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Glenn Y. Masada - Publications

Affiliations: 
University of Texas at Austin, Austin, Texas, U.S.A. 
Area:
Mechanical Engineering
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13/24 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2005 Gwak KW, Masada GY. Structural analysis and optimization of nonlinear control systems using singular value decomposition Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 127: 105-113. DOI: 10.1115/1.1876495  0.37
2004 Gwak K, Masada GY. Regularization Embedded Nonlinear Control Designs for Input-Constrained and Ill-Conditioned Thermal System Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 126: 574-582. DOI: 10.1115/1.1789973  0.488
1995 Lee FS, Moon TJ, Masada GY. Extended Bond Graph Reticulation of Piezoelectric Continua Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 117: 1-7. DOI: 10.1115/1.2798518  0.348
1995 Leifer J, Masada GY, Busch-Vishniac IJ. Finite element simulation of a nondestructive shear test for TAB bonds Ieee Transactions On Semiconductor Manufacturing. 8: 352-359. DOI: 10.1109/66.401013  0.306
1994 Yen C, Masada GY. Dynamic Analysis of Flexible Bodies Using Extended Bond Graphs Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 116: 66-72. DOI: 10.1115/1.2900682  0.335
1994 Lee FS, Moon TJ, Masada GY. Extended bond graph reticulation of magnetostrictive continua Journal of Applied Physics. 75: 4621-4627. DOI: 10.1063/1.355910  0.327
1993 Eftychiou MA, Bergman TL, Masada GY. A Detailed Thermal Model of the Infrared Reflow Soldering Process Journal of Electronic Packaging. 115: 55-62. DOI: 10.1115/1.2909302  0.32
1993 Yen C, Masada GY, Chan WM. Dynamic analysis of a two-link flexible manipulator system using Extended Bond Graphs Journal of the Franklin Institute-Engineering and Applied Mathematics. 330: 1113-1134. DOI: 10.1016/0016-0032(93)90068-6  0.317
1991 Ingrim ME, Masada GY. Extended Bond Graph Representation of the Traction Problem in Linear Elastodynamics Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 113: 118-121. DOI: 10.1115/1.2896335  0.326
1991 Ingrim ME, Masada GY. The Extended Bond Graph Notation Journal of Dynamic Systems Measurement and Control-Transactions of the Asme. 113: 113-117. DOI: 10.1115/1.2896334  0.303
1991 Yen C, Masada GY, Ingrim ME. Model of a hyperelastic thin plate using the extended bond graph method Journal of the Franklin Institute-Engineering and Applied Mathematics. 328: 765-780. DOI: 10.1016/0016-0032(91)90053-6  0.34
1991 Ingrim ME, Masada GY. Extended bond graph reticulation of the mixed initial-boundary value problem in finite hyperelasticity Journal of the Franklin Institute-Engineering and Applied Mathematics. 328: 753-764. DOI: 10.1016/0016-0032(91)90052-5  0.352
1991 Ingrim ME, Masada GY. Reticulation equivalency in the extended bond graph notation Journal of the Franklin Institute-Engineering and Applied Mathematics. 328: 741-752. DOI: 10.1016/0016-0032(91)90051-4  0.32
Low-probability matches (unlikely to be authored by this person)
1994 Lee FS, Moon TJ, Masada GY. Modeling of distributed electromechanical systems using Extended Bond Graphs Journal of the Franklin Institute-Engineering and Applied Mathematics. 331: 43-60. DOI: 10.1016/0016-0032(94)90078-7  0.299
1995 Kim Y-G, Pavuluri JK, White JR, Busch-Vishniac IJ, Masada GY. Thermocompression bonding effects on bump-pad adhesion Ieee Transactions On Components, Packaging, and Manufacturing Technology: Part B. 18: 192-200. DOI: 10.1109/96.365508  0.299
1992 Eftychiou M, Bergman TL, Masada GY. Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process Journal of Electronic Packaging. 114: 48-54. DOI: 10.1115/1.2905441  0.295
1992 Fernandes NJ, Bergman TL, Masada GY. Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms Journal of Electronic Packaging. 114: 41-47. DOI: 10.1115/1.2905440  0.289
2016 Balasubramanian S, Gaspredes JL, Moon TJ, Masada GY. Feasibility study of a residential hybrid ground source heat pump system Journal of Thermal Science and Engineering Applications. 8. DOI: 10.1115/1.4032763  0.28
1996 Mittal S, Masada GY, Bergman TL. Mechanical response of PCB assemblies during infrared reflow soldering Ieee Transactions On Components Packaging and Manufacturing Technology Part A. 19: 127-132. DOI: 10.1109/95.486624  0.274
2014 Gaspredes JL, Masada GY, Moon TJ. A Simulink®-Based Building Load-Ground Source Heat Pump Model Used to Assess Short-and Long-Term Heat Pump and Ground Loop Performance Journal of Thermal Science and Engineering Applications. 6: 21013. DOI: 10.1115/1.4026081  0.264
1992 Paynter HM, Masada GY, Fahrenthold EP. Multi-anchored state equations applied to square-well fluids with differing well-widths Fluid Phase Equilibria. 79: 49-62. DOI: 10.1016/0378-3812(92)85119-S  0.246
1990 Paynter HM, Fahrenthold EP, Masada GY. Simple pressure and energy state equations for Lennard-Jones (12,6) fluid Journal of Heat Transfer. 112: 240-244. DOI: 10.1115/1.2910352  0.208
1992 Attarwala AI, Tien JK, Masada GY, Dody G. Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints Journal of Electronic Packaging. 114: 109-111. DOI: 10.1115/1.2906405  0.192
1987 Beaman JJ, Wang SY, Masada GY. Cycle time control of an onboard oxygen generation system. Aviation, Space, and Environmental Medicine. 58: 1225-9. PMID 3426498  0.135
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