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Jipu Lei, Ph.D. - Publications

Affiliations: 
2005 University of North Texas, Denton, TX, United States 
Area:
Analytical Chemistry
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4 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2006 Lei J, Rudenja S, Magtoto N, Kelber JA. Cu electrodeposition on Ru(0001): Perchlorate dissociation and its effects on Cu deposition Thin Solid Films. 497: 121-129. DOI: 10.1016/J.Tsf.2005.10.057  0.651
2005 Liu J, Lei J, Magtoto N, Rudenja S, Garza M, Kelber JA. The effects of an iodine surface layer on ru reactivity in air and during Cu electrodeposition Journal of the Electrochemical Society. 152: G115-G121. DOI: 10.1149/1.1842072  0.53
2003 Wang C, Lei J, Bjelkevig C, Rudenja S, Magtoto N, Kelber J. Electrodeposition of adherent copper film on unmodified tungsten Thin Solid Films. 445: 72-79. DOI: 10.1016/S0040-6090(03)01239-2  0.445
2002 Wang C, Lei J, Rudenja S, Magtoto N, Kelber J. Seedless electrodeposition of Cu on unmodified tungsten Electrochemical and Solid-State Letters. 5: C82-C84. DOI: 10.1149/1.1498015  0.537
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