Uziel Landau - Publications

Affiliations: 
Chemical Engineering Case Western Reserve University, Cleveland Heights, OH, United States 
Area:
Chemical Engineering

57 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2016 Boehme L, Landau U. Rapid screening of plating additives for bottom-up metallization of nano-scale features Journal of Applied Electrochemistry. 46: 39-46. DOI: 10.1007/S10800-015-0873-5  1
2013 Joi A, Akolkar R, Uziel L. Pulse electrodeposition of copper-manganese alloy for application in interconnect metallization Journal of the Electrochemical Society. 160. DOI: 10.1149/2.024312Jes  0.76
2013 Joi A, Akolkar R, Landau U. Additives for bottom-up copper plating from an alkaline complexed electrolyte Journal of the Electrochemical Society. 160. DOI: 10.1149/2.001312Jes  1
2013 Joi A, Akolkar R, Landau U. Pulse plating of copper germanide Applied Physics Letters. 102. DOI: 10.1063/1.4801470  1
2011 Adolf J, Landau U. Predictive analytical fill model of interconnect metallization providing optimal additives concentrations Journal of the Electrochemical Society. 158. DOI: 10.1149/1.3593038  1
2010 Agarwal AS, Landau U, Payer JH. Modeling the current distribution in thin electrolyte films with applications to crevice corrosion Journal of the Electrochemical Society. 157. DOI: 10.1149/1.3250868  1
2009 Mendez J, Akolkar R, Landau U. Polyether suppressors enabling copper metallization of high aspect ratio interconnects Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3211849  1
2009 Akolkar R, Landau U. Mechanistic analysis of the bottom-up fill in copper interconnect metallization Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3156640  1
2009 Adolf JD, Akolkar R, Landau U. Novel high molecular weight levelers extending gap fill to smaller features Ecs Transactions. 16: 1-10. DOI: 10.1149/1.3115644  1
2009 Sporer RW, Landau U, Kuo HH, Wang YM. A novel process for etching modulated profiles Ecs Transactions. 16: 13-30. DOI: 10.1149/1.3114005  1
2008 Sporer RW, Landau U, Kuo HHH, Wang YM. A process for etching modulated profiles Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2956135  1
2008 Payer JH, Shan X, Agarwal AS, Landau U. Crevice corrosion damage evolution in high temperature brines Ecs Transactions. 11: 39-53. DOI: 10.1149/1.2939076  1
2008 Agarwal AS, Landau U, Payer JH. Modeling particulates effects on the cathode current capacity in crevice corrosion Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2890418  1
2008 Agarwal AS, Landau U, Payer JH. Current distribution on a cathode covered by a thin film electrolyte in crevice corrosion - An analytical model Ecs Transactions. 11: 11-31. DOI: 10.1149/1.2888472  1
2008 Mendez J, Akolkar R, Andryushchenko T, Landau U. A mechanistic model for copper electropolishing in phosphoric acid Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2801396  1
2008 Payer JH, Xi S, Agarwal AS, Landau U. Crevice corrosion processes in thin films of electrolyte Nace - International Corrosion Conference Series. 082661-0826618.  1
2007 Agarwal AS, Landau U, Shan X, Payer JH. Modeling the effects of crevice former, particulates, and the evolving surface profile in crevice corrosion Ecs Transactions. 3: 459-471. DOI: 10.1149/1.2789249  1
2006 Agarwal AS, Landau U, Xi S, Payer JH. Modeling the cathodic region in crevice corrosion under a thin electrolyte film including particulates Ecs Transactions. 1: 67-86. DOI: 10.1149/1.2214626  1
2006 Purushothaman BK, Landau U. Rapid charging of lithium-ion batteries using pulsed currents Journal of the Electrochemical Society. 153: A533-A542. DOI: 10.1149/1.2161580  1
2006 Kelly RG, Agarwal A, Cui F, Shan X, Landau U, Payer JH. Considerations of the role of the cathodic region in localized corrosion Proceedings of the 11th International High Level Radioactive Waste Management Conference, Ihlrwm. 2006: 486-492.  1
2005 Purushothaman BK, Morrison PW, Landau U. Reducing mass-transport limitations by application of special pulsed current modes Journal of the Electrochemical Society. 152: J33-J39. DOI: 10.1149/1.1861172  1
2004 Akolkar R, Landau U. A time-dependent transport-kinetics model for additive interactions in copper interconnect metallization Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1799431  1
2004 Adelung R, Ernst F, Zheng N, Landau U. In situ nanoscale observation and control of electron-beam-induced cluster formation Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 1797-1802. DOI: 10.1116/1.1767830  1
2004 Akolkar R, Landau U, Kuo H, Wang YM. Modeling of the current distribution in aluminum anodization Journal of Applied Electrochemistry. 34: 807-813. DOI: 10.1023/B:Jach.0000035611.87036.36  1
2004 Fulop T, Bekele C, Landau U, Angus J, Kash K. Electrodeposition of polycrystalline InSb from aqueous electrolytes Thin Solid Films. 449: 1-5. DOI: 10.1016/S0040-6090(03)01383-X  1
2004 Agarwal AS, Landau U, Zawodzinski T. Hydrogen peroxide formation during oxygen reduction on high surface area Pt/C catalysts Proceedings - Electrochemical Society. 515-536.  1
2004 Akolkar R, Landau U. Analysis of the 'bottom-up' fill during copper metallization of semiconductor interconnects Proceedings - Electrochemical Society. 117-131.  1
1999 Martin HB, Smith BA, Angus JC, Landau U, Anderson AB. Boron-doped diamond films for electrochemical applications Materials Research Society Symposium - Proceedings. 555: 217-226. DOI: 10.1557/Proc-555-217  1
1999 Martin HB, Argoitia A, Angus JC, Landau U. Voltammetry studies of single-crystal and polycrystalline diamond electrodes Journal of the Electrochemical Society. 146: 2959-2964. DOI: 10.1149/1.1392035  1
1999 Angus JC, Martin HB, Landau U, Evstefeeva YE, Miller B, Vinokur N. Conducting Diamond Electrodes: Applications in Electrochemistry New Diamond and Frontier Carbon Technology. 9: 175-187.  1
1998 Häfeli UO, Warburton MC, Landau U. Electrodeposition of radioactive rhenium onto stents to prevent restenosis. Biomaterials. 19: 925-33. PMID 9690834 DOI: 10.1016/S0142-9612(98)00003-9  1
1998 Angus JC, Landau U, Whitesides GM. Microelectromechanics [5] (multiple letters) Science. 281: 1145.  1
1996 Argoitia A, Martin HB, Rozak EJ, Landau U, Angus JC. Electrochemical studies of boron-doped diamond electrodes Materials Research Society Symposium - Proceedings. 416: 349-354. DOI: 10.1557/Proc-416-349  1
1996 Martin HB, Argoitia A, Landau U, Anderson AB, Angus JC. Hydrogen and oxygen evolution on boron-doped diamond electrodes Journal of the Electrochemical Society. 143. DOI: 10.1149/1.1836901  1
1996 Weng D, Wainright JS, Landau U, Savinell RF. Electro-osmotic drag coefficient of water and methanol in polymer electrolytes at elevated temperatures Journal of the Electrochemical Society. 143: 1260-1263. DOI: 10.1149/1.1836626  1
1995 Weng D, Landau U. Direct Electroplating on Nonconductors Journal of the Electrochemical Society. 142: 2598-2604. DOI: 10.1149/1.2050060  1
1994 Savinell R, Yeager E, Tryk D, Landau U, Wainright J, Weng D, Lux K, Litt M, Rogers C. Polymer electrolyte for operation at temperatures up to 200°C Journal of the Electrochemical Society. 141: L46-L48. DOI: 10.1149/1.2054875  1
1994 Savinell R, Tryk D, Landau U, Wainrighl J, Weng D, Lux K, Litt M, Rogers C, Yeager E. A Polymer Electrolyte for Operation at Temperatures up to 200°C Journal of the Electrochemical Society. 141: 146-148. DOI: 10.1149/1.2054875  1
1994 Shea LD, Feke DL, Landau U. Counteracting flow electrophoresis: A technique for separating biochemicals or charged macromolecules Biotechnology Progress. 10: 246-252. DOI: 10.1021/Bp00027A002  1
1992 Yang MC, Landau U, Angus JC. Electrodeposition of GaAs from Aqueous Electrolytes Journal of the Electrochemical Society. 139: 3480-3488. DOI: 10.1149/1.2069103  1
1991 Lanzi O, Landau U. Effect of Sinter Fracture and Ohmic Resistance on Capacity Retention in the Nickel Oxide Electrode Journal of the Electrochemical Society. 138: 2527-2538. DOI: 10.1149/1.2086012  1
1991 Zeller RL, Landau U. Electrodeposition of Ductile Ni-P Amorphous Alloys Using Periodic-Reverse Current Journal of the Electrochemical Society. 138: 1010-1017. DOI: 10.1149/1.2085707  1
1990 Lanzi O, Landau U. Terminal Effect at a Resistive Electrode under Tafel Kinetics Journal of the Electrochemical Society. 137: 1139-1143. DOI: 10.1149/1.2086616  1
1990 Zeller RL, Landau U. The Effect of Hydrogen on the Ductility of Electrodeposited Ni-P Amorphous Alloys Journal of the Electrochemical Society. 137: 1107-1112. DOI: 10.1149/1.2086611  1
1990 Roha D, Landau U. Mass Transport of Leveling Agents in Plating: Steady-State Model for Blocking Additives Journal of the Electrochemical Society. 137: 824-834. DOI: 10.1149/1.2086563  1
1990 Lanzi O, Landau U. Effect of Pore Structure on Current and Potential Distributions in a Porous Electrode Journal of the Electrochemical Society. 137: 585-593. DOI: 10.1149/1.2086511  1
1990 Menon MM, Landau U. Modeling of Cells with Multiple Electrode Reactions Thickness and Composition Variations in Alloy Plating Journal of the Electrochemical Society. 137: 445-452. DOI: 10.1149/1.2086460  1
1989 Lanzi OL, Reid JD, Landau U, Galasco RT. Effect of Local Kinetic Variations on Through-Hole Plating Journal of the Electrochemical Society. 136: 368-374. DOI: 10.1149/1.2096637  1
1988 Lanzi O, Landau U. Analysis of Mass Transport and Ohmic Limitations in Through-Hole Plating Journal of the Electrochemical Society. 135: 1922-1930. DOI: 10.1149/1.2096180  1
1988 Landau U, Weinberg NL, Gileadi E. THREE-ELECTRODE MEASUREMENTS IN INDUSTRIAL CELLS Journal of the Electrochemical Society. 135: 396-403. DOI: 10.1149/1.2095623  1
1987 Menon MM, Landau U. Modeling of Electrochemical Cells Including Diffusion, Migration, and Unsteady-State Effects Journal of the Electrochemical Society. 134: 2248-2253. DOI: 10.1149/1.2100860  1
1986 Angus JC, Landau U, Liao SH, Yang MC. Controlled Electroplating through Gelatin Films Journal of the Electrochemical Society. 133: 1152-1160. DOI: 10.1002/Chin.198640334  1
1983 Landau U, Shyu JH. ROUGHNESS EVOLUTION AND DENDRITIC GROWTH IN ZINC ELECTRODEPOSITION FROM HALIDE ELECTROLYTES Electric Power Research Institute (Report) Epri Em 1
1982 Oren Y, Landau U. Growth of zinc dendrites in acidic zinc chloride solutions Electrochimica Acta. 27: 739-748. DOI: 10.1016/0013-4686(82)85068-8  1
1982 Landau U, Cahan BD, Oren Y, Shyu JH, Chen CT, Selman JR, Lee J, Gopikanth ML, Symons PC. ZINC ELECTRODEPOSITION AND DENDRITIC GROWTH FROM ZINC HALIDE ELECTROLYTES Electric Power Research Institute (Report) Epri Em 1
1980 Gregory TD, Feke DL, Angus JC, Brosilow CB, Landau U. Electrolysis of liquid hydrogen sulphide Journal of Applied Electrochemistry. 10: 405-408. DOI: 10.1007/Bf00617216  1
1979 Shyu JH, Landau U. MORPHOLOGICAL STABILITY AND DENDRITE GROWTH IN ELECTRODEPOSITION Journal of Geophysical Research. 79: 427-429.  1
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