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Hong Shi, Ph.D. - Publications

Affiliations: 
2012 Chemical Engineering University of Utah, Salt Lake City, UT 
Area:
Chemical Engineering, General Engineering, Mechanical Engineering
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2 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2010 Shi H, Ring TA. CMP pad wear and polish-rate decay modeled by asperity population balance with fluid effect Microelectronic Engineering. 87: 2368-2375. DOI: 10.1016/J.Mee.2010.04.010  0.494
2010 Shi H, Ring TA. Analytical solution for polish-rate decay in chemical-mechanical polishing Journal of Engineering Mathematics. 68: 207-211. DOI: 10.1007/S10665-010-9369-9  0.489
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