Year |
Citation |
Score |
2012 |
Zorman C, Eldridge A, Du J, Johnston M, Dubnisheva A, Manley S, Fissell W, Fleischman A, Roy S. Amorphous silicon carbide as a non-biofouling structural material for biomedical microdevices Materials Science Forum. 717: 537-540. DOI: 10.4028/Www.Scientific.Net/Msf.717-720.537 |
0.473 |
|
2009 |
Nath P, Strelnik J, Vasanji A, Moore LR, Williams PS, Zborowski M, Roy S, Fleischman AJ. Development of multistage magnetic deposition microscopy. Analytical Chemistry. 81: 43-9. PMID 19055419 DOI: 10.1021/Ac8010186 |
0.305 |
|
2007 |
Eldridge AN, Dubnisheva A, Fissell WH, Fleischman AJ, Roy S. Increased biocompatibility of common MEMS substrates with solution phase coupled poly(ethylene glycol) films Proceedings of the Asme Summer Bioengineering Conference 2007, Sbc 2007. 55-56. |
0.309 |
|
2003 |
Fleischman A, Modi R, Nair A, Talman J, Lockwood G, Roy S. Miniature high frequency focused ultrasonic transducers for minimally invasive imaging procedures Sensors and Actuators a: Physical. 103: 76-82. DOI: 10.1016/S0924-4247(02)00323-0 |
0.317 |
|
2000 |
Mehregany M, Zorman CA, Roy S, Fleischman AJ, Wu CH, Rajan N. Silicon carbide for microelectromechanical systems International Materials Reviews. 45: 85-108. DOI: 10.1179/095066000101528322 |
0.54 |
|
1998 |
Fleischman AJ, Roy S, Zorman CA, Mehregany M. Behaviour of Polycrystalline SiC and Si Surface-Micromachined Lateral Resonant Structures at Elevated Temperatures Materials Science Forum. 889-894. DOI: 10.4028/Www.Scientific.Net/Msf.264-268.889 |
0.558 |
|
1998 |
Wu CH, Fleischman AJ, Zorman CA, Mehregany M. Growth and characterization of SiC films on large-area Si wafers by APCVD - Temperature dependence Materials Science Forum. 264: 179-182. DOI: 10.4028/Www.Scientific.Net/Msf.264-268.179 |
0.659 |
|
1998 |
Zorman CA, Roy S, Wu C, Fleischman AJ, Mehregany M. Characterization of polycrystalline silicon carbide films grown by atmospheric pressure chemical vapor deposition on polycrystalline silicon Journal of Materials Research. 13: 406-412. DOI: 10.1557/Jmr.1998.0053 |
0.705 |
|
1998 |
Fleischman AJ, Zorman CA, Mehregany M. Etching of 3C-SiC using CHF3/O2 and CHF3/O2/He plasmas at 1.75 Torr Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 16: 536-539. DOI: 10.1116/1.589858 |
0.514 |
|
1998 |
Zorman CA, Roy S, Wu CH, Fleischman AJ, Mehregany M. Characterization of polycrystalline silicon carbide films grown by atmospheric pressure chemical vapor deposition on polycrystalline silicon Journal of Materials Research. 13: 406-412. |
0.684 |
|
1998 |
Fleischman AJ, Roy S, Zorman CA, Mehregany M. Behavior of polycrystalline SiC and Si surface-micromachined lateral resonant structures at elevated temperatures Materials Science Forum. 264: 889-892. |
0.524 |
|
1998 |
Fleischman AJ, Wei X, Zorman CA, Mehregany M. Surface micromachining of polycrystalline SiC deposited on SiO2 by APCVD Materials Science Forum. 264: 885-888. |
0.664 |
|
1998 |
Deanna RG, Fleischman AJ, Zorman CA, Mehregany M. Design, operation, and modeling of a vertical APCVD reactor for silicon carbide film growth Journal of Wide Bandgap Materials. 6: 280-295. |
0.583 |
|
1997 |
Roy S, Zorman CA, Wu CH, Fleischman AJ, Mehregany M. XRD and XTEM investigation of polycrystalline silicon carbide on polycrystalline silicon Materials Research Society Symposium - Proceedings. 444: 81-86. |
0.683 |
|
1996 |
Roy S, Zorman CA, Wu CH, Fleischman AJ, Mehregany M. Xrd and Xtem Investigation of Polycrystalline Silicon Carbide on Polycrystalline Silicon Mrs Proceedings. 444. DOI: 10.1557/proc-444-81 |
0.683 |
|
1996 |
Fleischman AJ, Roy S, Zorman CA, Mehregany M, Matus LG. Polycrystalline silicon carbide for surface micromachining Proceedings of the Ieee Micro Electro Mechanical Systems (Mems). 234-238. |
0.68 |
|
1995 |
Zorman CA, Fleischman AJ, Dewa AS, Mehregany M, Jacob C, Nishino S, Pirouz P. Epitaxial growth of 3C-SiC films on 4 in. diam (100) silicon wafers by atmospheric pressure chemical vapor deposition Journal of Applied Physics. 78: 5136-5138. DOI: 10.1063/1.359745 |
0.67 |
|
1991 |
Baratte H, Fleischman AJ, Scilla GJ, Jackson TN, Hovel HJ, Cardone F. Process Damage and Contamination Effects for Shallow Si Implanted GaAs Journal of the Electrochemical Society. 138: 219-222. DOI: 10.1149/1.2085543 |
0.324 |
|
1991 |
Murakami M, Lustig N, Price WH, Fleischman A. Thermally stable, low‐resistance NiInWNxohmic contacts ton‐type GaAs prepared by sputter deposition Applied Physics Letters. 59: 2409-2411. DOI: 10.1063/1.106031 |
0.304 |
|
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