Samuel Graham - Publications

Mechanical Engineering Georgia Institute of Technology, Atlanta, GA 
Mechanical Engineering, Materials Science Engineering, Electronics and Electrical Engineering

36 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Cheng Z, Mu F, You T, Xu W, Shi J, Liao ME, Wang Y, Huynh K, Suga T, Goorsky MS, Ou X, Graham S. Thermal Transport across Ion-cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3-SiC Interfaces. Acs Applied Materials & Interfaces. PMID 32909730 DOI: 10.1021/acsami.0c11672  0.4
2020 Koh YR, Cheng Z, Mamun A, Hoque MSB, Liu Z, Bai T, Hussain K, Liao ME, Li R, Gaskins JT, Giri A, Tomko J, Braun J, Gaevski M, Lee E, ... ... Graham S, et al. Bulk-like intrinsic phonon thermal conductivity of micrometer thick AlN films. Acs Applied Materials & Interfaces. PMID 32491824 DOI: 10.1021/acsami.0c03978  0.4
2019 Cheng Z, Bai T, Shi J, Feng T, Wang Y, Mecklenburg M, Li C, Hobart KD, Feygelson T, Tadjer MJ, Pate BB, Foley B, Yates L, Pantelides ST, Cola BA, ... ... Graham S, et al. Tunable Thermal Energy Transport across Diamond Membranes and Diamond-Si Interfaces by Nanoscale Graphoepitaxy. Acs Applied Materials & Interfaces. PMID 31042348 DOI: 10.1021/acsami.9b02234  0.4
2019 Gaskins JT, Kotsonis G, Giri A, Ju S, Rohskopf A, Wang Y, Bai T, Sachet E, Shelton CT, Liu Z, Cheng Z, Foley BM, Graham S, Luo T, Henry A, et al. Corrrection to Thermal Boundary Conductance Across Heteroepitaxial ZnO/GaN Interfaces: Assessment of the Phonon Gas Model. Nano Letters. PMID 30673236 DOI: 10.1021/acs.nanolett.9b00022  0.4
2018 Gaskins JT, Kotsonis G, Giri A, Ju S, Rohskopf A, Wang Y, Bai T, Sachet E, Shelton CT, Liu Z, Cheng Z, Foley B, Graham S, Luo T, Henry A, et al. Thermal boundary conductance across heteroepitaxial ZnO/GaN interfaces: Assessment of the phonon gas model. Nano Letters. PMID 30412411 DOI: 10.1021/acs.nanolett.8b02837  0.4
2018 Yates L, Anderson J, Gu X, Lee C, Bai T, Mecklenburg M, Aoki T, Goorsky MS, Kuball M, Piner EL, Graham S. Low Thermal Boundary Resistance Interfaces for GaN-on-Diamond Devices. Acs Applied Materials & Interfaces. PMID 29939717 DOI: 10.1021/acsami.8b07014  0.4
2018 Kim K, Luo H, Zhu T, Pierron ON, Graham S. Influence of Polymer Substrate Damage on the Time Dependent Cracking of SiNBarrier Films. Scientific Reports. 8: 4560. PMID 29540713 DOI: 10.1038/s41598-018-22105-2  0.32
2018 Cheng Z, Bougher T, Bai T, Wang SY, Li C, Yates L, Foley B, Goorsky MS, Cola BA, Faili F, Graham S. Probing Growth-Induced Anisotropic Thermal Transport in High-Quality CVD Diamond Membranes by Multi-frequency and Multi-spot-size Time-Domain Thermoreflectance. Acs Applied Materials & Interfaces. PMID 29328632 DOI: 10.1021/acsami.7b16812  0.4
2016 Kolesov VA, Fuentes-Hernandez C, Chou WF, Aizawa N, Larrain FA, Wang M, Perrotta A, Choi S, Graham S, Bazan GC, Nguyen TQ, Marder SR, Kippelen B. Solution-based electrical doping of semiconducting polymer films over a limited depth. Nature Materials. PMID 27918568 DOI: 10.1038/nmat4818  0.32
2016 Wang CY, Fuentes-Hernandez C, Yun M, Singh AK, Dindar A, Choi S, Graham S, Kippelen B. Organic field-effect transistors with a bilayer gate dielectric comprising an oxide nanolaminate grown by atomic layer deposition. Acs Applied Materials & Interfaces. PMID 27760296 DOI: 10.1021/acsami.6b10603  0.32
2016 Kim K, Luo H, Singh AK, Zhu T, Graham S, Pierron ON. Environmentally-Assisted Cracking In Silicon Nitride Barrier Films On PET Substrates. Acs Applied Materials & Interfaces. PMID 27643813 DOI: 10.1021/acsami.6b06417  0.4
2016 Kim H, Singh AK, Wang CY, Fuentes-Hernandez C, Kippelen B, Graham S. Experimental investigation of defect-assisted and intrinsic water vapor permeation through ultrabarrier films. The Review of Scientific Instruments. 87: 033902. PMID 27036786 DOI: 10.1063/1.4942510  0.4
2016 Kelly LL, Racke DA, Schulz P, Li H, Winget P, Kim H, Ndione P, Sigdel AK, Brédas JL, Berry JJ, Graham S, Monti OL. Spectroscopy and control of near-surface defects in conductive thin film ZnO. Journal of Physics. Condensed Matter : An Institute of Physics Journal. 28: 094007. PMID 26871256 DOI: 10.1088/0953-8984/28/9/094007  0.32
2015 Kelly LL, Racke DA, Kim H, Ndione P, Sigdel AK, Berry JJ, Graham S, Nordlund D, Monti OL. Hybridization-Induced Carrier Localization at the C60 /ZnO Interface. Advanced Materials (Deerfield Beach, Fla.). PMID 26596518 DOI: 10.1002/adma.201503694  0.4
2015 Matz DL, Sojoudi H, Graham S, Pemberton JE. Signature Vibrational Bands for Defects in CVD Single-Layer Graphene by Surface-Enhanced Raman Spectroscopy. The Journal of Physical Chemistry Letters. 6: 964-9. PMID 26262853 DOI: 10.1021/jz5027272  0.4
2015 Beechem T, Yates L, Graham S. Invited Review Article: Error and uncertainty in Raman thermal conductivity measurements. The Review of Scientific Instruments. 86: 041101. PMID 25933834 DOI: 10.1063/1.4918623  0.4
2015 Tarasov A, Zhang S, Tsai MY, Campbell PM, Graham S, Barlow S, Marder SR, Vogel EM. Controlled doping of large-area trilayer MoS2 with molecular reductants and oxidants. Advanced Materials (Deerfield Beach, Fla.). 27: 1175-81. PMID 25580926 DOI: 10.1002/adma.201404578  0.4
2015 Matz DL, Sojoudi H, Graham S, Pemberton JE. Signature vibrational bands for defects in CVD single-layer graphene by surface-enhanced Raman spectroscopy Journal of Physical Chemistry Letters. 6: 964-969. DOI: 10.1021/jz5027272  0.4
2014 Sadeghi-Tohidi F, Samet D, Graham S, Pierron ON. Comparison of the cohesive and delamination fatigue properties of atomic-layer-deposited alumina and titania ultrathin protective coatings deposited at 200 °C. Science and Technology of Advanced Materials. 15: 015003. PMID 27877645 DOI: 10.1088/1468-6996/15/1/015003  0.32
2014 Hwang do K, Fuentes-Hernandez C, Fenoll M, Yun M, Park J, Shim JW, Knauer KA, Dindar A, Kim H, Kim Y, Kim J, Cheun H, Payne MM, Graham S, Im S, et al. Systematic reliability study of top-gate p- and n-channel organic field-effect transistors. Acs Applied Materials & Interfaces. 6: 3378-86. PMID 24524341 DOI: 10.1021/am405424k  0.4
2013 Abadi PP, Maschmann MR, Baur JW, Graham S, Cola BA. Deformation response of conformally coated carbon nanotube forest. Nanotechnology. 24: 475707. PMID 24192522 DOI: 10.1088/0957-4484/24/47/475707  0.4
2013 Taphouse JH, Bougher TL, Singh V, Abadi PP, Graham S, Cola BA. Carbon nanotube thermal interfaces enhanced with sprayed on nanoscale polymer coatings. Nanotechnology. 24: 105401. PMID 23425973 DOI: 10.1088/0957-4484/24/10/105401  0.4
2013 Bulusu A, Paniagua SA, MacLeod BA, Sigdel AK, Berry JJ, Olson DC, Marder SR, Graham S. Efficient modification of metal oxide surfaces with phosphonic acids by spray coating. Langmuir : the Acs Journal of Surfaces and Colloids. 29: 3935-42. PMID 23421597 DOI: 10.1021/la303354t  0.4
2013 Heller E, Choi S, Dorsey D, Vetury R, Graham S. Electrical and structural dependence of operating temperature of AlGaN/GaN HEMTs Microelectronics Reliability. 53: 872-877. DOI: 10.1016/j.microrel.2013.03.004  0.4
2012 Kim Y, Bulusu A, Giordano AJ, Marder SR, Dauskardt R, Graham S. Experimental study of interfacial fracture toughness in a SiN(x)/PMMA barrier film. Acs Applied Materials & Interfaces. 4: 6711-9. PMID 23127918 DOI: 10.1021/am301880y  0.4
2012 Sojoudi H, Baltazar J, Tolbert LM, Henderson CL, Graham S. Creating graphene p-n junctions using self-assembled monolayers. Acs Applied Materials & Interfaces. 4: 4781-6. PMID 22909428 DOI: 10.1021/am301138v  0.4
2012 Abadi PP, Hutchens SB, Greer JR, Cola BA, Graham S. Effects of morphology on the micro-compression response of carbon nanotube forests. Nanoscale. 4: 3373-80. PMID 22543679 DOI: 10.1039/c2nr30474k  0.4
2012 Zhou Y, Fuentes-Hernandez C, Shim J, Meyer J, Giordano AJ, Li H, Winget P, Papadopoulos T, Cheun H, Kim J, Fenoll M, Dindar A, Haske W, Najafabadi E, Khan TM, ... ... Graham S, et al. A universal method to produce low-work function electrodes for organic electronics. Science (New York, N.Y.). 336: 327-32. PMID 22517855 DOI: 10.1126/science.1218829  0.4
2012 Pathak S, Lim EJ, Abadi PP, Graham S, Cola BA, Greer JR. Higher recovery and better energy dissipation at faster strain rates in carbon nanotube bundles: an in-situ study. Acs Nano. 6: 2189-97. PMID 22332591 DOI: 10.1021/nn300376j  0.4
2012 Wasniewski JR, Altman DH, Hodson SL, Fisher TS, Bulusu A, Graham S, Cola BA. Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4005909  0.4
2011 Park B, Kim YJ, Graham S, Reichmanis E. Change in electronic states in the accumulation layer at interfaces in a poly(3-hexylthiophene) field-effect transistor and the impact of encapsulation Acs Applied Materials and Interfaces. 3: 3545-3551. PMID 21863841 DOI: 10.1021/am200760m  0.4
2010 Cross R, Cola BA, Fisher T, Xu X, Gall K, Graham S. A metallization and bonding approach for high performance carbon nanotube thermal interface materials. Nanotechnology. 21: 445705. PMID 20935353 DOI: 10.1088/0957-4484/21/44/445705  0.4
2010 Jackson RK, Munro A, Nebesny K, Armstrong N, Graham S. Evaluation of transparent carbon nanotube networks of homogeneous electronic type. Acs Nano. 4: 1377-84. PMID 20201542 DOI: 10.1021/nn9010076  0.4
2008 Eliason MT, Sunden EO, Cannon AH, Graham S, García AJ, King WP. Polymer cell culture substrates with micropatterned carbon nanotubes. Journal of Biomedical Materials Research. Part A. 86: 996-1001. PMID 18067160 DOI: 10.1002/jbm.a.31697  0.4
2007 Beechem T, Graham S, Kearney SP, Phinney LM, Serrano JR. Invited Article: Simultaneous mapping of temperature and stress in microdevices using micro-Raman spectroscopy. The Review of Scientific Instruments. 78: 061301. PMID 17614598 DOI: 10.1063/1.2738946  0.4
2002 Clayton JD, Schroeter BM, McDowell DL, Graham S. Distributions of stretch and rotation in polycrystalline OFHC Cu Journal of Engineering Materials and Technology, Transactions of the Asme. 124: 302-312. DOI: 10.1115/1.1479354  0.4
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