswami S, Kaur A, Chahal P. 3-D Printed Air Substrates for the Design and Fabrication of RF Components Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 982-989. DOI: 10.1109/Tcpmt.2017.2686706 |
0.451 |
|
2017 |
Byford JA, Ghazali MIM, Karuppuswami S, Wright BL, Chahal P. Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization Ieee Transactions On Components, Packaging and Manufacturing Technology. 7: 463-471. DOI: 10.1109/Tcpmt.2017.2651645 |
0.451 |
|
2017 |
Kaur A, Hogan T, Chahal P. Selective Fabrication of SiC/Si Heterojunction Diodes by Local Laser Annealing Process for Microwave Circuit Applications Ieee Journal of the Electron Devices Society. 5: 291-298. DOI: 10.1109/Jeds.2017.2721916 |
0.361 |
|
2016 |
Rothwell EJ, Frasch JL, Ellison SM, Chahal P, Ouedraogo RO. ANALYSIS OF THE NICOLSON-ROSS-WEIR METHOD FOR CHARACTERIZING THE ELECTROMAGNETIC PROPERTIES OF ENGINEERED MATERIALS Progress in Electromagnetics Research. 157: 31-47. DOI: 10.2528/Pier16071706 |
0.309 |
|
2016 |
Kaur A, Yang X, Chahal P. CNTs and Graphene-Based Diodes for Microwave and Millimeter-Wave Circuits on Flexible Substrates Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2016.2586023 |
0.578 |
|
2016 |
Ghazali MIM, Park KY, Byford JA, Papapolymerou J, Chahal P. 3D printed metalized-polymer UWB high-gain Vivaldi antennas Ieee Mtt-S International Microwave Symposium Digest. 2016. DOI: 10.1109/MWSYM.2016.7540075 |
0.543 |
|
2015 |
Yang X, Chahal PP. On-Wafer Terahertz Ribbon Waveguides Using Polymer--Ceramic Nanocomposites Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2390611 |
0.578 |
|
2015 |
Myers JC, Chahal P, Rothwell E, Kempel L. A multilayered metamaterial-inspired miniaturized dynamically tunable antenna Ieee Transactions On Antennas and Propagation. 63: 1546-1553. DOI: 10.1109/Tap.2015.2398124 |
0.406 |
|
2015 |
Yuan M, Chahal P, Alocilja EC, Chakrabartty S. Wireless Biosensing Using Silver-Enhancement Based Self-Assembled Antennas in Passive Radio Frequency Identification (RFID) Tags Ieee Sensors Journal. 15: 4442-4450. DOI: 10.1109/Jsen.2015.2420852 |
0.399 |
|
2015 |
Myers JC, Kaur A, Byford JA, Chahal P. Investigation of modulation-capable silicon waveguides for efficient on-wafer terahertz interconnects Proceedings - Electronic Components and Technology Conference. 2015: 1010-1016. DOI: 10.1109/ECTC.2015.7159719 |
0.306 |
|
2015 |
Ghazali MIM, Gutierrez E, Myers JC, Kaur A, Wright B, Chahal P. Affordable 3D printed microwave antennas Proceedings - Electronic Components and Technology Conference. 2015: 240-246. DOI: 10.1109/ECTC.2015.7159599 |
0.316 |
|
2015 |
Byford JA, Park KY, Chahal P, Rothwell EJ. Frequency reconfigurable patch antenna array Electronics Letters. 51: 1628-1630. DOI: 10.1049/El.2015.1771 |
0.59 |
|
2014 |
Park KY, Chahal P. A near-field spoof plasmon THz probe using metallized 3-D printed plastic International Conference On Infrared, Millimeter, and Terahertz Waves, Irmmw-Thz. DOI: 10.1109/IRMMW-THz.2014.6956368 |
0.561 |
|
2014 |
Chahal P, Hejase JA, Shane S, Park KY, Kaur A, Byford J. Millimeter wave and terahertz dielectric probe microfluidic sensors International Conference On Infrared, Millimeter, and Terahertz Waves, Irmmw-Thz. DOI: 10.1109/IRMMW-THz.2014.6956055 |
0.724 |
|
2014 |
Yang X, Kaur A, Chahal P. Embedded diodes for microwave and millimeter wave circuits Proceedings - Electronic Components and Technology Conference. 2144-2150. DOI: 10.1109/ECTC.2014.6897599 |
0.315 |
|
2014 |
Park KY, Chahal P. Novel THz imaging array using high resistivity metasurfaces Proceedings - Electronic Components and Technology Conference. 775-781. DOI: 10.1109/ECTC.2014.6897373 |
0.58 |
|
2014 |
Hejase JA, Shane SS, Park KY, Chahal P. Nondestructive millimeter wave imaging and spectroscopy using dielectric focusing probes Aip Conference Proceedings. 1581: 1588-1593. DOI: 10.1063/1.4865013 |
0.726 |
|
2013 |
Hejase JA, Rothwell EJ, Chahal P. A multiple angle method for THz time-domain material characterization Ieee Transactions On Terahertz Science and Technology. 3: 656-665. DOI: 10.1109/Tthz.2013.2278460 |
0.723 |
|
2013 |
Hejase JA, Paladhi PR, Chahal PP. Corrections to “Terahertz Characterization of Dielectric Substrates for Component Design and Nondestructive Evaluation of Packages” [Nov 11 1685-1694] Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 357-357. DOI: 10.1109/Tcpmt.2013.2242657 |
0.689 |
|
2013 |
Yang X, Kaur A, Chahal P. Implementation of semiconducting nanowires for the design of THz detectors Proceedings - Electronic Components and Technology Conference. 2375-2380. DOI: 10.1109/ECTC.2013.6575917 |
0.333 |
|
2013 |
Park KY, Wiwatcharagoses N, Chahal P. Wafer-level integration of micro-lens for THz focal plane array application Proceedings - Electronic Components and Technology Conference. 1912-1919. DOI: 10.1109/ECTC.2013.6575839 |
0.599 |
|
2012 |
Wiwatcharagoses N, Park KY, Chahal P. Metamaterial-inspired miniaturized microwave sensing probes Proceedings - Electronic Components and Technology Conference. 2106-2111. DOI: 10.1109/ECTC.2012.6249132 |
0.599 |
|
2012 |
Yang X, Chahal P. Embedded actives for terahertz circuit applications: Imaging array Proceedings - Electronic Components and Technology Conference. 2082-2086. DOI: 10.1109/ECTC.2012.6249128 |
0.307 |
|
2012 |
Wiwatcharagoses N, Park KY, Chahal P. Metamaterial transmission line based reconfigurable X-band phase shifter design Proceedings - Electronic Components and Technology Conference. 2018-2024. DOI: 10.1109/ECTC.2012.6249117 |
0.564 |
|
2012 |
Park KY, Meierbachtol CS, Wiwatcharagoses N, Chahal P. Surface plasmon-assisted terahertz imaging array Proceedings - Electronic Components and Technology Conference. 1846-1851. DOI: 10.1109/ECTC.2012.6249089 |
0.302 |
|
2012 |
Chahal P, Myers J, Park KY, Meierbachtol C, Nair N. Planar surface plasmonic structures for terahertz circuits and sensors Proceedings - Electronic Components and Technology Conference. 930-935. DOI: 10.1109/ECTC.2012.6248947 |
0.331 |
|
2012 |
Park KY, Wiwatcharagoses N, Chahal P. A metamaterial-inspired high-Q X-band oscillator Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest). DOI: 10.1109/APS.2012.6349272 |
0.544 |
|
2012 |
Myers JC, Meierbachtol CS, Hejase JA, Chahal P. Plasmonic waveguide coupling at terahertz frequencies Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest). DOI: 10.1109/APS.2012.6349134 |
0.715 |
|
2012 |
Acosta Silveira LC, Hejase JA, Chahal P. A terahertz photonic crystal structure for sensing applications Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest). DOI: 10.1109/APS.2012.6348842 |
0.712 |
|
2012 |
Park KY, Wiwatcharagoses N, Chahal P. Miniaturization of microstrip band stop filter using a novel periodic structure Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest). DOI: 10.1109/APS.2012.6348840 |
0.534 |
|
2012 |
Wiwatcharagoses N, Park KY, Chahal P. A modified split ring resonator loaded miniaturized reconfigurable antenna Ieee Antennas and Propagation Society, Ap-S International Symposium (Digest). DOI: 10.1109/APS.2012.6348458 |
0.56 |
|
2012 |
Hejase JA, Rothwell EJ, Chahal P. A multiple angle material parameter extraction method for stacked layers of dielectrics using thz time domain spectroscopy Aip Conference Proceedings. 1430: 581-588. DOI: 10.1063/1.4716280 |
0.711 |
|
2011 |
Hejase JA, Rothwell EJ, Chahal P. Self-calibrating technique for terahertz time-domain material parameter extraction. Journal of the Optical Society of America. a, Optics, Image Science, and Vision. 28: 2561-7. PMID 22193269 DOI: 10.1364/Josaa.28.002561 |
0.719 |
|
2011 |
Hejase JA, Paladhi PR, Chahal PP. Terahertz characterization of dielectric substrates for component design and nondestructive evaluation of packages Ieee Transactions On Components, Packaging and Manufacturing Technology. 1: 1685-1694. DOI: 10.1109/Tcpmt.2011.2163632 |
0.77 |
|
2011 |
Yang X, Hejase J, Paladhi P, Chahal P. Planar terahertz circuits using thin dielectric waveguides Irmmw-Thz 2011 - 36th International Conference On Infrared, Millimeter, and Terahertz Waves. DOI: 10.1109/irmmw-THz.2011.6105221 |
0.737 |
|
2011 |
Park KY, Wiwatcharagoses N, Chahal P. Plastic injection micromachining of millimeter and sub-millimeter rectangular waveguide filters Irmmw-Thz 2011 - 36th International Conference On Infrared, Millimeter, and Terahertz Waves. DOI: 10.1109/irmmw-THz.2011.6105163 |
0.542 |
|
2011 |
Park KY, Hejase JA, Meierbachtol CS, Wiwatcharagoses N, Chahal P. Metamaterial-inspired absorbers for Terahertz packaging applications Proceedings - Electronic Components and Technology Conference. 2107-2113. DOI: 10.1109/ECTC.2011.5898809 |
0.745 |
|
2011 |
Wiwatcharagoses N, Park KY, Hejase JA, Williamson L, Chahal P. Microwave artificially structured periodic media microfluidic sensor Proceedings - Electronic Components and Technology Conference. 1889-1893. DOI: 10.1109/ECTC.2011.5898773 |
0.718 |
|
2011 |
Hejase JA, Myers J, Kempel L, Chahal P. Design study of electronically steerable half-width microstrip leaky wave antennas Proceedings - Electronic Components and Technology Conference. 1348-1353. DOI: 10.1109/ECTC.2011.5898687 |
0.737 |
|
2011 |
Hejase JA, Schulte B, Chahal P. Design and test of wide-band terahertz dielectric sub-wavelength focusing probes Proceedings - Electronic Components and Technology Conference. 1035-1040. DOI: 10.1109/ECTC.2011.5898637 |
0.737 |
|
2011 |
Wiwatcharagoses N, Park KY, Chahal P. A new metamaterial unit cell for compact microstrip circuit designs Proceedings - Electronic Components and Technology Conference. 169-172. DOI: 10.1109/ECTC.2011.5898509 |
0.554 |
|
2010 |
Hejase JA, Paladhi PR, Chahal P. Terahertz packaging: Study of substrates for novel component designs Proceedings - Electronic Components and Technology Conference. 744-751. DOI: 10.1109/ECTC.2010.5490763 |
0.746 |
|
2008 |
Pillans B, Morris F, Chahal P, Frazier G, Lee JB. Schottky barrier contact-based RF MEMS switch Journal of Microelectromechanical Systems. 17: 1439-1446. DOI: 10.1109/Jmems.2008.2007227 |
0.553 |
|
2007 |
Pillans B, Morris F, Chahal P, Frazier G, Lee JB. Schottky contact RF MEMS switch characterization Ieee Mtt-S International Microwave Symposium Digest. 379-382. DOI: 10.1109/MWSYM.2007.380450 |
0.483 |
|
2007 |
Bhattacharya SK, Varadarajan MG, Chahal P, Jha GC, Tummala RR. A novel electroless process for embedding a thin film resistor on the benzocyclobutene dielectric Journal of Electronic Materials. 36: 242-244. DOI: 10.1007/S11664-006-0058-4 |
0.537 |
|
2006 |
Bhattacharya S, Varadarajan M, Chahal P, Lee KJ, Bhattacharjee A, Tummala RR, Sitaraman S, Papapolymerou J, Tentzeris M, Laskar J. SOP embedded thin film resistors on high and low loss thick film dielectrics Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 1999-2004. |
0.632 |
|
2005 |
Chahal P, Morris F, Frazier G. Zero bias resonant tunnel Schottky contact diode for wide-band direct detection Ieee Electron Device Letters. 26: 894-896. DOI: 10.1109/Led.2005.859622 |
0.411 |
|
1998 |
Chahal P, Tummala RR, Allen MG, Swaminathan M. A novel integrated decoupling capacitor for MCM-L technology Ieee Transactions On Components Packaging and Manufacturing Technology Part B. 21: 184-192. DOI: 10.1109/96.673707 |
0.568 |
|
1997 |
Bhattacharya S, Tummala RR, Chahal P, White G. Integration of polymer/ceramic thin film capacitor on PWB Proceedings of the International Symposium and Exhibition On Advanced Packaging Materials Processes, Properties and Interfaces. 68-70. |
0.504 |
|
1997 |
Chahal P, Haridass A, Pham A, Tummala RR, Allen MG, Swaminathan M, Laskar J. Integration of thin film passive circuits using high/low dielectric constant materials Proceedings - Electronic Components and Technology Conference. 739-744. |
0.593 |
|
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