Marc Hodes - Publications

Affiliations: 
Mechanical Engineering Tufts University, Boston 
Area:
Mechanical Engineering

62 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2017 Hodes M, Kirk TL, Karamanis G, MacLachlan S. Effect of thermocapillary stress on slip length for a channel textured with parallel ridges Journal of Fluid Mechanics. 814: 301-324. DOI: 10.1017/Jfm.2017.8  0.48
2016 Karamanis G, Hodes M. Longitudinal-fin heat sink optimization capturing conjugate effects under fully developed conditions Journal of Thermal Science and Engineering Applications. 8. DOI: 10.1115/1.4034339  0.68
2016 Lam LS, Hodes M, Karamanis G, Kirk T, MacLachlan S. Effect of meniscus curvature on apparent thermal slip Journal of Heat Transfer. 138. DOI: 10.1115/1.4034189  0.68
2015 Hodes M, Lam LS, Cowley A, Enright R, MacLachlan S. Effect of evaporation and condensation at menisci on apparent thermal slip Journal of Heat Transfer. 137. DOI: 10.1115/1.4029818  0.68
2015 Zhang R, Hodes M, Lower N, Wilcoxon R. Water-Based Microchannel and Galinstan-Based Minichannel Cooling Beyond 1 kW/cm² Heat Flux Ieee Transactions On Components, Packaging and Manufacturing Technology. DOI: 10.1109/Tcpmt.2015.2426791  0.68
2014 Lam LS, Melnick C, Hodes M, Ziskind G, Enright R. Nusselt numbers for thermally developing couette flow with hydrodynamic and thermal slip Journal of Heat Transfer. 136. DOI: 10.1115/1.4026305  0.68
2014 Enright R, Hodes M, Salamon T, Muzychka Y. Isoflux nusselt number and slip length formulae for superhydrophobic microchannels Journal of Heat Transfer. 136. DOI: 10.1115/1.4024837  0.68
2014 Brownell E, Hodes M. Optimal design of thermoelectric generators embedded in a thermal resistance network Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 612-621. DOI: 10.1109/TCPMT.2013.2295169  0.68
2014 Hodes M, Zhang R, Lam LS, Wilcoxon R, Lower N. On the potential of galinstan-based minichannel and minigap cooling Ieee Transactions On Components, Packaging and Manufacturing Technology. 4: 46-56. DOI: 10.1109/Tcpmt.2013.2274699  0.68
2014 Zhang R, Hodes M, Lower N, Wilcoxon R. High heat flux, single-phase microchannel cooling Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 1-7. DOI: 10.1109/SEMI-THERM.2014.6892207  0.68
2014 Griffin JS, Mills DH, Cleary M, Nelson R, Manno VP, Hodes M. Continuous extraction rate measurements during supercritical CO2 drying of silica alcogel Journal of Supercritical Fluids. 94: 38-47. DOI: 10.1016/J.Supflu.2014.05.020  0.68
2014 Hodes M, Lam LS, MacLachlan S, Enright R. Effects of evaporation and condensation on apparent thermal slip Proceedings of the 15th International Heat Transfer Conference, Ihtc 2014 0.68
2013 Lam LS, Hodes M, Enright R. Analysis of galinstan-based microgap cooling enhancement using structured surfaces Asme 2013 Heat Transfer Summer Conf. Collocated With the Asme 2013 7th Int. Conf. On Energy Sustainability and the Asme 2013 11th Int. Conf. On Fuel Cell Science, Engineering and Technology, Ht 2013. 3. DOI: 10.1115/1.4030208  0.68
2013 Cleary M, North MT, Van Lieshout M, Brooks DA, Grimes R, Hodes M. Reduced power precision temperature control using variable conductance heat pipes Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 2048-2058. DOI: 10.1109/Tcpmt.2013.2270286  0.68
2013 Mueller S, Hodes M, Lyons A. Capillary-driven evaporation-enhanced heat sink Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1683-1692. DOI: 10.1109/Tcpmt.2013.2253157  0.68
2013 Zhang R, Hodes M, Lower N, Wilcoxon R. Thermo-fluid characteristics of a minichannel heat sink cooled with liquid metal Annual Ieee Semiconductor Thermal Measurement and Management Symposium. 159-165. DOI: 10.1109/SEMI-THERM.2013.6526822  0.68
2012 Zhang R, Hodes M, Brooks DA, Manno VP. Optimized thermoelectric module-heat sink assemblies for precision temperature control Journal of Electronic Packaging, Transactions of the Asme. 134. DOI: 10.1115/1.4005905  0.68
2012 Annapragada SR, Salamon T, Kolodner P, Hodes M, Garimella SV. Determination of electrical contact resistivity in thermoelectric modules (TEMs) from module-level measurements Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 668-676. DOI: 10.1109/TCPMT.2012.2183595  0.68
2012 Melnick C, Hodes M, Ziskind G, Cleary M, Manno VP. Thermoelectric module-variable conductance heat pipe assemblies for reduced power temperature control Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 474-482. DOI: 10.1109/Tcpmt.2011.2178413  0.68
2012 Krishnan S, Hernon D, Hodes M, Mullins J, Lyons AM. Design of complex structured monolithic heat sinks for enhanced air cooling Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 266-277. DOI: 10.1109/Tcpmt.2011.2175448  0.68
2012 Hodes M. Optimal design of thermoelectric refrigerators embedded in a thermal resistance network Ieee Transactions On Components, Packaging and Manufacturing Technology. 2: 483-495. DOI: 10.1109/Tcpmt.2011.2166762  0.68
2012 Hodes M, Rui Zhang, Wilcoxon R, Lower N. Cooling potential of galinstan-based minichannel heat sinks Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm. 297-302. DOI: 10.1109/ITHERM.2012.6231443  0.68
2011 Wlezien R, Prapas J, Briggs S, Hodes M, Manno V, Matson D, Chiesa L. Characterization and optimization of fluid flow in a high biot number system Materials Research Society Symposium Proceedings. 1306: 25-30. DOI: 10.1557/Opl.2011.91  0.68
2010 Hodes M. Optimal pellet geometries for thermoelectric power generation Ieee Transactions On Components and Packaging Technologies. 33: 307-318. DOI: 10.1615/Ihtc13.P21.210  0.68
2010 Hodes M. Optimal pellet geometries for thermoelectric refrigeration under robin boundary conditions Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 605-614. DOI: 10.1115/InterPACK2009-89376  0.68
2010 Kumari N, Bahadur V, Hodes M, Salamon T, Lyons A, Kolodner P, Garimella SV. Numerical analysis of mist-cooled high power components in cabinets Proceedings of the Asme Interpack Conference 2009, Ipack2009. 2: 933-944. DOI: 10.1115/InterPACK2009-89269  0.68
2010 Enright R, Hodes M, Salamon TR, Muzychka Y. Analysis and simulation of heat transfer in a superhydrophobic microchannel 2010 14th International Heat Transfer Conference, Ihtc 14. 6: 157-168. DOI: 10.1115/IHTC14-22948  0.68
2010 Hwang DC, Manno VP, Hodes M, Chan GJ. Energy savings achievable through liquid cooling: A rack level case study 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501419  0.68
2010 Annapragada SR, Salamon T, Kolodner P, Hodes M, Garimella SV. Prediction of electrical contact resistivity in thermoelectric modules (TEMs) from module-level measurements 2010 12th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2010. DOI: 10.1109/ITHERM.2010.5501317  0.68
2010 Kumari N, Bahadur V, Hodes M, Salamon T, Kolodner P, Lyons A, Garimella SV. Analysis of evaporating mist flow for enhanced convective heat transfer International Journal of Heat and Mass Transfer. 53: 3346-3356. DOI: 10.1016/J.Ijheatmasstransfer.2010.02.027  0.68
2009 Pettes AM, Hodes MS, Goodson KE. Optimized thermoelectric refrigeration in the presence of thermal boundary resistance Ieee Transactions On Advanced Packaging. 32: 423-430. DOI: 10.1109/Tadvp.2008.924221  0.68
2009 Hernon D, Salamon T, Kempers R, Krishnan S, Lyons A, Hodes M, Kolodner P, Mullins J, McGarry L. Thermal management: Enabling enhanced functionality and reduced carbon footprint Bell Labs Technical Journal. 14: 7-19. DOI: 10.1002/bltj.20385  0.68
2009 Lyons A, Krishnan S, Mullins J, Hodes M, Hernon D. Advanced heat sinks enabled by three-dimensional printing 20th Annual International Solid Freeform Fabrication Symposium, Sff 2009. 749-760.  0.68
2009 Kim KJ, Hodes M. Thermoelectric energy scavenging from waste heat of power amplifier transistors 15th International Workshop On Thermal Investigations of Ics and Systems, Therminic 2009. 75-79.  0.68
2009 Cleary M, Grimes R, Hodes M, North MT. PIV measurements in the condenser region of a gas-loaded thermosyphon 2008 Proceedings of the Asme Summer Heat Transfer Conference, Ht 2008. 3: 651-658.  0.68
2008 Enright R, Dalton T, Krupenkin TN, Kolodner P, Hodes M, Salamon TR. Effects of interfacial position on drag reduction in a superhydrophobic microchannel Proceedings of the 6th International Conference On Nanochannels, Microchannels, and Minichannels, Icnmm2008. 835-845. DOI: 10.1115/ICNMM2008-62251  0.68
2008 Bahadur V, Hodes M, Lyons A, Krishnan S, Garimella SV. Enhanced cooling in a sealed cabinet using an evaporating-condensing dielectric mist 2008 11th Ieee Intersociety Conference On Thermal and Thermomechanical Phenomena in Electronic Systems, I-Therm. 1191-1198. DOI: 10.1109/ITHERM.2008.4544396  0.68
2007 Krupenkin TN, Taylor JA, Wang EN, Kolodner P, Hodes M, Salamon TR. Reversible wetting-dewetting transitions on electrically tunable superhydrophobic nanostructured surfaces. Langmuir : the Acs Journal of Surfaces and Colloids. 23: 9128-33. PMID 17663572 DOI: 10.1021/La7008557  0.68
2007 Krishnan S, Hodes M, Jones C, Malis O. Analysis of an annular-geometry thermoelectric module (TEM) 2007 Proceedings of the Asme Interpack Conference, Ipack 2007. 2: 241-247. DOI: 10.1115/IPACK2007-33763  0.68
2007 Cleary M, Hodes M, Grimes R, North MT. Characterisation of a variable conductance heat pipe prototype for a photonic application 2007 Proceedings of the Asme/Jsme Thermal Engineering Summer Heat Transfer Conference - Ht 2007. 3: 313-320. DOI: 10.1115/HT2007-32623  0.68
2007 Hodes M, Bolle C, Kolodner P. Efficient cooling of multiple components in a shielded circuit pack Journal of Electronic Packaging, Transactions of the Asme. 129: 216-218. DOI: 10.1115/1.2721095  0.68
2007 Kolodner P, Hodes M, Ewes I, Holmes P. Mechanical gap fillers: Concepts and thermal resistance measurements Ieee Transactions On Components and Packaging Technologies. 30: 813-823. DOI: 10.1109/Tcapt.2007.906696  0.68
2006 Cleary M, Hodes M, Grimes R, North MT. Design of a variable conductance heat pipe for a photonic component American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. DOI: 10.1115/IMECE2006-13603  0.68
2006 Dalton T, Hodes M, Eason C, Kolodner P, Enright R, Krupenkin T. Challenges in using nano-textured surfaces to reduce pressure drop through microchannels 7th International Conference On Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Eurosime 2006. 2006. DOI: 10.1109/ESIME.2006.1644071  0.68
2006 Krupenkin T, Kolodner P, Taylor JA, Hodes M. Electrically tunable superhydrophobic nanostructured surfaces Proceedings of the 4th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2006. 2006: 1211-1220. DOI: 10.1002/Bltj.20111  0.68
2006 Henoch C, Krupenkin TN, Kolodner P, Taylor JA, Hodes MS, Lyons AM, Peguero C, Breuer K. Turbulent drag reduction using superhydrophobic surfaces Collection of Technical Papers - 3rd Aiaa Flow Control Conference. 2: 840-844.  0.68
2006 Enright R, Eason C, Dalton T, Hodes M, Salamon T, Kolodner P, Krupenkin T. Friction factors and nusselt numbers in microchannels with superhydrophobic walls Proceedings of the 4th International Conference On Nanochannels, Microchannels and Minichannels, Icnmm2006. 2006: 599-609.  0.68
2005 Salamon T, Lee W, Krupenkin T, Hodes M, Kolodner P, Enright R, Salinger A. Numerical simulation of fluid flow in microchannels with superhydrophobic walls American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 376: 819-829. DOI: 10.1115/IMECE2005-82641  0.68
2005 Hodes M. On one-dimensional analysis of thermoelectric modules (TEMs) Ieee Transactions On Components and Packaging Technologies. 28: 218-229. DOI: 10.1109/Tcapt.2005.848532  0.68
2005 Kolodner P, Ewes I, Hodes M, Holmes P. Thermal-resistance measurements on mechanical gap fillers Proceedings of the Asme/Pacific Rim Technical Conference and Exhibition On Integration and Packaging of Mems, Nems, and Electronic Systems: Advances in Electronic Packaging 2005. 91-98.  0.68
2004 Hodes M, Marrone PA, Hong GT, Smith KA, Tester JW. Salt precipitation and scale control in supercritical water oxidation - Part A: Fundamentals and research Journal of Supercritical Fluids. 29: 265-288. DOI: 10.1016/S0896-8446(03)00093-7  0.68
2004 Marrone PA, Hodes M, Smith KA, Tester JW. Salt precipitation and scale control in supercritical water oxidation - Part B: Commercial/full-scale applications Journal of Supercritical Fluids. 29: 289-312. DOI: 10.1016/S0896-8446(03)00092-5  0.68
2004 Hodes M, Griffith P, Smith KA, Hurst WS, Bowers WJ, Sako K. Salt solubility and deposition in high temperature and pressure aqueous solutions Aiche Journal. 50: 2038-2049. DOI: 10.1002/Aic.10238  0.68
2004 Hodes M. One-dimensional analysis of thermoelectric modules Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference. 1: 242-250.  0.68
2003 Hodes M, Smith KA, Griffith P. A natural convection model for the rate of salt deposition from near-supercritical, aqueous solutions Journal of Heat Transfer. 125: 1027-1037. DOI: 10.1115/1.1603772  0.68
2002 Hodes M, Weinstein RD, Pence SJ, Piccini JM, Manzione L, Chen C. Transient Thermal Management of a Handset Using Phase Change Material (PCM) Journal of Electronic Packaging, Transactions of the Asme. 124: 419-426. DOI: 10.1115/1.1523061  0.68
2002 Smith KA, Hodes M, Griffith P. On the potential for homogeneous nucleation of salt from aqueous solution in a natural convection boundary layer Journal of Heat Transfer. 124: 930-937. DOI: 10.1115/1.1494089  0.68
2002 Hurst WS, Hodes MS, Bowers WJ, Bean VE, Maslar JE, Griffith P, Smith KA. Optical flow cell and apparatus for solubility, salt deposition and Raman spectroscopic studies in aqueous solutions near the water critical point Journal of Supercritical Fluids. 22: 157-166. DOI: 10.1016/S0896-8446(01)00120-6  0.68
2001 Chen C, Hodes M, Manzione L. Sizing of heat spreaders above dielectric layers Journal of Electronic Packaging, Transactions of the Asme. 123: 173-181. DOI: 10.1115/1.1377271  0.68
2001 Weinstein RD, Hodes M, Piccini JM. Improved static and transient thermal management of handsets using heat spreaders and Phase Change Materials (PCMS) Proceedings of the National Heat Transfer Conference. 1: 205-214.  0.68
2000 Hodes M. Formulae to size axisymmetric heat spreaders above dielectric layers American Society of Mechanical Engineers, Manufacturing Engineering Division, Med. 11: 443-451.  0.68
2000 Smith KA, Hodes M, Griffith P. On the potential for homogeneous nucleation in aqueous salt solutions at elevated temperatures and pressures American Society of Mechanical Engineers, Heat Transfer Division, (Publication) Htd. 366: 133-142.  0.68
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