| Year |
Citation |
Score |
| 2007 |
Plawsky JL, Achanta R, Cho W, Rodriguez O, Saxena R, Gill WN. Mechanical and Transport Properties of Low-k Dielectrics Dielectric Films For Advanced Microelectronics. 137-197. DOI: 10.1002/9780470017944.ch4 |
0.674 |
|
| 2006 |
Ojha M, Gill WN, Plawsky JL, Cho W. Fabrication of ultrathin (∼100 nm), low-index nanoporous silica films for photonic devices: Role of substrate adhesion on the film thickness Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 24: 1109-1116. DOI: 10.1116/1.2187999 |
0.713 |
|
| 2005 |
Xi JQ, Ojha M, Cho W, Plawsky JL, Gill WN, Gessmann T, Schubert EF. Omnidirectional reflector using nanoporous SiO2 as a low-refractive-index material. Optics Letters. 30: 1518-20. PMID 16007793 DOI: 10.1364/Ol.30.001518 |
0.68 |
|
| 2005 |
Saxena R, Cho W, Rodriguez O, Gill WN, Plawsky JL, Tsui T, Grunow S. Effect of Dielectric Pore Size Distribution on Interfacial Adhesion of the Tantalum-Porous Dielectric Interface Mrs Proceedings. 863. DOI: 10.1557/PROC-863-B6.6 |
0.303 |
|
| 2005 |
Xi JQ, Ojha M, Cho W, Plawsky JL, Gill WN, Gessmann T, Schubert EF. Omnidirectional reflector using nanoporous SiO2 as a low-refractive-index material Optics Letters. 30: 1518-1520. DOI: 10.1364/OL.30.001518 |
0.665 |
|
| 2005 |
Cho W, Saxena R, Rodriguez O, Ojha M, Achanta R, Plawsky JL, Gill WN. Polymer penetration and pore sealing in nanoporous silica by CHF 3 plasma exposure Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1901664 |
0.734 |
|
| 2005 |
Cho W, Rodriguez O, Saxena R, Ojha M, Achanta R, Plawsky JL, Gill WN. A model for the etching of nanoporous silica in C4F8 plasmas based on pore geometry and porosity effects Journal of the Electrochemical Society. 152. DOI: 10.1149/1.1850375 |
0.736 |
|
| 2005 |
Rodriguez OR, Cho W, Saxena R, Plawsky JL, Gill WN. Mechanism of Cu diffusion in porous low- κ dielectrics Journal of Applied Physics. 98. DOI: 10.1063/1.1954869 |
0.67 |
|
| 2005 |
Rodriguez O, Saxena R, Cho W, Plawsky JL, Gill WN. Diffusion of Copper in Nanoporous Dielectric Films Industrial & Engineering Chemistry Research. 44: 1220-1225. DOI: 10.1021/Ie049554R |
0.649 |
|
| 2004 |
Rodriguez O, Cho W, Saxena R, Achanta R, Gill WN, Plawsky OL. Effect of Surface Chemistry on the diffusion of Copper in nanoporous dielectrics Mrs Proceedings. 812. DOI: 10.1557/Proc-812-F6.8 |
0.715 |
|
| 2004 |
Cho W, Saxena R, Rodriguez O, Achanta R, Ojha M, Plawsky JL, Gill WN, Baklanov MR. Modification of Nanoporous Silica Structures by Fluorocarbon Plasma Treatment Mrs Proceedings. 812. DOI: 10.1557/Proc-812-F6.7 |
0.754 |
|
| 2004 |
Saxena R, Cho W, Rodriguez O, Gill WN, Plawsky JL. Barrier Layer Morphological Stability and Adhesion to Porous Low-κ Dielectrics Mrs Proceedings. 812. DOI: 10.1557/Proc-812-F3.12 |
0.593 |
|
| 2004 |
Xi JQ, Ojha M, Cho W, Gessmann T, Schubert EF, Plawsky JL, Gill WN. Omni-directional reflector using a low refractive index material International Journal of High Speed Electronics and Systems. 14: 726-731. DOI: 10.1142/S0129156404002740 |
0.673 |
|
| 2004 |
Saxena R, Cho W, Rodriguez O, Gill WN, Plawsky JL. Stability of thin copper films on mesoporous dielectrics Journal of Non-Crystalline Solids. 350: 14-22. DOI: 10.1016/J.Jnoncrysol.2004.08.229 |
0.705 |
|
| 2004 |
Saxena R, Rodriguez O, Cho W, Gill WN, Plawsky JL, Baklanov MR, Mogilnikov KP. Internal matrix structure of low-κ mesoporous silica and its relation to mechanical properties Journal of Non-Crystalline Solids. 349: 189-199. DOI: 10.1016/J.Jnoncrysol.2004.08.185 |
0.715 |
|
| 2004 |
Cho W, Saxena R, Rodriguez O, Achanta R, Plawsky JL, Gill WN. Effects of sintering on dielectric constants of mesoporous silica Journal of Non-Crystalline Solids. 350: 336-344. DOI: 10.1016/J.Jnoncrysol.2004.07.084 |
0.764 |
|
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