☰

Rohan Akolkar, Ph.D. - Publications

Affiliations: 
2005 Case Western Reserve University, Cleveland Heights, OH, United States 
Area:
Chemical Engineering
Tree Info Similar researchers PubMed Report error

38 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2020 Vukmirovic MB, Adzic RR, Akolkar R. Copper Electrodeposition from Deep Eutectic Solvents-Voltammetric Studies Providing Insights into the Role of Substrate: Platinum vs Glassy Carbon. The Journal of Physical Chemistry. B. PMID 32497430 DOI: 10.1021/Acs.Jpcb.0C02735  0.412
2020 Shaheen NA, Mahesh I, Vukmirovic MB, Akolkar R. Hysteresis effects and roughness suppression efficacy of polyethylenimine additive in Cu electrodeposition in ethaline Electrochemistry Communications. 115: 106721. DOI: 10.1016/J.Elecom.2020.106721  0.431
2019 Shen D, Vukmirovic MB, Akolkar R. Understanding the Role of Complexation in the Charge-Transfer Kinetics of the Cu2+ + e ↔ Cu1+ Redox Reaction in Ethaline Deep Eutectic Solvent Journal of the Electrochemical Society. 166: E526-E532. DOI: 10.1149/2.1211915Jes  0.341
2019 Liu X, Bolton O, Akolkar R. Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition Journal of the Electrochemical Society. 166. DOI: 10.1149/2.0411913Jes  0.304
2019 Joi A, Venkatraman K, Tso K, Dictus D, Dordi Y, Wu P, Pao C, Akolkar R. Editors' Choice—Interface Engineering Strategy Utilizing Electrochemical ALD of Cu-Zn for Enabling Metallization of Sub-10 nm Semiconductor Device Nodes Ecs Journal of Solid State Science and Technology. 8: 516. DOI: 10.1149/2.0181909Jss  0.31
2019 Venkatraman K, Gusley R, Lesak A, Akolkar R. Electrochemistry-enabled atomic layer deposition of copper: Investigation of the deposit growth rate and roughness Journal of Vacuum Science and Technology. 37: 20901. DOI: 10.1116/1.5079560  0.413
2018 Shen D, Steinberg K, Akolkar R. Avoiding Pitfalls in the Determination of Reliable Electrochemical Kinetics Parameters for the Cu2+ → Cu1+ Reduction Reaction in Deep Eutectic Solvents Journal of the Electrochemical Society. 165. DOI: 10.1149/2.1011814Jes  0.357
2018 Gong Y, Venkatraman K, Akolkar R. Communication—Electrochemical Atomic Layer Etching of Copper Journal of the Electrochemical Society. 165. DOI: 10.1149/2.0901807Jes  0.389
2018 Maraschky A, Akolkar R. Mechanism Explaining the Onset Time of Dendritic Lithium Electrodeposition via Considerations of the Li+Transport within the Solid Electrolyte Interphase Journal of the Electrochemical Society. 165. DOI: 10.1149/2.0601814Jes  0.321
2018 Venkatraman K, Joi A, Dordi Y, Akolkar R. Electroless atomic layer deposition of copper Electrochemistry Communications. 91: 45-48. DOI: 10.1016/J.Elecom.2018.05.007  0.448
2017 Liu X, Richtering W, Akolkar R. Investigation of the Kinetics and Mass Transport Aspects of Hydrogen Evolution during Electroless Deposition of Nickel–Phosphorus Journal of the Electrochemical Society. 164. DOI: 10.1149/2.1521707Jes  0.31
2017 Venkatraman K, Dordi Y, Akolkar R. Electrochemical Atomic Layer Deposition of Cobalt Enabled by the Surface-Limited Redox Replacement of Underpotentially Deposited Zinc Journal of the Electrochemical Society. 164. DOI: 10.1149/2.0091704Jes  0.357
2016 Yu L, Akolkar R. Communication-underpotential deposition of lead for investigating the early stages of electroless copper deposition on ruthenium Journal of the Electrochemical Society. 163: D247-D249. DOI: 10.1149/2.0701606Jes  0.412
2016 Yu L, Vashaei Z, Ernst F, Akolkar R. Electroless deposition of copper-manganese for applications in semiconductor interconnect metallization Journal of the Electrochemical Society. 163: D374-D378. DOI: 10.1149/2.0631608Jes  0.431
2016 Banik SJ, Rao KK, Akolkar R. Determination of the diffusion-adsorption properties of polymeric electrolyte additives using an additive injection method implemented on a rotating disc electrode Journal of the Electrochemical Society. 163: E241-E247. DOI: 10.1149/2.0231609Jes  0.34
2016 Venkatraman K, Gusley R, Yu L, Dordi Y, Akolkar R. Electrochemical Atomic Layer Deposition of Copper: A Lead-Free Process Mediated by Surface-Limited Redox Replacement of Underpotentially Deposited Zinc Journal of the Electrochemical Society. 163. DOI: 10.1149/2.0021612Jes  0.404
2016 Zhao M, Yu L, Akolkar R, Anderson AB. Mechanism of Electroless Copper Deposition from [CuIIEDTA]2– Complexes Using Aldehyde-Based Reductants Journal of Physical Chemistry C. 120: 24789-24793. DOI: 10.1021/Acs.Jpcc.6B07546  0.37
2016 Rao KK, Ferguson M, Murphy K, Zhao J, Lacks D, Akolkar R. Electrochemical characterization of micro-cracks in polyurethane resin films deposited on metallic surfaces Journal of Applied Electrochemistry. 46: 1237-1243. DOI: 10.1007/S10800-016-1005-6  0.334
2015 Miller A, Yu L, Blickensderfer J, Akolkar R. Electrochemical copper metallization of glass substrates mediated by solution-phase deposition of adhesion-promoting layers Journal of the Electrochemical Society. 162: D630-D634. DOI: 10.1149/2.1071514Jes  0.418
2015 Banik SJ, Akolkar R. Suppressing Dendritic Growth during Alkaline Zinc Electrodeposition using Polyethylenimine Additive Electrochimica Acta. 179: 475-481. DOI: 10.1016/J.Electacta.2014.12.100  0.38
2014 Blickensderfer J, Altemare P, Thiel KO, Schreier HJ, Akolkar R. Direct electroless plating of iron-boron on copper Journal of the Electrochemical Society. 161. DOI: 10.1149/2.0471410Jes  0.404
2014 Akolkar R. Modeling dendrite growth during lithium electrodeposition at sub-ambient temperature Journal of Power Sources. 246: 84-89. DOI: 10.1016/J.Jpowsour.2013.07.056  0.355
2013 Banik SJ, Akolkar R. Suppressing dendrite growth during zinc electrodeposition by PEG-200 additive Journal of the Electrochemical Society. 160. DOI: 10.1149/2.040311Jes  0.39
2013 Joi A, Akolkar R, Uziel L. Pulse electrodeposition of copper-manganese alloy for application in interconnect metallization Journal of the Electrochemical Society. 160. DOI: 10.1149/2.024312Jes  0.406
2013 Akolkar R. Characterizing transport limitations during copper electrodeposition of high aspect ratio through-silicon vias Ecs Electrochemistry Letters. 2. DOI: 10.1149/2.007302Eel  0.367
2013 Yu L, Guo L, Preisser R, Akolkar R. Autocatalysis during electroless copper deposition using glyoxylic acid as reducing agent Journal of the Electrochemical Society. 160. DOI: 10.1149/2.002312Jes  0.417
2013 Joi A, Akolkar R, Landau U. Additives for bottom-up copper plating from an alkaline complexed electrolyte Journal of the Electrochemical Society. 160. DOI: 10.1149/2.001312Jes  0.607
2013 Joi A, Akolkar R, Landau U. Pulse plating of copper germanide Applied Physics Letters. 102. DOI: 10.1063/1.4801470  0.62
2013 Akolkar R. Mathematical model of the dendritic growth during lithium electrodeposition Journal of Power Sources. 232: 23-28. DOI: 10.1016/J.Jpowsour.2013.01.014  0.353
2012 Akolkar R. Analytical model for the current distribution during copper electrodeposition on resistivewafers under tafel kinetics Ecs Electrochemistry Letters. 1. DOI: 10.1149/2.011206Eel  0.382
2009 Mendez J, Akolkar R, Landau U. Polyether suppressors enabling copper metallization of high aspect ratio interconnects Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3211849  0.608
2009 Akolkar R, Landau U. Mechanistic analysis of the bottom-up fill in copper interconnect metallization Journal of the Electrochemical Society. 156. DOI: 10.1149/1.3156640  0.659
2009 Adolf JD, Akolkar R, Landau U. Novel high molecular weight levelers extending gap fill to smaller features Ecs Transactions. 16: 1-10. DOI: 10.1149/1.3115644  0.557
2008 Mendez J, Akolkar R, Andryushchenko T, Landau U. A mechanistic model for copper electropolishing in phosphoric acid Journal of the Electrochemical Society. 155. DOI: 10.1149/1.2801396  0.625
2007 Akolkar R, Wang YM, Kuo HH. Kinetics of the electrolytic coloring process on anodized aluminum Journal of Applied Electrochemistry. 37: 291-296. DOI: 10.1007/S10800-006-9258-0  0.342
2004 Akolkar R, Landau U. A time-dependent transport-kinetics model for additive interactions in copper interconnect metallization Journal of the Electrochemical Society. 151. DOI: 10.1149/1.1799431  0.618
2004 Akolkar R, Landau U, Kuo H, Wang YM. Modeling of the current distribution in aluminum anodization Journal of Applied Electrochemistry. 34: 807-813. DOI: 10.1023/B:Jach.0000035611.87036.36  0.622
2004 Akolkar R, Landau U. Analysis of the 'bottom-up' fill during copper metallization of semiconductor interconnects Proceedings - Electrochemical Society. 117-131.  0.621
Show low-probability matches.