Vinay Sriram, Ph.D. - Publications
Affiliations: | 2008 | University of California, Los Angeles, Los Angeles, CA |
Area:
Materials Science EngineeringYear | Citation | Score | |||
---|---|---|---|---|---|
2010 | Sriram V, Yang JM, Ye J, Minor AM. In-situ metrology and testing of nanotwinned copper pillars for potential air gap applications Microelectronic Engineering. 87: 2046-2049. DOI: 10.1016/J.Mee.2010.04.019 | 0.413 | |||
2009 | Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C. In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper Journal of Applied Physics. 105. DOI: 10.1063/1.3068191 | 0.307 | |||
2009 | Tong M, Sriram V, Minor A, Yang JM. In situ and ex situ nanomechanical analysis of reactive nanolayer solder joints Advanced Engineering Materials. 11: 645-649. DOI: 10.1002/Adem.200900102 | 0.391 | |||
2008 | Xu D, Sriram V, Ozolins V, Yang JM, Tu KN, Stafford GR, Beauchamp C, Zienert I, Geisler H, Hofmann P, Zschech E. Nanotwin formation and its physical properties and effect on reliability of copper interconnects Microelectronic Engineering. 85: 2155-2158. DOI: 10.1016/J.Mee.2008.04.035 | 0.346 | |||
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