Weiwei Deng, Ph.D. - Publications

Affiliations: 
2008 Yale University, New Haven, CT 
Area:
Mechanical Engineering

6 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Novak S, Lin PT, Li C, Borodinov N, Han Z, Monmeyran C, Patel N, Du Q, Malinowski M, Fathpour S, Lumdee C, Xu C, Kik PG, Deng W, Hu J, et al. Electrospray Deposition of Uniform Thickness Ge23Sb7S70 and As40S60 Chalcogenide Glass Films. Journal of Visualized Experiments : Jove. PMID 27583775 DOI: 10.3791/54379  0.8
2014 Duong B, Liu H, Li C, Deng W, Ma L, Su M. Printed multilayer microtaggants with phase change nanoparticles for enhanced labeling security. Acs Applied Materials & Interfaces. 6: 8909-12. PMID 24827166 DOI: 10.1021/am501668x  0.8
2011 Deng W, Gomez A. Electrospray cooling for microelectronics International Journal of Heat and Mass Transfer. 54: 2270-2275. DOI: 10.1016/j.ijheatmasstransfer.2011.02.038  0.8
2011 Gomez A, Deng W. Fundamentals of Cone-Jet Electrospray Aerosol Measurement: Principles, Techniques, and Applications: Third Edition. 435-448. DOI: 10.1002/9781118001684.ch20  0.8
2010 Deng W, Waits CM, Gomez A. Digital electrospray for controlled deposition. The Review of Scientific Instruments. 81: 035114. PMID 20370220 DOI: 10.1063/1.3340907  0.8
2010 Almería B, Deng W, Fahmy TM, Gomez A. Controlling the morphology of electrospray-generated PLGA microparticles for drug delivery. Journal of Colloid and Interface Science. 343: 125-33. PMID 20022337 DOI: 10.1016/j.jcis.2009.10.002  0.8
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