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Ming-Tzer Lin, Ph.D. - Publications

Affiliations: 
2003 Lehigh University, Bethlehem, PA, United States 
Area:
Mechanical Engineering, Materials Science Engineering, Condensed Matter Physics
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20 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2023 Nguyen TAK, Dang NM, Lin CH, Lee MC, Wang ZY, Tsai YC, Lin MT. Effects of RF Magnetron Sputtering Power on the Mechanical Behavior of Zr-Cu-Based Metallic Glass Thin Films. Nanomaterials (Basel, Switzerland). 13. PMID 37836318 DOI: 10.3390/nano13192677  0.364
2022 Dang NM, Wang ZY, Lin CH, Lin MT. The Effects of Stresses and Interfaces on Texture Transformation in Silver Thin Films. Nanomaterials (Basel, Switzerland). 12. PMID 35159674 DOI: 10.3390/nano12030329  0.423
2021 Dang NM, Wang ZY, Wu TY, Nguyen TAK, Lin MT. Measurement of Effects of Different Substrates on the Mechanical Properties of Submicron Titanium Nickel Shape Memory Alloy Thin Film Using the Bulge Test. Micromachines. 12. PMID 33467736 DOI: 10.3390/mi12010085  0.339
2020 Chen TY, Chou YC, Wang ZY, Lin WY, Lin MT. Using Digital Image Correlation on SEM Images of Strain Field after Ion Beam Milling for the Residual Stress Measurement of Thin Films. Materials (Basel, Switzerland). 13. PMID 32178450 DOI: 10.3390/ma13061291  0.361
2018 Chen W, Lee Y, Wu T, Chen T, Hsu C, Lin M. Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate Journal of Electronic Materials. 47: 35-48. DOI: 10.1007/S11664-017-5685-4  0.422
2016 Huang D, Tu W, Zhang X, Tsai L, Wu T, Lin M. Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging Microelectronics Reliability. 65: 131-141. DOI: 10.1016/J.Microrel.2016.07.006  0.404
2016 Ellis EA, Chmielus M, Lin MT, Joress H, Visser K, Woll A, Vinci RP, Brown WL, Baker SP. Driving forces for texture transformation in thin Ag films Acta Materialia. 105: 495-504. DOI: 10.1016/J.Actamat.2015.12.020  0.427
2015 Wu FL, Ou SL, Kao YC, Chen CL, Tseng MC, Lu FC, Lin MT, Horng RH. Thin-film vertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via the patterned design of Cu substrate. Optics Express. 23: 18156-65. PMID 26191874 DOI: 10.1364/Oe.23.018156  0.363
2015 Huang AW, Lu CH, Wu SC, Chen TC, Vinci RP, Brown WL, Lin MT. Viscoelastic mechanical properties measurement of thin Al and Al-Mg films using bulge testing Thin Solid Films. DOI: 10.1016/J.Tsf.2016.03.064  0.405
2015 Cheng YC, Wang YT, Hsu FC, Lu FC, Wu CL, Lin MT. Effect of Loading Stress on the Growth of Cn/Sn Intermetallic Compounds at High Temperatures Journal of Electronic Materials. 44: 604-611. DOI: 10.1007/S11664-014-3503-9  0.457
2014 Hsu FC, Wang YT, Cheng YC, Tong CJ, Lin MT. The study of internal friction in nanocrystalline Ag and Au thin films Thin Solid Films. 570: 262-267. DOI: 10.1016/J.Tsf.2014.03.016  0.415
2014 Wang YT, Tong CJ, Shieh YF, Cheng YC, Hsieh FC, Lin MT. Effect of temperature on energy loss and internal friction in nanocrystalline copper thin films Surface and Coatings Technology. 260: 272-278. DOI: 10.1016/J.Surfcoat.2014.07.032  0.421
2014 Hsu FC, Cheng YC, Wang YT, Lin MT, Chen CM. Planar copper-tin inter-metallic film formation on strained substrates Microelectronics Reliability. 54: 1378-1383. DOI: 10.1016/J.Microrel.2014.02.006  0.369
2012 Cheng HH, Huang DS, Lin MT. Heat dissipation design and analysis of high power LED array using the finite element method Microelectronics Reliability. 52: 905-911. DOI: 10.1016/J.Microrel.2011.05.009  0.306
2012 Hu T, Hsu F, Huang A, Lin M. Influence of External Strain on the Growth of Interfacial Intermetallic Compounds Between Sn and Cu Substrates Journal of Electronic Materials. 41: 3309-3319. DOI: 10.1007/S11664-012-2244-X  0.32
2011 Liao W, Chen C, Lin M, Wang C. Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains Scripta Materialia. 65: 691-694. DOI: 10.1016/J.Scriptamat.2011.07.007  0.339
2009 Tong C, Lin M. Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems. 15: 1207-1216. DOI: 10.1007/S00542-008-0750-9  0.377
2007 Lin MT, Chromik RR, Barbosa N, El-Deiry P, Hyun S, Brown WL, Vinci RP, Delph TJ. The influence of vanadium alloying on the elevated-temperature mechanical properties of thin gold films Thin Solid Films. 515: 7919-7925. DOI: 10.1016/J.Tsf.2007.04.025  0.596
2006 Lin M, Tong C, Chiang C. Design an Electroplated Frame Freestanding Specimen for Microtensile Testing of Submicron thin TaN and Cu Film Mrs Proceedings. 914. DOI: 10.1557/Proc-0914-F09-16  0.398
2003 Stesmans A, Pierreux D, Jaccodine RJ, Lin MT, Delph TJ. Influence of in situ applied stress during thermal oxidation of (111)Si on Pb interface defects Applied Physics Letters. 82: 3038-3040. DOI: 10.1063/1.1555277  0.582
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