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I Charles Ume - Publications

Affiliations: 
Georgia Institute of Technology, Atlanta, GA 
Area:
Mechanical Engineering, Packaging Engineering
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28 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Kang S, Ume IC. Dynamic digital fringe projection technique for measuring the warpage of unpainted PBGA packages and boards The International Journal of Advanced Manufacturing Technology. 96: 3235-3249. DOI: 10.1007/S00170-018-1819-Y  0.366
2017 Yang L, Ume IC. Measurement of weld penetration depths in thin structures using transmission coefficients of laser-generated Lamb waves and neural network. Ultrasonics. 78: 96-109. PMID 28324778 DOI: 10.1016/J.Ultras.2017.02.019  0.444
2015 Yang L, Ume IC. Inspection of notch depths in thin structures using transmission coefficients of laser-generated Lamb waves. Ultrasonics. 63: 168-73. PMID 26195299 DOI: 10.1016/J.Ultras.2015.07.004  0.464
2015 Yang L, Gong J, Ume IC. Fundamental Study of Microelectronic Chips’ Response Under Laser Excitation and Signal Processing Methods Journal of Nondestructive Evaluation. 34. DOI: 10.1007/S10921-015-0294-8  0.42
2014 Kang S, Ume IC. Automatic Segmentation Method for Segmenting PBGA Package and PWB Regions during Warpage Measurement of Unpainted PWB Assembly Journal of Microelectronics and Electronic Packaging. 2014: 574-579. DOI: 10.4071/Isom-Poster5  0.307
2014 Kang S, Ume IC. Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods Journal of Electronic Packaging. 136: 31007. DOI: 10.1115/1.4027425  0.365
2013 Kang S, Ume IC. Techniques for Measuring Warpage of Chip Packages, PWBs, and PWB Assemblies Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1533-1544. DOI: 10.1109/Tcpmt.2013.2255054  0.325
2013 Gong J, Ume IC. Nondestructive Evaluation of Poor-Wetted Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound and Interferometric Technique Ieee Transactions On Components, Packaging and Manufacturing Technology. 3: 1301-1309. DOI: 10.1109/Tcpmt.2012.2226033  0.49
2012 Wu T, Ume IC. Prediction and experimental validation of penetration depth of butt welds in thin plates using superimposed laser sources Ndt & E International. 50: 10-19. DOI: 10.1016/J.Ndteint.2012.04.002  0.604
2011 Wu T, Ume IC. Fundamental study of laser generation of narrowband Lamb waves using superimposed line sources technique Ndt & E International. 44: 315-323. DOI: 10.1016/J.Ndteint.2011.01.006  0.579
2010 Yang J, Ume I. Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods. Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 57: 920-32. PMID 20378454 DOI: 10.1109/TUFFC.2010.1496  0.379
2010 Yang J, Zhang L, Ume IC, Ghiu C, White G. Board-level solder joint reliability study of land grid array packages for RF application using a laser ultrasound inspection system Journal of Electronic Packaging, Transactions of the Asme. 132: 0210061-0210066. DOI: 10.1115/1.4001832  0.441
2010 Yang J, Ume IC. Laser ultrasonic technique for evaluating solder bump defects in flip chip packages using modal and signal analysis methods Ieee Transactions On Ultrasonics, Ferroelectrics, and Frequency Control. 57: 920-932. DOI: 10.1109/Tuffc.2010.1496  0.476
2010 Tan W, Ume IC, Hung Y, Wu CFJ. Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies Ieee Transactions On Advanced Packaging. 33: 314-322. DOI: 10.1109/Tadvp.2010.2041451  0.314
2009 Powell RE, Ume IC. A novel projection moiré system for measuring PWBA warpage using simulated optimized convective reflow process Journal of Electronic Packaging, Transactions of the Asme. 131: 0210061-0210066. DOI: 10.1115/1.3103938  0.673
2009 Yang J, Ume IC. Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals Journal of Electronic Packaging. 131: 11013. DOI: 10.1115/1.3068301  0.464
2008 Zhang L, Ume IC. Application of Experimental and Finite Element Modal Analysis in Development of a Novel Solder Joint Inspection Systems Journal of Microelectronics and Electronic Packaging. 5: 97-103. DOI: 10.4071/1551-4897-5.3.97  0.438
2008 Yang J, Ume IC. Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses Journal of Electronic Packaging. 130: 31009. DOI: 10.1115/1.2957328  0.435
2007 Kita A, Ume IC. Effects of Broadband Laser Generated Ultrasound on Array Gain Journal of Nondestructive Evaluation. 26: 11-18. DOI: 10.1007/S10921-007-0015-Z  0.437
2006 Kita A, Ume IC. Effects of Broadband Laser Generated Ultrasound on Array Gain Quantitative Nondestructive Evaluation. 820: 225-232. DOI: 10.1063/1.2184533  0.441
2004 Ding H, Ume IC, Zhang C. Warpage Analysis of Underfilled Wafers Journal of Electronic Packaging. 126: 265-270. DOI: 10.1115/1.1707036  0.609
2002 Hopko SN, Ume IC, Erdahl DS. Development of a flexible laser ultrasonic probe Journal of Manufacturing Science and Engineering-Transactions of the Asme. 124: 351-357. DOI: 10.1115/1.1379369  0.526
2002 Mi B, Ume IC. Frequency spectrum analysis of laser generated ultrasonic waves in ablative regime Quantitative Nondestructive Evaluation. 615: 363-370. DOI: 10.1063/1.1472821  0.719
2002 Mi B, Ume IC. Parametric Studies of Laser Generated Ultrasonic Signals in Ablative Regime: Time and Frequency Domains Journal of Nondestructive Evaluation. 21: 23-33. DOI: 10.1023/A:1019980725994  0.728
2000 Graham GM, Ume IC, Hopko SN. Laser Array/EMAT Ultrasonic Measurement of the Penetration Depth in a Liquid Weld Pool Journal of Manufacturing Science and Engineering-Transactions of the Asme. 122: 70-75. DOI: 10.1115/1.538910  0.478
1999 Hopko SN, Ume IC. Laser Ultrasonics: Simultaneous Generation by Means of Thermoelastic Expansion and Material Ablation Journal of Nondestructive Evaluation. 18: 91-98. DOI: 10.1023/A:1021856526734  0.557
1999 Hopko SN, Ume IC. Laser generated ultrasound by material ablation using fiber optic delivery Ultrasonics. 37: 1-7. DOI: 10.1016/S0041-624X(98)00046-8  0.507
1997 Graham GM, Ume IC. Automated system for laser ultrasonic sensing of weld penetration Mechatronics. 7: 711-721. DOI: 10.1016/S0957-4158(97)00031-7  0.467
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