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Rick F. Reidy - Publications

Affiliations: 
University of North Texas, Denton, TX, United States 
Area:
Materials Science Engineering
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22 high-probability publications. We are testing a new system for linking publications to authors. You can help! If you notice any inaccuracies, please sign in and mark papers as correct or incorrect matches. If you identify any major omissions or other inaccuracies in the publication list, please let us know.

Year Citation  Score
2018 Barclay JD, Okobiah O, Deng L, Sengphanlaya T, Du J, Reidy RF. High temperature water as a clean and etch of low-k and SiO2 films Microelectronic Engineering. 196: 54-58. DOI: 10.1016/J.Mee.2018.04.016  0.354
2015 Ballard JB, Dick DD, McDonnell SJ, Bischof M, Fu J, Owen JH, Owen WR, Alexander JD, Jaeger DL, Namboodiri P, Fuchs E, Chabal YJ, Wallace RM, Reidy R, Silver RM, et al. Atomically Traceable Nanostructure Fabrication. Journal of Visualized Experiments : Jove. PMID 26274555 DOI: 10.3791/52900  0.322
2014 Smith TS, Lynch KM, Cooper CM, Okobiah O, Osei-Yiadom E, Bischof M, Kouloumpis A, Baikousi M, Dimos K, Reidy RF. Wetting behavior of plasma treated low-k films in dHF cleans solutions Microelectronic Engineering. 128: 79-84. DOI: 10.1016/J.Mee.2014.05.006  0.346
2013 Polley CM, Clarke WR, Miwa JA, Scappucci G, Wells JW, Jaeger DL, Bischof MR, Reidy RF, Gorman BP, Simmons M. Exploring the limits of N-type ultra-shallow junction formation. Acs Nano. 7: 5499-505. PMID 23721101 DOI: 10.1021/Nn4016407  0.304
2013 Sondhi A, Morandi C, Reidy RF, Scharf TW. Theoretical and Experimental Investigations on the Mechanism of Carbothermal Reduction of Zirconia (Preprint) Ceramics International. 39: 4489-4497. DOI: 10.1016/J.Ceramint.2012.11.043  0.303
2012 Schmucker SW, Kumar N, Abelson JR, Daly SR, Girolami GS, Bischof MR, Jaeger DL, Reidy RF, Gorman BP, Alexander J, Ballard JB, Randall JN, Lyding JW. Field-directed sputter sharpening for tailored probe materials and atomic-scale lithography. Nature Communications. 3: 935. PMID 22760634 DOI: 10.1038/Ncomms1907  0.305
2009 Vinogradova E, Osei-Yiadom E, Smith CE, Mueller DW, Reidy RF. Effects of plasmas on porous low dielectric constant CVD SiOCH films Microelectronic Engineering. 86: 176-180. DOI: 10.1016/J.Mee.2008.10.018  0.354
2008 Vinogradova E, Smith CE, Mueller D, McKerrow AJ, Reidy R. Moisture Adsorption in Plasma-Damaged Porous Low-k Dielectrics Mrs Proceedings. 1079. DOI: 10.1557/Proc-1079-N02-09  0.356
2008 Vinogradova E, Smith CE, Mueller DW, Reidy RF. Application of deuterium exchange to analyze moisture uptake characteristics of porous low-dielectric-constant SiOCH films Electrochemical and Solid-State Letters. 11: H255-H257. DOI: 10.1149/1.2947786  0.363
2007 Wang J, Cha D, Matz P, Smith C, Mueller D, Reidy R, Kim M. TEM-EELS Study on the Ash Damage and Repair of Porous Low-k Films Microscopy and Microanalysis. 13: 794-795. DOI: 10.1017/S1431927607071863  0.302
2007 Dong H, Zhang Z, Lee M, Mueller DW, Reidy RF. Sol-gel polycondensation of methyltrimethoxysilane in ethanol studied by 29 Si NMR spectroscopy using a two-step acid/base procedure Journal of Sol-Gel Science and Technology. 41: 11-17. DOI: 10.1007/S10971-006-0115-8  0.567
2005 Dong H, Reidy RF, Brennan JD. Shrinkage and springback behavior of methylsilsesquioxanes prepared by an acid/base two-step processing procedure Chemistry of Materials. 17: 6012-6017. DOI: 10.1021/Cm051369W  0.386
2005 Orozco-Teran R, Gorman B, Mueller D, Baklanov M, Reidy R. Effect of silylation on triethoxyfluorosilane xerogel films by means of atmospheric pressure drying Thin Solid Films. 471: 145-153. DOI: 10.1016/J.Tsf.2004.05.005  0.33
2004 Gorman BP, Orozco-Teran RA, Zhang Z, Matz PD, Mueller DW, Reidy RF. Rapid repair of plasma ash damage in low-k dielectrics using supercritical CO 2 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures. 22: 1210-1212. DOI: 10.1116/1.1755220  0.575
2004 Dong H, Gorman B, Zhang Z, Orozco-Teran R, Roepsch J, Mueller D, Kim M, Reidy R. Reinforcement mechanism for mechanically enhanced xerogel films Journal of Non-Crystalline Solids. 350: 345-350. DOI: 10.1016/J.Jnoncrysol.2004.08.231  0.564
2004 Zhang Z, Dong H, Gorman BP, Mueller DW, Reidy RF. Behavior of copper ions in silica xerogels Journal of Non-Crystalline Solids. 341: 157-161. DOI: 10.1016/J.Jnoncrysol.2004.04.026  0.546
2004 Roepsch JA, Gorman BP, Mueller DW, Reidy RF. Dielectric behavior of triethoxyfluorosilane aerogels Journal of Non-Crystalline Solids. 336: 53-58. DOI: 10.1016/J.Jnoncrysol.2003.12.043  0.342
2003 Gorman BP, Mueller DW, Reidy RF. Drying and Functionalization of Triethoxyfluorosilane-Based Low-k Dielectrics in CO2 Electrochemical and Solid-State Letters. 6. DOI: 10.1149/1.1615353  0.334
2003 Zhang Z, Gorman BP, Dong H, Orozco-Teran RA, Mueller DW, Reidy RF. Investigation of polymerization and cyclization of dimethyldiethoxysilane by 29Si NMR and FTIR Journal of Sol-Gel Science and Technology. 28: 159-165. DOI: 10.1023/A:1026098729993  0.563
2003 Dong H, Lee M, Thomas RD, Zhang Z, Reidy RF, Mueller DW. Methyltrimethoxysilane Sol-Gel Polymerization in Acidic Ethanol Solutions Studied by 29Si NMR Spectroscopy Journal of Sol-Gel Science and Technology. 28: 5-14. DOI: 10.1023/A:1025690300105  0.572
2001 Gorman BP, Orozco-Teran RA, Roepsch JA, Mueller DW, Reidy RF. Low Dielectric Constant Functionalized Silica Gels Mrs Proceedings. 714. DOI: 10.1557/Proc-714-L7.17.1  0.406
2001 Gorman BP, Orozco-Teran RA, Roepsch JA, Dong H, Reidy RF, Mueller DW. High strength, low dielectric constant fluorinated silica xerogel films Applied Physics Letters. 79: 4010-4012. DOI: 10.1063/1.1418267  0.405
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